公开(公告)号：US20230418166A1

公开(公告)日：2023-12-28

申请号：US18213785

申请日：2023-06-23

Applicant: Tokyo Electron Limited

Inventor： Yuichiro KUNUGIMOTO ,  Shota UEYAMA ,  Akihiro TERAMOTO ,  Yuta NISHIYAMA ,  Shinichi HATAKEYAMA

IPC: G03F7/00 ,  B08B13/00 ,  G01F9/00 ,  G03F7/16 ,  G01G21/22 ,  B08B3/02

CPC classification number: G03F7/70491 ,  B08B13/00 ,  G01F9/003 ,  G03F7/16 ,  G01G21/22 ,  B08B3/02

Abstract: A substrate processing system includes: a measuring unit provided detachably with respect to a placement portion of a placement stage; a measuring jig for measuring a processing liquid; a liquid processing unit including a supplier which supplies the processing liquid to the measuring jig; a transfer mechanism for transferring the measuring jig between the measuring unit and the liquid processing unit; and a controller. The controller executes: a process of transferring the measuring jig in the measuring unit from the measuring unit to the liquid processing unit; a process of ejecting the processing liquid from the supplier to the measuring jig; a third process of transferring the measuring jig from the liquid processing unit to the measuring unit; and a fourth process of calculating an ejection amount of the processing liquid based on a measurement value in the measuring unit.

公开(公告)号：US20230253219A1

公开(公告)日：2023-08-10

申请号：US18105993

申请日：2023-02-06

Applicant: Tokyo Electron Limited

Inventor： Yuichiro KUNUGIMOTO ,  Hideki KAJIWARA ,  Kazuhiro MATSUURA ,  Shinichi MIZUSHINO ,  Hokuto SHIGEMOTO ,  Akihiro TOYOZAWA ,  Yuji SAKAI

IPC: H01L21/67 ,  H01L21/687 ,  H01L21/68

CPC classification number: H01L21/6715 ,  H01L21/68764 ,  H01L21/681

Abstract: A substrate processing apparatus includes: a rotary holder configured to hold and rotate a substrate; a cup arranged so as to surround the substrate held by the rotary holder; a coating liquid nozzle configured to inject a coating liquid onto the substrate; a removal liquid nozzle configured to inject, onto the substrate, a removal liquid for removing a film from a peripheral portion of the substrate; a nozzle tracking camera attached to a nozzle arm that holds the coating liquid nozzle so as to track the coating liquid nozzle and configured to capture an image of the coating liquid nozzle; and a processing space camera configured to capture an image of a processing space above the rotary holder.

公开(公告)号：US20230187233A1

公开(公告)日：2023-06-15

申请号：US18107935

申请日：2023-02-09

Applicant: TOKYO ELECTRON LIMITED

Inventor： Masataka GOSHO ,  Yuichi DOUKI ,  Satoshi BIWA ,  Satoshi OKAMURA ,  Katsuhiro OOKAWA ,  Yuichiro KUNUGIMOTO

IPC: H01L21/67 ,  B08B7/04 ,  H01L21/66 ,  H01L21/02 ,  B08B3/08 ,  H01L21/687

CPC classification number: H01L21/67051 ,  H01L21/67253 ,  B08B7/04 ,  H01L22/20 ,  H01L21/02057 ,  B08B3/08 ,  H01L21/68764 ,  H01L21/02101 ,  H01L21/67028 ,  H01L21/67288 ,  H01L22/12 ,  H01L21/67248

Abstract: There is provided a substrate processing apparatus comprising a liquid amount detecting part configured to detect a liquid amount of a liquid film formed on a substrate; and a coating state detecting part configured to detect a coating state of the substrate with the liquid film formed thereon.

公开(公告)号：US20220400232A1

公开(公告)日：2022-12-15

申请号：US17776800

申请日：2020-11-04

Applicant: Tokyo Electron Limited

Inventor： Yuichiro KUNUGIMOTO ,  Keishi HAMADA ,  Takafumi HAYAMA ,  Motoi OKADA ,  Shoki HAMAGUCHI

IPC: H04N7/18 ,  H04N5/232 ,  G06T7/00 ,  H04N5/91 ,  G03F7/16

Abstract: A monitoring apparatus for a substrate processing apparatus includes: an imaging unit that captures an image of a nozzle of the substrate processing apparatus and a surface of a substrate held by a substrate holder of the substrate processing apparatus; a monitoring data generation unit that generates monitoring video data based on imaging video data captured by the imaging unit during an execution of a substrate process performed by the substrate processing apparatus including a first process and a second process; and a monitoring condition changing unit that changes a generation condition of the monitoring video data during the execution of the substrate process so that at least a resolution or a number of frames of the monitoring video data during an execution of the second process is different from the monitoring video data during an execution of the first process.

公开(公告)号：US20240371661A1

公开(公告)日：2024-11-07

申请号：US18760302

申请日：2024-07-01

Applicant: TOKYO ELECTRON LIMITED

Inventor： Masataka GOSHO ,  Yuichi DOUKI ,  Satoshi BIWA ,  Satoshi OKAMURA ,  Katsuhiro OOKAWA ,  Yuichiro KUNUGIMOTO

IPC: H01L21/67 ,  B08B3/08 ,  B08B7/04 ,  H01L21/02 ,  H01L21/66 ,  H01L21/687

Abstract: There is provided a substrate processing apparatus comprising a liquid amount detecting part configured to detect a liquid amount of a liquid film formed on a substrate; and a coating state detecting part configured to detect a coating state of the substrate with the liquid film formed thereon.

