公开(公告)号：US20230253219A1

公开(公告)日：2023-08-10

申请号：US18105993

申请日：2023-02-06

Applicant: Tokyo Electron Limited

Inventor： Yuichiro KUNUGIMOTO ,  Hideki KAJIWARA ,  Kazuhiro MATSUURA ,  Shinichi MIZUSHINO ,  Hokuto SHIGEMOTO ,  Akihiro TOYOZAWA ,  Yuji SAKAI

IPC: H01L21/67 ,  H01L21/687 ,  H01L21/68

CPC classification number: H01L21/6715 ,  H01L21/68764 ,  H01L21/681

Abstract: A substrate processing apparatus includes: a rotary holder configured to hold and rotate a substrate; a cup arranged so as to surround the substrate held by the rotary holder; a coating liquid nozzle configured to inject a coating liquid onto the substrate; a removal liquid nozzle configured to inject, onto the substrate, a removal liquid for removing a film from a peripheral portion of the substrate; a nozzle tracking camera attached to a nozzle arm that holds the coating liquid nozzle so as to track the coating liquid nozzle and configured to capture an image of the coating liquid nozzle; and a processing space camera configured to capture an image of a processing space above the rotary holder.