公开(公告)号：US20060249833A1

公开(公告)日：2006-11-09

申请号：US11396603

申请日：2006-04-04

申请人： Toshihiko Ohara ,  Yoshiharu Unami ,  Yuji Inatani ,  Shoji Ito

发明人： Toshihiko Ohara ,  Yoshiharu Unami ,  Yuji Inatani ,  Shoji Ito

IPC分类号： H01L23/04 ,  H01L21/4763

CPC分类号： H05K3/4617 ,  H05K3/386 ,  H05K3/4046 ,  H05K3/4069 ,  H05K3/4602 ,  H05K3/4647 ,  H05K3/4652 ,  H05K2201/0355 ,  H05K2201/0394 ,  H05K2201/0969 ,  H05K2201/10234 ,  H05K2203/0733 ,  H05K2203/1461 ,  Y10T29/49117 ,  Y10T29/49155

摘要： A method for manufacturing a wiring board comprising an insulating member, comprising: a penetrating hole formation process of forming a penetrating hole in the insulating member; a placement process of inserting a conductive connecting particle into the penetrating hole; a connecting particle pressing process of disposing the conductive layers on both surfaces of the insulating member, pressing the conductive layers toward the connecting particle in the penetrating hole, and deforming the connecting particle in the pressing direction to obtain the connecting member; and a patterning process of patterning the conductive layers, wherein, in the connecting particle pressing process, the pressing is performed such that the cross-sectional area in the direction along the insulating member surface of at least a portion of the connecting member is greater than the contact area of the connecting member with the conductive layers.

摘要翻译： 一种用于制造包括绝缘构件的布线板的方法，包括：在所述绝缘构件中形成贯通孔的贯通孔形成工序; 将导电性连接粒子插入贯通孔的配置工序; 将导电层配置在绝缘部件的两面上的连接粒子挤压工序，将导电层朝向穿透孔内的连接粒子按压，使连接粒子沿按压方向变形，得到连接部件; 以及图案化导电层的图案化工艺，其中在连接粒子压制过程中，进行按压使得沿着连接构件的至少一部分的绝缘构件表面的方向上的横截面积大于 连接构件与导电层的接触面积。

公开(公告)号：US07926175B2

公开(公告)日：2011-04-19

申请号：US11862574

申请日：2007-09-27

申请人： Toshihiko Ohara ,  Yoshiharu Unami ,  Yuji Inatani ,  Shoji Ito

发明人： Toshihiko Ohara ,  Yoshiharu Unami ,  Yuji Inatani ,  Shoji Ito

IPC分类号： H05K3/10

CPC分类号： H05K3/4617 ,  H05K3/386 ,  H05K3/4046 ,  H05K3/4069 ,  H05K3/4602 ,  H05K3/4647 ,  H05K3/4652 ,  H05K2201/0355 ,  H05K2201/0394 ,  H05K2201/0969 ,  H05K2201/10234 ,  H05K2203/0733 ,  H05K2203/1461 ,  Y10T29/49117 ,  Y10T29/49155

摘要： A method for manufacturing a wiring board comprising an insulating member, comprising: a penetrating hole formation process of forming a penetrating hole in the insulating member; a placement process of inserting a conductive connecting particle into the penetrating hole; a connecting particle pressing process of disposing the conductive layers on both surfaces of the insulating member, pressing the conductive layers toward the connecting particle in the penetrating hole, and deforming the connecting particle in the pressing direction to obtain the connecting member; and a patterning process of patterning the conductive layers, wherein, in the connecting particle pressing process, the pressing is performed such that the cross-sectional area in the direction along the insulating member surface of at least a portion of the connecting member is greater than the contact area of the connecting member with the conductive layers.

摘要翻译： 一种用于制造包括绝缘构件的布线板的方法，包括：在所述绝缘构件中形成贯通孔的贯通孔形成工序; 将导电性连接粒子插入贯通孔的配置工序; 将导电层配置在绝缘部件的两面上的连接粒子挤压工序，将导电层朝向穿透孔内的连接粒子按压，使连接粒子沿按压方向变形，得到连接部件; 以及图案化导电层的图案化工艺，其中在连接粒子压制过程中，进行按压使得沿着连接构件的至少一部分的绝缘构件表面的方向上的横截面积大于 连接构件与导电层的接触面积。

公开(公告)号：US20080016685A1

公开(公告)日：2008-01-24

申请号：US11862574

申请日：2007-09-27

申请人： Toshihiko OHARA ,  Yoshiharu Unami ,  Yuji Inatani ,  Shoji Ito

发明人： Toshihiko OHARA ,  Yoshiharu Unami ,  Yuji Inatani ,  Shoji Ito

IPC分类号： H01R43/00

CPC分类号： H05K3/4617 ,  H05K3/386 ,  H05K3/4046 ,  H05K3/4069 ,  H05K3/4602 ,  H05K3/4647 ,  H05K3/4652 ,  H05K2201/0355 ,  H05K2201/0394 ,  H05K2201/0969 ,  H05K2201/10234 ,  H05K2203/0733 ,  H05K2203/1461 ,  Y10T29/49117 ,  Y10T29/49155

摘要： A method for manufacturing a wiring board comprising an insulating member, comprising: a penetrating hole formation process of forming a penetrating hole in the insulating member; a placement process of inserting a conductive connecting particle into the penetrating hole; a connecting particle pressing process of disposing the conductive layers on both surfaces of the insulating member, pressing the conductive layers toward the connecting particle in the penetrating hole, and deforming the connecting particle in the pressing direction to obtain the connecting member; and a patterning process of patterning the conductive layers, wherein, in the connecting particle pressing process, the pressing is performed such that the cross-sectional area in the direction along the insulating member surface of at least a portion of the connecting member is greater than the contact area of the connecting member with the conductive layers.

摘要翻译： 一种用于制造包括绝缘构件的布线板的方法，包括：在所述绝缘构件中形成贯通孔的贯通孔形成工序; 将导电性连接粒子插入贯通孔的配置工序; 将导电层配置在绝缘部件的两面上的连接粒子挤压工序，将导电层朝向穿透孔内的连接粒子按压，使连接粒子沿按压方向变形，得到连接部件; 以及图案化导电层的图案化工艺，其中在连接粒子压制过程中，进行按压使得沿着连接构件的至少一部分的绝缘构件表面的方向上的横截面积大于 连接构件与导电层的接触面积。