公开(公告)号：US06242930B1

公开(公告)日：2001-06-05

申请号：US09196953

申请日：1998-11-20

申请人： Kouji Matsunaga ,  Hirobumi Inoue ,  Masao Tanehashi ,  Toru Taura ,  Masahiko Nikaidou ,  Yuuichi Yamagishi ,  Satoshi Hayakawa ,  Hironori Tsugane

发明人： Kouji Matsunaga ,  Hirobumi Inoue ,  Masao Tanehashi ,  Toru Taura ,  Masahiko Nikaidou ,  Yuuichi Yamagishi ,  Satoshi Hayakawa ,  Hironori Tsugane

IPC分类号： G01R3102

CPC分类号： G01R1/06772

摘要： In a high-frequency probe having a detachable end according to the present invention, parts relating to replacement of an end unit are three parts, that is, an end unit, a probe body, and a pressure block. The end unit comprises a coaxial cable, two slender plate-like ground plates. The coaxial cable is linear in the direction of the end of the high-frequency probe. The ground plates sandwich the coaxial cable. The probe body has an end unit support surface, a circuit board, an end unit arrangement surface and an end part guide. The end unit support surface forms a perpendicular surface used for fixing the end unit to a predetermined position in the end side of the central block in a central part of a surface of the body block. The circuit board connects the end unit to a coaxial connector. The end unit arrangement surface forms a plane in an end side of the body block. And further the guide groove positions and fixes the ground plate in the end part. It is capable to supply positioning pins and a positioning pin holes in mutual contact surfaces for positioning. The present invention makes it possible to adjust characteristic impedance of the probe end part by providing an elastically-shaped part for securing contact pressure and using a pipe or the ground plate in an exposed part of the coaxial inner conductor for performing gap adjustment.

摘要翻译： 在根据本发明的具有可拆卸端部的高频探头中，与端部单元的更换相关的部件是端部单元，探针主体和压力块三部分。 端部单元包括同轴电缆，两个细长的板状接地板。 同轴电缆在高频探头端部的方向是线性的。 接地板夹着同轴电缆。 探头主体具有端部单元支撑表面，电路板，端部单元布置表面和端部引导件。 端部单元支撑表面形成垂直表面，用于将端部单元固定在主体块的表面的中心部分中的中心块的端侧中的预定位置。 电路板将端部单元连接到同轴连接器。 端部单元布置表面在主体块的端侧形成平面。 此外，引导槽定位并将接地板固定在端部。 能够在相互接触的表面上提供定位销和定位销孔，用于定位。 本发明通过提供一种用于确保接触压力的弹性形状部分并且在同轴内部导体的暴露部分中使用管道或接地板来进行间隙调节，可以调节探针端部的特性阻抗。

公开(公告)号：US06310483B1

公开(公告)日：2001-10-30

申请号：US09183883

申请日：1998-10-30

申请人： Toru Taura ,  Hirobumi Inoue ,  Masao Tanehashi ,  Kouji Matsunaga ,  Yuuichi Yamagishi ,  Satoshi Hayakawa ,  Hironori Tsugane

发明人： Toru Taura ,  Hirobumi Inoue ,  Masao Tanehashi ,  Kouji Matsunaga ,  Yuuichi Yamagishi ,  Satoshi Hayakawa ,  Hironori Tsugane

IPC分类号： G01R3102

CPC分类号： G01R1/06772

摘要： A high-frequency probe according to the present invention comprises a probe chip that has an end part that is pressed to an electrode and is covered by a electrically conductive outer enclosure, and slides in a vertical direction by an inner surface of this electrically conductive outer enclosure inside this electrically conductive outer enclosure. A signal conductive pattern is fixed inside this probe chip and is connected with a inner conductor having elasticity. The inner conductor can be bent in the vertical direction at a central part of a hole having an opening, which is sufficiently long in the vertical direction, in the center space of a ground conductor, which is fixed to an end part of the main block, when the inner conductor is pressed due to contact of the end part. In addition, the high-frequency probe has a thin shape of a maximum thickness in a transverse direction which is perpendicular to the vertical direction that is a direction of the probe being pressed to a device electrode. The maximum thickness is substantially equal to a pitch between device electrodes, and can be formed in the construction of unifying a plurality of high-frequency probes.

