公开(公告)号：US20240082957A1

公开(公告)日：2024-03-14

申请号：US18261520

申请日：2022-01-05

Applicant: Tokyo Electron Limited

Inventor： Hayato TANOUE ,  Kento ARAKI ,  Yohei YAMASHITA ,  Gousuke SHIRAISHI

IPC: B23K26/361 ,  B23K26/08 ,  B23K26/18 ,  B23K26/402 ,  H01L21/268

CPC classification number: B23K26/361 ,  B23K26/0823 ,  B23K26/083 ,  B23K26/18 ,  B23K26/402 ,  H01L21/268 ,  B23K2103/56

Abstract: A substrate processing apparatus configured to process a combined substrate in which a first substrate and a second substrate are stacked on top of each other includes a substrate holder configured to hold the combined substrate; a laser radiating unit configured to radiate laser light to a laser absorbing film in a pulse shape; a moving mechanism configured to move the substrate holder and the laser radiating unit relative to each other; and a controller configured to control the laser radiating unit and the moving mechanism. The controller performs, based on a thickness of the laser absorbing film, a control of selecting a position of a separation surface between the first substrate and the second substrate from one of a position between the first substrate and the laser absorbing film or a position between the a separation facilitating film and the second substrate.

公开(公告)号：US20240312804A1

公开(公告)日：2024-09-19

申请号：US18261507

申请日：2022-01-04

Applicant: Tokyo Electron Limited

Inventor： Hayato TANOUE ,  Kento ARAKI ,  Yohei YAMASHITA ,  Gousuke SHIRAISHI

IPC: H01L21/67 ,  H01L21/268 ,  H01L21/762

CPC classification number: H01L21/67092 ,  H01L21/268 ,  H01L21/76254

Abstract: A substrate processing apparatus configured to process a combined substrate in which a first substrate and a second substrate are bonded to each other includes a substrate holder configured to hold the combined substrate; a laser radiating unit configured to radiate laser light in a pulse shape to a laser absorbing layer formed between the first substrate and the second substrate; a moving mechanism configured to move the substrate holder and the laser radiating unit relative to each other; and a controller configured to control the laser radiating unit and the moving mechanism. The controller sets an interval of the laser light radiated to the laser absorbing layer based on a thickness of the laser absorbing layer.

公开(公告)号：US20240071765A1

公开(公告)日：2024-02-29

申请号：US18261518

申请日：2022-01-05

Applicant: Tokyo Electron Limited

Inventor： Hayato TANOUE ,  Kento ARAKI ,  Yohei YAMASHITA ,  Gousuke SHIRAISHI

IPC: H01L21/268

CPC classification number: H01L21/268

Abstract: A substrate processing apparatus configured to process a combined substrate in which a first substrate, an interface layer including at least a laser absorbing film, and a second substrate are stacked on top of each other includes a substrate holder configured to hold the combined substrate; an interface laser radiating unit configured to radiate laser light to the laser absorbing film in a pulse shape; a moving mechanism configured to move the substrate holder and the interface laser radiating unit relative to each other; and a controller. The controller performs a control of acquiring information of the interface layer formed in the combined substrate, and a control of setting, based on the acquired information of the interface layer, a bonding interface having a weakest adhesive strength among bonding interfaces in the interface layer as a separation interface between the first substrate and the second substrate.