公开(公告)号：US20060049995A1

公开(公告)日：2006-03-09

申请号：US11215131

申请日：2005-08-31

申请人： Toshikazu Imaoka ,  Sawai Tetsuro ,  Atsushi Sakai ,  Ryosuke Usui ,  Yasunori Inoue

发明人： Toshikazu Imaoka ,  Sawai Tetsuro ,  Atsushi Sakai ,  Ryosuke Usui ,  Yasunori Inoue

IPC分类号： H01Q1/24

CPC分类号： H01Q1/2283 ,  H01L24/24 ,  H01L24/45 ,  H01L2223/6677 ,  H01L2224/04105 ,  H01L2224/05001 ,  H01L2224/0554 ,  H01L2224/05568 ,  H01L2224/05573 ,  H01L2224/12105 ,  H01L2224/24137 ,  H01L2224/24145 ,  H01L2224/24195 ,  H01L2224/32145 ,  H01L2224/32225 ,  H01L2224/45144 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/48464 ,  H01L2224/73267 ,  H01L2225/06568 ,  H01L2924/00014 ,  H01L2924/01079 ,  H01L2924/14 ,  H01L2924/15311 ,  H01L2924/181 ,  H01L2924/18162 ,  H01L2924/19105 ,  H01L2924/30107 ,  H01L2924/3011 ,  H01L2924/3025 ,  H01Q1/22 ,  H05K1/0298 ,  H05K1/16 ,  H01L2924/00 ,  H01L2224/05599 ,  H01L2224/05099 ,  H01L2924/00012 ,  H01L2224/0555 ,  H01L2224/0556

摘要： An integrated antenna type circuit apparatus which provides excellent circuit characteristics while suppressing an increase in packaging area. The integrated antenna type circuit apparatus includes an insulating base, a semiconductor circuit device, chip parts, a molding resin, an antenna conductor, a ground conductor, and external lead electrodes. The plurality of chip parts are mounted on the insulating base, and are soldered to electrodes of wiring conductors on the top of the insulating base for electric and physical connection. The insulating base has a multilayer structure, being formed by laminating a plurality of insulator layers. The antenna conductor is formed on the bottom of the insulating base. A wiring conductor adjacent to the antenna conductor is provided with the ground conductor so that it overlaps with the antenna conductor.