摘要翻译： 根据本发明的高频探针包括探针芯片，其具有被压到电极并被导电外壳覆盖的端部，并且通过该导电外壳的内表面在垂直方向上滑动 封装在该导电外壳内。 信号导电图案固定在该探针芯片内，并与具有弹性的内部导体连接。 内导体可以在具有开口的中心部分的垂直方向上弯曲，该中心部分在接地导体的中心空间中在垂直方向上足够长，该接地导体的中心空间固定到主块的端部 当内导体由于端部的接触被按压时。 此外，高频探头具有垂直于被探针被压向器件电极的方向的垂直方向的横向上的最大厚度的薄形状。 最大厚度基本上等于器件电极之间的间距，并且可以在统一多个高频探针的结构中形成。

公开(公告)号：US06229321B1

公开(公告)日：2001-05-08

申请号：US09238268

申请日：1999-01-27

申请人： Kouji Matsunaga ,  Hirobumi Inoue ,  Masao Tanehashi ,  Masahiko Nikaidou ,  Toru Taura ,  Yuuichi Yamagishi ,  Satoshi Hayakawa

发明人： Kouji Matsunaga ,  Hirobumi Inoue ,  Masao Tanehashi ,  Masahiko Nikaidou ,  Toru Taura ,  Yuuichi Yamagishi ,  Satoshi Hayakawa

IPC分类号： G01R3102

CPC分类号： H01L22/20 ,  G01R1/06772 ,  G01R31/2851 ,  G01R31/318513 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/49171 ,  H01L2924/01019 ,  H01L2924/1423 ,  H01L2924/15153 ,  H01L2924/15165 ,  H01L2924/19041 ,  H01L2924/00014 ,  H01L2924/00

摘要： A process for manufacturing a high frequency multichip module includes a reception inspection step which includes steps of preparing a vertical-type probe, setting the high frequency bare chip on a device stage, and measuring high frequency characteristics of the high frequency bare chip using the vertical-type probe. The prepared vertical-type probe has a center conductor and ground conductors arranged at both sides of the tip portion of the center conductor in the vertical direction in which the probe is pressed to electrodes of the high frequency bare chip. The high frequency bare chip has a ground electrode disposed at the opposite side of the chip from the signal electrodes on the upper surface of a device stage. Then, only a good product is fed to the next step. After the reception inspection, the process goes to a component mounting step. Preferably, the process goes to the next step when the high frequency multichip modules passes at least on of a performance test and visual inspection after the component mounting step.

摘要翻译： 一种制造高频多芯片模块的方法，包括接收检查步骤，包括准备垂直型探针，在器件载物台上设置高频裸芯片，以及使用垂直方向测量高频裸芯片的高频特性 型探针。 所制备的垂直型探针具有中心导体和布置在中心导体的尖端部分的两侧的接地导体，该垂直方向上的探针被压到高频裸芯片的电极上。 高频裸芯片具有设置在与器件级的上表面上的信号电极的芯片相对侧的接地电极。 然后，只有一个好的产品被送入下一步。 在接收检查之后，处理进行到组件安装步骤。 优选地，当高频多芯片模块在部件安装步骤之后至少进行性能测试和目视检查时，该过程进行到下一步骤。

公开(公告)号：US06400168B2

公开(公告)日：2002-06-04

申请号：US09886033

申请日：2001-06-22

申请人： Kouji Matsunaga ,  Hirobumi Inoue ,  Masao Tanehashi ,  Toru Taura ,  Masahiko Nikaidou ,  Yuuichi Yamagishi ,  Satoshi Hayakawa

发明人： Kouji Matsunaga ,  Hirobumi Inoue ,  Masao Tanehashi ,  Toru Taura ,  Masahiko Nikaidou ,  Yuuichi Yamagishi ,  Satoshi Hayakawa

