公开(公告)号：US20220220606A1

公开(公告)日：2022-07-14

申请号：US17638736

申请日：2020-07-21

Applicant: TOKYO ELECTRON LIMITED

Inventor： Tamaki TAKEYAMA ,  Hiroaki CHIHAYA ,  Motoi YAMAGATA ,  Manabu NAKAGAWASAI ,  Shinji ORIMOTO

IPC: C23C14/54 ,  C23C14/50 ,  C23C14/34 ,  H01L21/687

Abstract: There is provided a method for processing a substrate, comprising: preparing a substrate processing device including a rotatable stage on which a substrate is placed, a frozen heat transfer body fixed on a backside of the stage with a gap interposed therebetween and cooled to an extremely low temperature, a gas supply mechanism configured to supply to the gap a cooling gas for transferring a cold heat of the frozen heat transfer body to the stage, a rotation mechanism configured to rotate the stage, and a processing mechanism configured to process the substrate; preheating the stage such that a temperature of the stage reaches a steady cooling temperature within a fixed range; and after preheating, continuously processing a plurality of substrates by the processing mechanism while rotating the stage that has reached the steady cooling temperature in a state where a substrate having a specific temperature higher than or equal to room temperature is placed on the stage.

公开(公告)号：US20240052950A1

公开(公告)日：2024-02-15

申请号：US18233243

申请日：2023-08-11

Applicant: TOKYO ELECTRON LIMITED

Inventor： Satoshi YONEKURA ,  Tamaki TAKEYAMA ,  Tatsuhiko TANIMURA ,  Shigeyuki OKURA

IPC: F16K39/02 ,  G05D16/16

CPC classification number: F16K39/028 ,  G05D16/16

Abstract: An automatic pressure control device that controls a pressure in a processing container to which a source gas for forming a film on a substrate is supplied, includes: a vacuum exhauster configured to vacuum-exhaust a gas in the processing container; an exhaust path connecting the processing container and the vacuum exhauster; and a butterfly valve including an annular valve seat having an inner wall surface and a valve body configured as a plate-shaped body. The valve body is rotatably installed to the valve seat via a shaft and configured to change an opening area of the exhaust path by being arranged to be inclined and changing an inclination angle of the valve body. The butterfly valve is configured to control the pressure in the processing container by changing the inclination angle of the valve body based on a result of detecting the pressure in the processing container.

公开(公告)号：US20210285096A1

公开(公告)日：2021-09-16

申请号：US17184089

申请日：2021-02-24

Applicant: Tokyo Electron Limited

Inventor： Masato SHINADA ,  Tamaki TAKEYAMA ,  Kazunaga ONO ,  Naoyuki SUZUKI ,  Hiroaki CHIHAYA ,  Einstein Noel ABARRA

IPC: C23C14/54 ,  H01L43/12 ,  H01L21/66 ,  H01F41/32 ,  G01B11/06 ,  G01S17/08 ,  G01S7/481

Abstract: A film thickness measurement apparatus includes: a stage that places a substrate having a film formed thereon and measures a thickness of the film in-situ in a film forming apparatus; a film thickness meter including a light emitter that emits light toward the substrate disposed on the stage and a light receiving sensor that receives the light reflected by the substrate for measuring the thickness of the film in-situ; a moving mechanism including a multi-joint arm that moves an irradiation point of the light on the substrate; a distance meter that measures a distance between the light receiving sensor and the irradiation point on the substrate; and a distance adjustor that adjusts the distance between the light receiving sensor and the irradiation point on the substrate.