公开(公告)号：US11600502B2

公开(公告)日：2023-03-07

申请号：US16546653

申请日：2019-08-21

Applicant: Tokyo Electron Limited

Inventor： Hiroshi Yoshida ,  Yuki Ishii

IPC: H01L21/67 ,  H01L21/306 ,  H01L21/66

Abstract: A substrate liquid processing apparatus includes a processing tub configured to store a processing liquid therein; a processing liquid supply configured to supply the processing liquid into the processing tub; a processing liquid drain device configured to drain the processing liquid from the processing tub; and a controller configured to control the processing liquid supply and the processing liquid drain device. The controller calculates, in response to an instruction to change a concentration of a preset component of the processing liquid stored in the processing tub, a drain amount and a feed amount of the processing liquid from/into the processing tub based on information upon a current concentration of the preset component, information upon a concentration increment thereof per unit time and information upon the changed concentration thereof, and controls the processing liquid supply and the processing liquid drain device based on the calculation result.

公开(公告)号：US20200066553A1

公开(公告)日：2020-02-27

申请号：US16546653

申请日：2019-08-21

Applicant: Tokyo Electron Limited

Inventor： Hiroshi Yoshida ,  Yuki Ishii

IPC: H01L21/67 ,  H01L21/306 ,  H01L21/66

Abstract: A substrate liquid processing apparatus includes a processing tub configured to store a processing liquid therein; a processing liquid supply configured to supply the processing liquid into the processing tub; a processing liquid drain device configured to drain the processing liquid from the processing tub; and a controller configured to control the processing liquid supply and the processing liquid drain device. The controller calculates, in response to an instruction to change a concentration of a preset component of the processing liquid stored in the processing tub, a drain amount and a feed amount of the processing liquid from/into the processing tub based on information upon a current concentration of the preset component, information upon a concentration increment thereof per unit time and information upon the changed concentration thereof, and controls the processing liquid supply and the processing liquid drain device based on the calculation result.

公开(公告)号：US11594430B2

公开(公告)日：2023-02-28

申请号：US16124529

申请日：2018-09-07

Applicant: Tokyo Electron Limited

Inventor： Takafumi Tsuchiya ,  Yuki Ishii ,  Hiroyuki Masutomi ,  Seigo Fujitsu

IPC: H01L21/67

Abstract: A substrate liquid processing apparatus A1 includes a processing tub 41 accommodating a processing liquid 43 and a substrate 8; a gas nozzle 70 discharging a gas into a lower portion within the processing tub 41; a gas supply unit 90 supplying the gas; a gas supply line 93 connecting the gas nozzle 70 with the gas supply unit 90; a decompression unit 95 introducing the processing liquid 43 within the processing tub 41 into the gas supply line 93 by decompressing the gas supply line 93; and a control unit 7 performing a first control of controlling the gas supply unit 90 to stop supply of the gas and controlling the decompression unit 95 to introduce the processing liquid 43 into the gas supply line 93 in a part of an idle period during which the substrate 8 is not accommodated in the processing tub 41.

公开(公告)号：US20190080937A1

公开(公告)日：2019-03-14

申请号：US16124529

申请日：2018-09-07

Applicant: Tokyo Electron Limited

Inventor： Takafumi Tsuchiya ,  Yuki Ishii ,  Hiroyuki Masutomi ,  Seigo Fujitsu

IPC: H01L21/67

Abstract: A substrate liquid processing apparatus A1 includes a processing tub 41 accommodating a processing liquid 43 and a substrate 8; a gas nozzle 70 discharging a gas into a lower portion within the processing tub 41; a gas supply unit 90 supplying the gas; a gas supply line 93 connecting the gas nozzle 70 with the gas supply unit 90; a decompression unit 95 introducing the processing liquid 43 within the processing tub 41 into the gas supply line 93 by decompressing the gas supply line 93; and a control unit 7 performing a first control of controlling the gas supply unit 90 to stop supply of the gas and controlling the decompression unit 95 to introduce the processing liquid 43 into the gas supply line 93 in a part of an idle period during which the substrate 8 is not accommodated in the processing tub 41.