公开(公告)号：US20230096305A1

公开(公告)日：2023-03-30

申请号：US17908660

申请日：2021-02-17

Applicant: Tokyo Electron Limited

Inventor： Masato Hamada ,  Masami Akimoto ,  Masatoshi Shiraishi ,  Kazuyuki Goto ,  Satoshi Kaneko ,  Kazuki Motomatsu

IPC: C25D5/08 ,  C25D17/10 ,  C25D21/08

Abstract: A plating apparatus 1 includes a substrate holder 10, a first electrode, a second electrode and a voltage applying unit 30. The substrate holder 10 is configured to hold a substrate. The first electrode is electrically connected to the substrate. The second electrode is configured to scan with respect to a front surface of the substrate. The voltage applying unit 30 is configured to apply a voltage between the first electrode and the second electrode. A first discharge opening 23 configured to discharge a plating liquid L1 and a second discharge opening 24 configured to discharge a cleaning liquid L2 are formed in a bottom surface 22a of the second electrode.

公开(公告)号：US20240318343A1

公开(公告)日：2024-09-26

申请号：US18578448

申请日：2022-06-29

Applicant: Tokyo Electron Limited

Inventor： Kazuyuki Goto ,  Masatoshi Shiraishi ,  Masato Hamada

IPC: C25D7/12 ,  C25D5/54 ,  C25D17/00 ,  C25D21/12 ,  H01L21/288

CPC classification number: C25D7/123 ,  C25D5/54 ,  C25D17/001 ,  C25D21/12 ,  H01L21/288

Abstract: A controller outputs a control signal to control a plating liquid supply and a power applying device to perform a first electrolytic plating processing by applying power to a processing surface in a state that a plating liquid is in contact with a first facing range, which is a partial range of an electrode facing surface, and the controller also outputs, after the first electrolytic plating processing is performed, a control signal to control the plating liquid supply and the power applying device to perform a second electrolytic plating processing by applying the power to the processing surface in a state that the plating liquid is in contact with a second facing range of the electrode facing surface, the second facing range being wider than the first facing range.

公开(公告)号：US20230042744A1

公开(公告)日：2023-02-09

申请号：US17760120

申请日：2021-02-01

Applicant: Tokyo Electron Limited

Inventor： Masato Hamada ,  Masami Akimoto ,  Masatoshi Shiraishi ,  Satoshi Kaneko ,  Kazuki Motomatsu ,  Kazuyuki Goto

IPC: C25D17/06

Abstract: A plating method includes holding a substrate, supplying a plating liquid L1, supplying a conductive liquid L2 and applying a voltage. In the holding of the substrate, the substrate is held. In the supplying of the plating liquid L1, the plating liquid L1 is supplied onto the held substrate. In the supplying of the conductive liquid L2, the conductive liquid L2, which is different from the plating liquid L1 supplied on the substrate, is supplied onto the plating liquid L1. In the applying of the voltage, the voltage is applied between the substrate and the conductive liquid L2.