公开(公告)号：US20220171294A1

公开(公告)日：2022-06-02

申请号：US17522050

申请日：2021-11-09

Applicant: Tokyo Electron Limited

Inventor： Yuichiro KUNUGIMOTO ,  Shota UEYAMA ,  Akihiro TERAMOTO ,  Yuta NISHIYAMA ,  Shinichi HATAKEYAMA

IPC: G03F7/20 ,  B08B13/00 ,  B08B3/02 ,  G03F7/16 ,  G01G21/22 ,  G01F9/00

Abstract: A substrate processing system includes: a measuring unit provided detachably with respect to a placement portion of a placement stage; a measuring jig for measuring a processing liquid; a liquid processing unit including a supplier which supplies the processing liquid to the measuring jig; a transfer mechanism for transferring the measuring jig between the measuring unit and the liquid processing unit; and a controller. The controller executes: a process of transferring the measuring jig in the measuring unit from the measuring unit to the liquid processing unit; a process of ejecting the processing liquid from the supplier to the measuring jig; a third process of transferring the measuring jig from the liquid processing unit to the measuring unit; and a fourth process of calculating an ejection amount of the processing liquid based on a measurement value in the measuring unit.

公开(公告)号：US20210080830A1

公开(公告)日：2021-03-18

申请号：US17016643

申请日：2020-09-10

Applicant: Tokyo Electron Limited

Inventor： Yuichiro KUNUGIMOTO ,  Takafumi HAYAMA ,  Hidehiro SUZUKI

IPC: G03F7/16

Abstract: There is provided a liquid processing apparatus comprising: a stage on which a substrate is placed; a nozzle configured to supply a processing liquid to the substrate placed on the stage and perform a processing on the substrate; a capturing part configured to capture an image of the nozzle so as to acquire image data; and a detector configured to detect a liquid level based on a plurality of the image data acquired by the capturing part at different timings within a period in which a supply of the processing liquid from the nozzle is not performed, wherein the liquid level is formed by the processing liquid or a liquid other than the processing liquid in a processing liquid flow path provided inside the nozzle.

公开(公告)号：US20190206702A1

公开(公告)日：2019-07-04

申请号：US16238236

申请日：2019-01-02

Applicant: TOKYO ELECTRON LIMITED

Inventor： Masataka GOSHO ,  Yuichi DOUKI ,  Satoshi BIWA ,  Satoshi OKAMURA ,  Katsuhiro OOKAWA ,  Yuichiro KUNUGIMOTO

IPC: H01L21/67 ,  H01L21/687 ,  H01L21/66 ,  H01L21/02 ,  B08B3/08 ,  B08B7/04

CPC classification number: H01L21/67051 ,  B08B3/08 ,  B08B7/04 ,  H01L21/02057 ,  H01L21/67248 ,  H01L21/67253 ,  H01L21/68764 ,  H01L22/20

Abstract: There is provided a substrate processing apparatus comprising a liquid amount detecting part configured to detect a liquid amount of a liquid film formed on a substrate; and a coating state detecting part configured to detect a coating state of the substrate with the liquid film formed thereon.

公开(公告)号：US20250112066A1

公开(公告)日：2025-04-03

申请号：US18899015

申请日：2024-09-27

Applicant: Tokyo Electron Limited

Inventor： Shinichi MIZUSHINO ,  Shunsuke INTO ,  Yuichiro KUNUGIMOTO ,  Akihiro TOYOZAWA ,  Daisuke ISHIMARU ,  Yuki MATSUTAKE ,  Shigeyuki IIDA ,  Takafumi HAYAMA

IPC: H01L21/67 ,  G02F1/29 ,  G03B13/34 ,  G03F7/16 ,  H01L21/66 ,  H04N23/56 ,  H04N23/60

Abstract: A liquid processing apparatus includes multiple stages on each of which a substrate is to be placed; multiple nozzles shared by the multiple stages, and each for supplying a processing liquid to the substrate; a camera shared by the multiple nozzles, and for monitoring states of the multiple nozzles; and an imaging condition changing program module for causing circuitry to change an imaging condition of the camera according to a monitoring condition.

公开(公告)号：US20240272554A1

公开(公告)日：2024-08-15

申请号：US18415499

申请日：2024-01-17

Applicant: Tokyo Electron Limited

Inventor： Yuichiro KUNUGIMOTO ,  Takafumi HAYAMA ,  Hidehiro SUZUKI

IPC: G03F7/16 ,  B05B15/50 ,  H01L21/67

CPC classification number: G03F7/162 ,  B05B15/50 ,  H01L21/6715 ,  H01L21/67253

Abstract: There is provided a liquid processing apparatus comprising: a stage on which a substrate is placed; a nozzle configured to supply a processing liquid to the substrate placed on the stage and perform a processing on the substrate; a capturing part configured to capture an image of the nozzle so as to acquire image data; and a detector configured to detect a liquid level based on a plurality of the image data acquired by the capturing part at different timings within a period in which a supply of the processing liquid from the nozzle is not performed, wherein the liquid level is formed by the processing liquid or a liquid other than the processing liquid in a processing liquid flow path provided inside the nozzle.