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    Method, apparatus and system for use in processing wafers
    5.
    发明授权
    Method, apparatus and system for use in processing wafers 有权
    用于处理晶片的方法，设备和系统

    公开(公告)号：US08052504B2

    公开(公告)日：2011-11-08

    申请号：US11829798

    申请日：2007-07-27

    申请人： William J. Kalenian ,  Tom Walsh ,  Dave Halley

    发明人： William J. Kalenian ,  Tom Walsh ,  Dave Halley

    IPC分类号： B24B49/00

    CPC分类号： B24B37/345 ,  B24B37/30 ,  H01L21/67161 ,  H01L21/67219 ,  H01L21/68785

    摘要： The present embodiment provides for methods and systems for use in processing objects such as wafers, including polishing and/or grinding wafers. Some embodiments provide systems that include a front-end module and a processing module. The front end module couples with a storage device that stores objects for processing. The front-end module can comprise a single robot, a transfer station, and a plurality of end effectors. The processing module is coupled with the front-end module such that the single robot delivers objects from the storage device to the processing module. The processing module comprising a rotating table, and a spindle with a carrier configured to retrieve the delivered object and process the object on the rotating table.

    摘要翻译： 本实施例提供了用于处理诸如晶片的物体的方法和系统，包括抛光和/或研磨晶片。 一些实施例提供了包括前端模块和处理模块的系统。 前端模块与存储用于处理的对象的存储设备耦合。 前端模块可以包括单个机器人，传送站和多个端部执行器。 处理模块与前端模块耦合，使得单个机器人将物体从存储装置传送到处理模块。 所述处理模块包括旋转台和具有承载件的主轴，所述托架被配置为检索所递送的物体并且处理所述旋转台上的物体。

    Multi-functional roofing tool
    6.
    发明授权
    Multi-functional roofing tool 失效
    多功能屋面工具

    公开(公告)号：US06266834B1

    公开(公告)日：2001-07-31

    申请号：US09488224

    申请日：2000-01-19

    申请人： Tom Walsh ,  John Gilchrist ,  Leonard Peterson

    发明人： Tom Walsh ,  John Gilchrist ,  Leonard Peterson

    IPC分类号： B25D104

    CPC分类号： B25F1/00 ,  B25C11/00 ,  B25D1/04

    摘要： A multipurpose hand-held tool having a handle and a head wherein the head has a plurality of implements. The head has a middle portion, which is connected the handle, a first head end and a second head end. The first head end has three cutters such that there is a cutting edge on the top side, the end, and the bottom side of the first head. The first head end also includes a plurality of gauge holes in the top side, and a nail slot on the bottom side. The second head end includes both a hammer head connected to the end and a hammer claw connected to the top side of the second head end. The multipurpose hand-held tool meets a need for roofers to have a multipurpose tool which helps to quickly, efficiently and accurately remove and replace roofing materials.

    摘要翻译： 一种具有把手和头部的多用途手持工具，其中头部具有多个工具。 头部具有连接手柄的中间部分，第一头部端部和第二头部端部。 第一头端具有三个切割器，使得在第一头部的顶侧，端部和底侧上存在切割边缘。 第一头端还包括在顶侧中的多个计量孔和底侧上的钉槽。 第二头端包括连接到端部的锤头和连接到第二头端的顶侧的锤爪。 多用途手持工具满足屋顶工具需要多用途工具，有助于快速，有效和准确地移除和更换屋顶材料。

    METHOD, APPARATUS AND SYSTEM FOR USE IN PROCESSING WAFERS
    7.
    发明申请
    METHOD, APPARATUS AND SYSTEM FOR USE IN PROCESSING WAFERS 有权
    用于处理波形的方法，装置和系统

