公开(公告)号：US20240242977A1

公开(公告)日：2024-07-18

申请号：US18412768

申请日：2024-01-15

Applicant: Tokyo Electron Limited

Inventor： Shota Umezaki ,  Takahiro Hayashida ,  Mikio Nakashima ,  Takafumi Yasunaga

IPC: H01L21/67

CPC classification number: H01L21/67023 ,  H01L21/67167 ,  H01L21/67196

Abstract: A substrate processing apparatus includes a unit block including multiple liquid film forming devices each configured to form a liquid film on a top surface of a substrate, and a drying device configured to replace the liquid film with a supercritical fluid to dry the substrate; and a transfer block provided between the multiple liquid film forming devices and the drying device. The transfer block includes a transfer device configured to transfer the substrate between the multiple liquid film forming devices and the drying device, and a length of a transfer path of the substrate is equal between each of the multiple liquid film forming devices and the drying device.