摘要:
In order to provide a resin sealed electronic device which is capable of securing high reliability by packaging with a transfer molding resin without using any under filler material, a resin sealed electronic device mounts a flip chip type monolithic IC on a hybrid circuit board through bumps and is packaged with a thermosetting resin through transfer molding. The transfer molding resin has a linear expansion coefficient of 3×10−6 to 17×10−6 and contains a filler having a particle size smaller than a height of the bump by more than 10 &mgr;m. The resin sealed electronic device is integrated in a unit including the hybrid circuit board mounting the flip chip type monolithic IC through transfer molding with the transfer molding resin, and the bump is restrained from moving by the transfer molding resin flowing around at transfer-molding.
摘要:
Object: The present invention is intended to supply an internal combustion engine-use igniter that is compact, excellent in mountability, and can contribute to the simplification and automation of assembly and to cost reduction. Implementing means: An insulated gate bipolar transistor (IGBT) is used as the ignition coil switching device for the internal combustion engine. The IGBT and a current limiting circuit intended to protect it from an overcurrent are formed on single semiconductor chip 3, and this semiconductor chip 3 and radio noise reduction capacitor 5 are contained in single packaging unit 4 having external input and output terminals 41 to 44. Packaging unit 4 is transfer-molded using a material such as epoxy resin.
摘要:
A less-deformable resin-sealed electronic apparatus of high reliability capable of increasing the robustness (long life-time) of soldered portions of a power semiconductor device for use in internal combustion engines while increasing the physical stiffness of an overall apparatus structure for achieving enhanced resistance to flexure or bending stresses is provided. A hybrid IC substrate 2 and power semiconductor device 3 are mounted on a metallic heat sink 1. The power semiconductor device 3 is coupled and contacted with the heat sink 1 by use of an Sn—Sb alloy-based solder material 4. The power semiconductor device 3 and hybrid IC substrate 2 plus heat sink 1 as well as input/output terminals 6-1 to 6-3 are embedded in a package 7 except for part of the input/output terminals, which package is made of epoxy at 70 to 90 weight percent (%) of an inorganic loading or filler material as machined by transfer mold techniques.
摘要:
A main IGBT conducts or blocks a primary current flowing through the ignition coil in response to an input ignition control signal to generate a high voltage on the secondary side of the ignition coil. The main IGBT and a current limiter circuit are integrated in a monolithic silicon substrate of an insulating gate bipolar power transistor. The main IGBT has a collector and agate connected through a depletion IGBT forming part of a constant current circuit, and a resistor. When a voltage generated across the resistor becomes equal to or higher than a zener voltage, a zener diode leads this current to an emitter of the main IGBT.
摘要:
An ignition apparatus for an internal combustion engine has an arrangement comprising a power part and a control part which are accumulated in a one-chip in an IGBT monolithic silicon substrate. The control circuit part has current limiting function of prevent the flowing of any current which is above a predetermined value as well as function of detecting malfunction heat generation by which a primary electric current is blocked compulsorily. The secondary voltage of an ignition coil is generated repeatedly below a plug discharge voltage so as not to generate spark discharge in the sparking plug when the electric current compulsory blocking is carried out, and energy charged in the ignition coil is emitted or discharged. With this arrangement, the one-chip ignition apparatus with high reliability can be achieved.
摘要:
A one-chip integration circuit including a power part and a control part integrated within an IGBT monolithic silicon substrate is disclosed. The control circuit part comprises a current limiting circuit for limiting a current so that it does not flow over a set-up value, a reference pulse generating circuit for detecting that an ignition control signal is inputted over a predetermined period of time, a digital timer made up by a digital counter, a latch circuit for dropping the gate voltage of the IGBT by latching due to the digital timer output signal and carrying out resetting when the ignition control signal is off, an input circuit having a potential comparison circuit in its input stage, in which the operation voltage for ignition control signal has a threshold value and a hysterisis, and an input protection circuit having a Zener diode and a resistor connected in parallel therewith for protecting the element from disturbance surges. A one-chip igniter with high operative stability and high reliability can be provided.
摘要:
According to the invention, a primary winding of an ignition coil is coupled with an insulated-gate bipolar transistor (IGBT). The IGBT is controlled by a current restriction circuit, which includes a control transistor for performing the on-off operation of the IGBT such that the IGBT is made conductive upon occurrence of an ignition control signal, and nonconductive, when a primary current of the ignition coil reaches a certain value depending on a reference voltage determined by a bias circuit. The bias circuit has a condenser, which is charged by a base current of the control transistor to change the base potential of the transistor slowly, when the transistor is made nonconductive.
摘要:
An ignition circuit is formed in one chip comprising an insulated gate bipolar transistor for controlling the flow of a primary current, a current limiting circuit for limiting the current flowing into the transistor, and a thermal shut-off circuit capable of forcibly shutting off the primary current in case of trouble. In the ignition circuit, a power supply GND terminal and an ignition control signal positive terminal are divided.
摘要:
Durability and lifetime of a resin sealed electronic device is improved by reducing thermal stresses acting on the power element and the parts mounting on the board. A power element of which the protective film on the power element is coated with a polyimide group resin at manufacturing the element is used, and a metallic heat sink of which the reverse side surface (portion of mounting on a board) is not plated is used. Further, a linear expansion coefficient of the molding resin is within a range of 3×10−6/°C. to 17×10−6/°C. The durability and the lifetime of the resin sealed electronic device is improved, because the thermal stresses are reduced by balancing linear expansion coefficients of the parts.
摘要:
A current on the primary side of an ignition coil is subjected to repeated conduction/cutoff control in accordance with an ignition control signal of an ECU to thereby generate a high voltage for ignition twice or more in one combustion stroke. In such a multiple ignition system for an internal combustion engine, the primary current of the ignition coil is detected by a resistor to thereby make the ECU recognize the fact that the primary current has reached a value not smaller than a set value through a signal line when the primary current becomes not smaller than the set value. The ECU determines cutoff timing in the second-time et seq. in the repeated conduction/cutoff control on the basis of the recognition.