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公开(公告)号:US20250112066A1
公开(公告)日:2025-04-03
申请号:US18899015
申请日:2024-09-27
Applicant: Tokyo Electron Limited
Inventor: Shinichi MIZUSHINO , Shunsuke INTO , Yuichiro KUNUGIMOTO , Akihiro TOYOZAWA , Daisuke ISHIMARU , Yuki MATSUTAKE , Shigeyuki IIDA , Takafumi HAYAMA
Abstract: A liquid processing apparatus includes multiple stages on each of which a substrate is to be placed; multiple nozzles shared by the multiple stages, and each for supplying a processing liquid to the substrate; a camera shared by the multiple nozzles, and for monitoring states of the multiple nozzles; and an imaging condition changing program module for causing circuitry to change an imaging condition of the camera according to a monitoring condition.
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公开(公告)号:US20230253219A1
公开(公告)日:2023-08-10
申请号:US18105993
申请日:2023-02-06
Applicant: Tokyo Electron Limited
Inventor: Yuichiro KUNUGIMOTO , Hideki KAJIWARA , Kazuhiro MATSUURA , Shinichi MIZUSHINO , Hokuto SHIGEMOTO , Akihiro TOYOZAWA , Yuji SAKAI
IPC: H01L21/67 , H01L21/687 , H01L21/68
CPC classification number: H01L21/6715 , H01L21/68764 , H01L21/681
Abstract: A substrate processing apparatus includes: a rotary holder configured to hold and rotate a substrate; a cup arranged so as to surround the substrate held by the rotary holder; a coating liquid nozzle configured to inject a coating liquid onto the substrate; a removal liquid nozzle configured to inject, onto the substrate, a removal liquid for removing a film from a peripheral portion of the substrate; a nozzle tracking camera attached to a nozzle arm that holds the coating liquid nozzle so as to track the coating liquid nozzle and configured to capture an image of the coating liquid nozzle; and a processing space camera configured to capture an image of a processing space above the rotary holder.
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