METHOD FOR PLANARIZATION OF ORGANIC FILMS
    1.
    发明申请

    公开(公告)号:US20200152472A1

    公开(公告)日:2020-05-14

    申请号:US16674790

    申请日:2019-11-05

    Abstract: Techniques herein include methods for planarizing films including films used in the fabrication of semiconductor devices. Such fabrication can generate structures on a surface of a substrate, and these structures can have a spatially variable density across the surface. Planarization methods herein include depositing a first acid-labile film overtop the structures and the substrate, the first acid-labile film filling between the structures. A second acid-labile film is deposited overtop the first acid-labile film. An acid source film is deposited overtop the second acid-labile film, the acid source film including an acid generator configured to generate an acid in response to receiving radiation having a predetermined wavelength of light. A pattern of radiation is projected over the acid source film, the pattern of radiation having a spatially variable intensity at predetermined areas of the pattern of radiation.

    SURFACE RELIEF GRATING PERFORMANCE AND COST ENHANCEMENTS FOR AUGMENTED REALITY APPLICATIONS

    公开(公告)号:US20250102738A1

    公开(公告)日:2025-03-27

    申请号:US18475944

    申请日:2023-09-27

    Abstract: Aspects of the present disclosure provide a method for fabricating a grating coupler. For example, the method can include providing a substrate, forming a plurality of grating elements and a photosensitive material above the substrate, and projecting actinic radiation of varied intensities to expose different regions of the photosensitive material, causing the photosensitive material to generate a solubility-changing agent. The method can also include removing the solubility-changing agent. The actinic radiation of varied intensities can correspond to depths of grooves between the grating elements.

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