公开(公告)号：US20230253219A1

公开(公告)日：2023-08-10

申请号：US18105993

申请日：2023-02-06

Applicant: Tokyo Electron Limited

Inventor： Yuichiro KUNUGIMOTO ,  Hideki KAJIWARA ,  Kazuhiro MATSUURA ,  Shinichi MIZUSHINO ,  Hokuto SHIGEMOTO ,  Akihiro TOYOZAWA ,  Yuji SAKAI

IPC: H01L21/67 ,  H01L21/687 ,  H01L21/68

CPC classification number: H01L21/6715 ,  H01L21/68764 ,  H01L21/681

Abstract: A substrate processing apparatus includes: a rotary holder configured to hold and rotate a substrate; a cup arranged so as to surround the substrate held by the rotary holder; a coating liquid nozzle configured to inject a coating liquid onto the substrate; a removal liquid nozzle configured to inject, onto the substrate, a removal liquid for removing a film from a peripheral portion of the substrate; a nozzle tracking camera attached to a nozzle arm that holds the coating liquid nozzle so as to track the coating liquid nozzle and configured to capture an image of the coating liquid nozzle; and a processing space camera configured to capture an image of a processing space above the rotary holder.

公开(公告)号：US20190255561A1

公开(公告)日：2019-08-22

申请号：US16266310

申请日：2019-02-04

Applicant: Tokyo Electron Limited

Inventor： Satoshi SHIMMURA ,  Yuji SAKAI ,  Kousuke YOSHIHARA

IPC: B05C21/00 ,  B05C5/02 ,  B08B9/08

Abstract: A solution treatment apparatus includes: a substrate holding unit holds and rotates a substrate; a coating solution supply unit applies a coating solution to the substrate held by the substrate holding unit; a cup unit arranged outside the substrate holding unit in a manner to be able to surround the substrate held by the substrate holding unit; an exhaust path provided between the substrate holding unit and an inner peripheral surface of the cup unit; a coating solution collection unit provided above the exhaust path in a manner to cover the exhaust path and including an opening part communicating in a vertical direction; a solvent supply unit supplies a solvent for the coating solution to the coating solution collection unit; and a relay unit located above the coating solution collection unit and projecting from the inner peripheral surface of the cup unit toward the coating solution collection unit.

公开(公告)号：US20140261163A1

公开(公告)日：2014-09-18

申请号：US14211625

申请日：2014-03-14

Applicant: TOKYO ELECTRON LIMITED

Inventor： Naofumi KISHITA ,  Yuji SAKAI

IPC: H01L21/687

CPC classification number: H01L21/67051 ,  B05C11/08 ,  G03F7/162 ,  H01L21/68714 ,  H01L21/68735 ,  H01L21/68785

Abstract: In one embodiment, a cleaning member has an annular part and an opening positioned radially inside the annular part, and can be moved up and down between a first position and a second position relative to a cleaning nozzle. For cleaning of the back surface of the wafer, the cleaning member is placed at its first position that allows a cleaning liquid to reach the back surface of the substrate through the opening of the cleaning member. For cleaning of the cup structure, the cleaning member placed at its second position higher than the first position is being rotated, and a cleaning liquid discharged from the cleaning nozzle collides with an annular part of the cleaning member and is guided to the inner surface of a cup structure.

Abstract translation: 在一个实施例中，清洁构件具有环形部分和径向位于环形部分内部的开口，并且可相对于清洁喷嘴在第一位置和第二位置之间上下移动。 为了清洁晶片的背面，清洁构件被放置在其第一位置，其允许清洁液体通过打开清洁构件到达衬底的后表面。 为了清洁杯结构，设置在高于第一位置的第二位置的清洁构件正在旋转，并且从清洁喷嘴排出的清洁液体与清洁构件的环形部分相撞并且被引导到 杯结构。