公开(公告)号：US20240021445A1

公开(公告)日：2024-01-18

申请号：US18215184

申请日：2023-06-28

Applicant: Tokyo Electron Limited

Inventor： Hiroki SAKURAI ,  Yenrui HSU ,  Shoki MIZUGUCHI ,  Nobuhiro OGATA ,  Shinichi UMENO ,  Kazuya GODA ,  Minsung KIM ,  Hiroyuki HIGASHI

IPC: H01L21/67 ,  H01L21/687 ,  H01L21/02

CPC classification number: H01L21/67051 ,  H01L21/67248 ,  H01L21/68764 ,  H01L21/02057

Abstract: A substrate processing apparatus according to the present disclosure includes a substrate holding unit, a fluid supplying unit, a processing-liquid supplying unit, a nozzle, a fluid amount adjusting unit, and a controller. The substrate holding unit holds a substrate to be rotatable. The fluid supplying unit supplies fluid including pressurized vapor or mist of deionized water. The processing-liquid supplying unit supplies processing liquid including at least a sulfuric acid. The nozzle is connected to the fluid supplying unit and the processing-liquid supplying unit to discharge mixed fluid of the fluid and the processing liquid toward the substrate. The fluid amount adjusting unit adjusts a flow volume of the fluid that is flowing through the fluid supplying unit. The controller controls the fluid amount adjusting unit to adjust a ratio of the fluid to the processing liquid.