IPC分类号： G01R3102

CPC分类号： G01R1/06738 ,  G01R1/06772 ,  Y10T29/49123

摘要： In a tip portion structure basically having a substrate, a plate spring, and a ground block, the substrate is attached to a signal line on a back surface of the substrate and is contacted on the tip with the signal electrode of the DUT placed on a device stage. The plate spring is made of a resilient material, placed on the front side of the substrate, and positioned to apply a pressure to the substrate. The ground block is positioned between the signal line and the device stage functioned as a ground electrode of the DUT. Alternatively, the tip portion structure further may have a ground plate or a ground surface formed of a conductive thin plate covering entirely the front surface of the substrate, and shaped to surround the signal line in cooperation with the ground block. A plurality of the signal lines may be arranged in parallel on the same plane of the substrate. Another tip portion structure is based on a coaxial cable to be cut from the center at a plane perpendicular to the axial direction thereof along one or more oblique plane. A metal ring fitted over a periphery of the coaxial outer conductor may be used.

摘要翻译： 在基本上具有基板，板簧和接地块的尖端部分结构中，将基板附着到基板的背面上的信号线上，并将其与被放置在基板上的DUT的信号电极接触 设备阶段 板簧由弹性材料制成，放置在基片的正面，并定位成对基片施加压力。 接地块位于作为DUT接地电极的信号线和器件级之间。 或者，尖端部分结构还可以具有由完全覆盖基板的前表面的导电薄板形成的接地板或接地表面，并且成形为与接地块一起包围信号线。 多个信号线可以平行布置在基板的同一平面上。 另一个尖端部分结构是基于同轴电缆，沿着一个或多个倾斜平面在垂直于其轴向方向的平面处从中心切割。 可以使用安装在同轴外导体周边上的金属环。

公开(公告)号：US06281691B1

公开(公告)日：2001-08-28

申请号：US09328362

申请日：1999-06-09

申请人： Kouji Matsunaga ,  Hirobumi Inoue ,  Masao Tanehashi ,  Toru Taura ,  Masahiko Nikaidou ,  Yuuichi Yamagishi ,  Satoshi Hayakawa

发明人： Kouji Matsunaga ,  Hirobumi Inoue ,  Masao Tanehashi ,  Toru Taura ,  Masahiko Nikaidou ,  Yuuichi Yamagishi ,  Satoshi Hayakawa

IPC分类号： G01R3102

CPC分类号： G01R1/06738 ,  G01R1/06772 ,  Y10T29/49123

摘要： In a tip portion structure basically having a substrate, a plate spring, and a ground block, the substrate is attached to a signal line on a back surface of the substrate and is contacted on the tip with the signal electrode of the DUT placed on a device stage. The plate spring is made of a resilient material, placed on the front side of the substrate, and positioned to apply a pressure to the substrate. The ground block is positioned between the signal line and the device stage functioned as a ground electrode of the DUT. Alternatively, the tip portion structure further may have a ground plate or a ground surface formed of a conductive thin plate covering entirely the front surface of the substrate, and shaped to surround the signal line in cooperation with the ground block . A plurality of the signal lines may be arranged in parallel on the same plane of the substrate. Another tip portion structure is based on a coaxial cable to be cut from the center at a plane perpendicular to the axial direction thereof along one or more oblique plane. A metal ring fitted over a periphery of the coaxial outer conductor may be used.

摘要翻译： 在基本上具有基板，板簧和接地块的尖端部分结构中，将基板附着到基板的背面上的信号线上，并将其与被放置在基板上的DUT的信号电极接触 设备阶段 板簧由弹性材料制成，放置在基片的正面，并定位成对基片施加压力。 接地块位于作为DUT接地电极的信号线和器件级之间。 或者，尖端部分结构还可以具有由完全覆盖基板的前表面的导电薄板形成的接地板或接地表面，并且成形为与接地块一起包围信号线。 多个信号线可以平行布置在基板的同一平面上。 另一个尖端部分结构是基于同轴电缆，沿着一个或多个倾斜平面在垂直于其轴向方向的平面处从中心切割。 可以使用安装在同轴外导体周边上的金属环。