Substrate processing method
    1.
    发明授权

    公开(公告)号:US10903081B2

    公开(公告)日:2021-01-26

    申请号:US15857774

    申请日:2017-12-29

    摘要: A substrate processing method is provided for performing a plating processing on a substrate having, on a surface thereof, an impurity-doped polysilicon film containing a high concentration of impurities. The substrate processing method includes forming a catalyst layer by supplying, onto the substrate, an alkaline catalyst solution containing a complex of a palladium ion and a monocyclic 5- or 6-membered heterocyclic compound having one or two nitrogen atoms as a heteroatom; and forming a plating layer through electroless plating by supplying a plating liquid onto the substrate after the forming of the catalyst layer.

    PLATING APPARATUS
    3.
    发明申请

    公开(公告)号:US20230096305A1

    公开(公告)日:2023-03-30

    申请号:US17908660

    申请日:2021-02-17

    IPC分类号: C25D5/08 C25D17/10 C25D21/08

    摘要: A plating apparatus 1 includes a substrate holder 10, a first electrode, a second electrode and a voltage applying unit 30. The substrate holder 10 is configured to hold a substrate. The first electrode is electrically connected to the substrate. The second electrode is configured to scan with respect to a front surface of the substrate. The voltage applying unit 30 is configured to apply a voltage between the first electrode and the second electrode. A first discharge opening 23 configured to discharge a plating liquid L1 and a second discharge opening 24 configured to discharge a cleaning liquid L2 are formed in a bottom surface 22a of the second electrode.

    Electrolytic treatment apparatus and electrolytic treatment method

    公开(公告)号:US11427921B2

    公开(公告)日:2022-08-30

    申请号:US16481939

    申请日:2018-01-18

    摘要: An electrolytic treatment apparatus 1 (1A) configured to perform an electrolytic treatment on a target substrate includes a substrate holder 10 and an electrolytic processor 20. The substrate holder 10 includes an insulating holding body 11 configured to hold the target substrate and an indirect negative electrode 12 disposed within the holding body 11. A negative voltage is applied to the indirect negative electrode 12. The electrolytic processor 20 is disposed to face the substrate holder 10 and configured to apply a voltage to the target substrate and an electrolyte in contact with the target substrate.

    Electrolytic processing jig and electrolytic processing method

    公开(公告)号:US11542627B2

    公开(公告)日:2023-01-03

    申请号:US16330812

    申请日:2017-09-11

    摘要: An electrolytic processing jig configured to perform an electrolytic processing on a processing target substrate includes a base body having a flat plate shape; an electrode provided at the base body; three or more terminals provided at the base body, each having elasticity and configured to be brought into contact with a peripheral portion of the processing target substrate; and a detecting unit configured to electrically detect a contact of at least one of the terminals with the processing target substrate.