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公开(公告)号：US20140352730A1
公开(公告)日：2014-12-04
申请号：US14291494
申请日：2014-05-30
Applicant: Tokyo Electron Limited
Inventor： Yoshihiro Kai , Yoshinori Ikeda , Kazuyoshi Shinohara , Tetsuya Oda , Satoru Tanaka , Yuki Yoshida , Meitoku Aibara
CPC classification number: B05B15/555 , C03C23/0075 , H01L21/67051 , H01L21/6715
Abstract: A substrate processing apparatus according to the present disclosure includes first and second nozzles that eject a processing liquid to a substrate; a moving mechanism that moves the first and second nozzles; and a nozzle cleaning device that cleans at least the second nozzle. The nozzle cleaning device includes a cleaning bath and an overflow bath. The cleaning bath includes a liquid storage portion that stores a cleaning liquid for cleaning the second nozzle, and an overflow portion that discharges the cleaning liquid exceeding a predetermined level from the liquid storage portion. The overflow bath is disposed adjacent to the cleaning bath and receives the cleaning liquid discharged from the overflow portion and discharge the received cleaning liquid to the outside.
Abstract translation: 根据本公开的基板处理装置包括将处理液喷射到基板的第一和第二喷嘴; 移动机构，其移动所述第一和第二喷嘴; 以及清洁至少第二喷嘴的喷嘴清洁装置。 喷嘴清洁装置包括清洗槽和溢流槽。 清洗槽包括储存用于清洗第二喷嘴的清洗液的液体储存部分和从液体储存部分排出超过预定水平的清洗液体的溢流部分。 溢流槽设置在清洗槽附近，并接收从溢流部排出的清洗液，并将接收到的清洗液排出到外部。
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公开(公告)号：US09764345B2
公开(公告)日：2017-09-19
申请号：US14291494
申请日：2014-05-30
Applicant: Tokyo Electron Limited
Inventor： Yoshihiro Kai , Yoshinori Ikeda , Kazuyoshi Shinohara , Tetsuya Oda , Satoru Tanaka , Yuki Yoshida , Meitoku Aibara
CPC classification number: B05B15/555 , C03C23/0075 , H01L21/67051 , H01L21/6715
Abstract: A substrate processing apparatus according to the present disclosure includes first and second nozzles that eject a processing liquid to a substrate; a moving mechanism that moves the first and second nozzles; and a nozzle cleaning device that cleans at least the second nozzle. The nozzle cleaning device includes a cleaning bath and an overflow bath. The cleaning bath includes a liquid storage portion that stores a cleaning liquid for cleaning the second nozzle, and an overflow portion that discharges the cleaning liquid exceeding a predetermined level from the liquid storage portion. The overflow bath is disposed adjacent to the cleaning bath and receives the cleaning liquid discharged from the overflow portion and discharge the received cleaning liquid to the outside.
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