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公开(公告)号:US4619730A
公开(公告)日:1986-10-28
申请号:US339065
申请日:1982-01-13
申请人: Toshihiko Suzuki , Nobuyuki Isawa , Yasunori Ohkubo , Kinji Hoshi
发明人: Toshihiko Suzuki , Nobuyuki Isawa , Yasunori Ohkubo , Kinji Hoshi
CPC分类号: C30B29/06 , C30B15/00 , Y10S117/90 , Y10S117/917 , Y10T117/1032 , Y10T117/1044 , Y10T117/1068 , Y10T117/1092
摘要: A process for solidification of fluid such as silicon melt and so on is disclosed. In this case, liquid material having electrical conductivity is in a container and a unidirectional stationary magnetic field is applied to the liquid material. Thus, the dissolution of at least one elemental material of the container into the liquid material is conducted by diffusion thereof.
摘要翻译: 公开了一种用于固化诸如硅熔体等的流体的方法。 在这种情况下,具有导电性的液体材料在容器中,并且单向固定磁场被施加到液体材料。 因此,将容器的至少一种元素材料溶解到液体材料中通过其扩散进行。
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公开(公告)号:US4622211A
公开(公告)日:1986-11-11
申请号:US562015
申请日:1983-12-16
申请人: Toshihiko Suzuki , Nobuyuki Isawa , Yasunori Ohkubo , Kinji Hoshi
发明人: Toshihiko Suzuki , Nobuyuki Isawa , Yasunori Ohkubo , Kinji Hoshi
CPC分类号: C30B29/06 , C30B15/00 , Y10S117/90 , Y10S117/917 , Y10T117/1032 , Y10T117/1044 , Y10T117/1068 , Y10T117/1092
摘要: An apparatus for solidification comprising a container for a liquid material which is to be solidified and an electric heater around the container and energized to melt the liquid material, a pair of magnets beside the container producing a stationary magnetic field, a source of electricity to supply substantially DC current to said heater and means for pulling a solid crystal from said liquid material.
摘要翻译: 一种用于凝固的装置,包括待固化的液体材料的容器和围绕容器的电加热器并被激发以熔化液体材料,在容器旁边的一对磁体产生静止的磁场,供电源 到所述加热器的大体上直流电流以及用于从所述液体材料中拉出固体晶体的装置。
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公开(公告)号:US4127969A
公开(公告)日:1978-12-05
申请号:US639806
申请日:1975-12-11
申请人: Kinji Hoshi , Kazuhiro Sugita
发明人: Kinji Hoshi , Kazuhiro Sugita
CPC分类号: H01L21/02027 , B28D5/0058 , B28D5/0088 , B28D5/022 , B28D5/028 , B28D5/042 , H01L21/302 , H01L21/67092 , H01L29/00 , H01L29/0657
摘要: Semiconductor wafers with apertures, that may include crystal orientation surfaces, are made by boring semiconductor ingots and slicing the bored ingots perpendicular to the bore or at an angle thereto. Novel means are provided for handling the wafers without scratching the major surfaces thereof, for supporting the slices to clean them, and for supporting the slices to coat the major surfaces.
摘要翻译: 可以包括晶体取向表面的具有孔的半导体晶片通过对半导体锭进行钻孔并且将钻孔垂直于孔或与其成一定角度切割。 提供了新颖的装置来处理晶片而不刮擦其主要表面,用于支撑切片以将其清洁,并且用于支撑切片以涂覆主表面。
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