    公开(公告)号：US20070269986A1

    公开(公告)日：2007-11-22

    申请号：US11829798

    申请日：2007-07-27

    申请人： William Kalenian ,  Tom Walsh ,  Dave Halley

    发明人： William Kalenian ,  Tom Walsh ,  Dave Halley

    IPC分类号： H01L21/302

    CPC分类号： B24B37/345 ,  B24B37/30 ,  H01L21/67161 ,  H01L21/67219 ,  H01L21/68785

    摘要： The present embodiment provides for methods and systems for use in processing objects such as wafers, including polishing and/or grinding wafers. Some embodiments provide systems that include a front-end module and a processing module. The front end module couples with a storage device that stores objects for processing. The front-end module can comprise a single robot, a transfer station, and a plurality of end effectors. The processing module is coupled with the front-end module such that the single robot delivers objects from the storage device to the processing module. The processing module comprising a rotating table, and a spindle with a carrier configured to retrieve the delivered object and process the object on the rotating table.

    摘要翻译： 本实施例提供了用于处理诸如晶片的物体的方法和系统，包括抛光和/或研磨晶片。 一些实施例提供了包括前端模块和处理模块的系统。 前端模块与存储用于处理的对象的存储设备耦合。 前端模块可以包括单个机器人，传送站和多个端部执行器。 处理模块与前端模块耦合，使得单个机器人将物体从存储装置传送到处理模块。 所述处理模块包括旋转台和具有承载件的主轴，所述托架被配置为检索所递送的物体并且处理所述旋转台上的物体。

    Method, apparatus and system for use in processing wafers
    8.
    发明授权
    Method, apparatus and system for use in processing wafers 有权
    用于处理晶片的方法，设备和系统

    公开(公告)号：US07249992B2

    公开(公告)日：2007-07-31

    申请号：US11173992

    申请日：2005-07-01

    申请人： William J. Kalenian ,  Tom Walsh

    发明人： William J. Kalenian ,  Tom Walsh

    IPC分类号： B24B51/00

    CPC分类号： B24B37/345 ,  B24B37/30 ,  H01L21/67161 ,  H01L21/67219 ,  H01L21/68785

    摘要： The present embodiment provides for methods and systems for use in processing objects such as wafers, including polishing and/or grinding wafers. Some embodiments provide systems that include a front-end module and a processing module. The front end module couples with a storage device that stores objects for processing. The front-end module can comprise a single robot, a transfer station, and a plurality of end effectors. The processing module is coupled with the front-end module such that the single robot delivers objects from the storage device to the processing module. The processing module comprising a rotating table, and a spindle with a carrier configured to retrieve the delivered object and process the object on the rotating table.

    摘要翻译： 本实施例提供了用于处理诸如晶片的物体的方法和系统，包括抛光和/或研磨晶片。 一些实施例提供了包括前端模块和处理模块的系统。 前端模块与存储用于处理的对象的存储设备耦合。 前端模块可以包括单个机器人，传送站和多个端部执行器。 处理模块与前端模块耦合，使得单个机器人将物体从存储装置传送到处理模块。 所述处理模块包括旋转台和具有承载件的主轴，所述托架被配置为检索所递送的物体并且处理所述旋转台上的物体。

    Method, apparatus and system for use in processing wafers
    9.
    发明申请
    Method, apparatus and system for use in processing wafers 有权

    公开(公告)号：US20060035563A1

    公开(公告)日：2006-02-16

    申请号：US11173992

    申请日：2005-07-01

    申请人： William Kalenian ,  Tom Walsh ,  Dave Halley

    发明人： William Kalenian ,  Tom Walsh ,  Dave Halley

    IPC分类号： B24B51/00

    CPC分类号： B24B37/345 ,  B24B37/30 ,  H01L21/67161 ,  H01L21/67219 ,  H01L21/68785

    摘要： The present embodiment provides for methods and systems for use in processing objects such as wafers, including polishing and/or grinding wafers. Some embodiments provide systems that include a front-end module and a processing module. The front end module couples with a storage device that stores objects for processing. The front-end module can comprise a single robot, a transfer station, and a plurality of end effectors. The processing module is coupled with the front-end module such that the single robot delivers objects from the storage device to the processing module. The processing module comprising a rotating table, and a spindle with a carrier configured to retrieve the delivered object and process the object on the rotating table.