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公开(公告)号：US20120212557A1
公开(公告)日：2012-08-23
申请号：US13401891
申请日：2012-02-22
CPC分类号： B41J2/335 , B41J2/33535 , B41J2/3354 , B41J2/33545 , B41J2/3357 , B41J2/33585
摘要： Adopted is a thermal head, including: a support substrate including a concave portion formed in a front surface thereof; an upper substrate, which is bonded in a stacked state to the front surface of the support substrate and includes a convex portion formed at a position corresponding to the concave portion; a heating resistor provided on a front surface of the upper substrate at a position straddling the convex portion; and a pair of electrodes provided on both sides of the heating resistor, in which at least one of the pair of electrodes include: a thin portion, which is connected to the heating resistor at a distal end surface of the convex portion in a region corresponding to the concave portion; and a thick portion, which is connected to the heating resistor and is formed thicker than the thin portion.
摘要翻译： 采用热敏头，包括：支撑基板，其包括形成在其前表面中的凹部; 上层基板，其以叠层状态接合到所述支撑基板的前表面，并且包括形成在与所述凹部对应的位置的凸部; 加热电阻器，其设置在跨越所述凸部的位置的所述上基板的前表面上; 以及一对电极，其设置在所述加热电阻器的两侧，所述一对电极中的至少一个包括：薄部，其在对应于所述凸起部的区域的所述凸部的远端表面处连接到所述加热电阻器 到凹部; 以及连接到加热电阻器并且形成为比薄部分厚的厚部分。
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2.发明授权Thermal head, method of manufacturing thermal head, and printer equipped with thermal head 有权热头，制造热头的方法，以及装有热头的打印机公开(公告)号：US08624946B2
公开(公告)日：2014-01-07
申请号：US13401891
申请日：2012-02-22
IPC分类号： B41J2/335
CPC分类号： B41J2/335 , B41J2/33535 , B41J2/3354 , B41J2/33545 , B41J2/3357 , B41J2/33585
摘要： A thermal head has a support substrate including a concave portion formed in a front surface thereof. An upper substrate is bonded in a stacked state to the front surface of the support substrate and includes a convex portion formed within a region corresponding to the concave portion. A heating resistor is provided on a front surface of the upper substrate at a position straddling the convex portion. A pair of electrodes is provided on both sides of the heating resistor. At least one of the pair of electrodes has a thin portion and a thick portion. The thin portion is connected to the heating resistor at one of a side surface and a top surface of the convex portion in the region corresponding to the concave portion. The thick portion is connected to the heating resistor and is formed thicker than the thin portion.
摘要翻译： 热敏头具有包括形成在其前表面中的凹部的支撑基板。 上层基板以叠层状态接合到支撑基板的前表面，并且包括形成在与凹部对应的区域内的凸部。 在上部基板的前表面上设置有加热电阻器，该位置跨越凸部。 在加热电阻器的两侧设置一对电极。 该对电极中的至少一个具有薄的部分和较厚的部分。 在对应于凹部的区域中，薄部分与凸起部分的侧表面和顶表面中的一个处连接到加热电阻器。 厚部连接到加热电阻器，并且形成为比薄部分厚。
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3.发明授权公开(公告)号：US08477166B2
公开(公告)日：2013-07-02
申请号：US13136005
申请日：2011-07-20
IPC分类号： B41J2/335
CPC分类号： B41J2/33585 , B41J2/3351 , B41J2/3354 , Y10T29/49002
摘要： A thermal head comprises a first substrate having a concave portion, a second substrate mounted on the first substrate and covering the concave portion to form with the first substrate a cavity portion, a heating resistor provided on a surface of the second substrate, and a pair of electrodes connected to the heating resistor for supplying power to the heating resistor. At least one of the pair of electrodes has a low thermal conductivity portion in a region opposed to the cavity portion. The low thermal conductivity portion is made of a material having a thermal conductivity lower than a thermal conductivity in other regions of the pair of electrodes and having an electrical resistance lower than an electrical resistance of the heating resistor.
摘要翻译： 热敏头包括具有凹部的第一基板，安装在第一基板上并覆盖凹部以与第一基板形成空腔部分的第二基板，设置在第二基板的表面上的加热电阻器和一对 的电极连接到加热电阻器，用于向加热电阻器供电。 所述一对电极中的至少一个在与空腔部分相对的区域中具有低热传导率部分。 低导热部分由在一对电极的其它区域中的导热率低于导热率的材料制成，并且具有低于加热电阻器的电阻的电阻。
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公开(公告)号：US08372296B2
公开(公告)日：2013-02-12
申请号：US12804954
申请日：2010-08-03
IPC分类号： H01L21/302 , B41J2/345
CPC分类号： B41J2/3359 , Y10T29/49083
摘要： Provided is a manufacturing method for a thermal head, including: bonding a flat upper substrate in a stacked state onto a flat supporting substrate including a heat-insulating concave portion open to one surface thereof so that the heat-insulating concave portion is closed (bonding step (SA2)); thinning the upper substrate bonded onto the supporting substrate by the bonding step (SA2) (plate thinning step (SA3)); measuring a thickness of the upper substrate thinned by the plate thinning step (SA3) (measurement step (SA4)); deciding a target resistance value of heating resistors based on the thickness of the upper substrate, which is measured by the measurement step (SA4) (decision step (SA5)); and forming, at positions of a surface of the upper substrate thinned by the plate thinning step (SA3), the heating resistors having the target resistance value determined by the decision step (SA5), the positions being opposed to the heat-insulating concave portion (resistor forming step (SA6)). Thus, a high-efficiency thermal head capable of accurately outputting a target heating amount obtained by estimating an amount of heat wasted without being used is easily manufactured without using a special apparatus.
摘要翻译： 本发明提供一种热敏头的制造方法，其特征在于，包括：将层叠状态的平坦的上部基板接合在具有向其一个表面开口的绝热凹部的平坦的支撑基板上，使得所述绝热凹部闭合（接合 步骤（SA2））; 通过接合步骤（SA2）（板薄化步骤（SA3））使结合到支撑衬底上的上衬底变薄; 测量通过板薄化步骤（SA3）变薄的上基板的厚度（测量步骤（SA4））; 基于通过测量步骤（SA4）测量的上基板的厚度（判定步骤（SA5）），确定加热电阻器的目标电阻值; 在由所述薄板稀化工序（SA3）变薄的所述上基板的表面的位置处，形成由所述判定工序（SA5）决定的所述目标电阻值的所述加热电阻体，与所述绝热凹部 （电阻形成工序（SA6））。 因此，在不使用特殊装置的情况下，容易制造能够精确地输出通过估计不使用而浪费的热量而获得的目标加热量的高效热头。
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公开(公告)号：US08289354B2
公开(公告)日：2012-10-16
申请号：US12807854
申请日：2010-09-15
IPC分类号： B41J2/335
CPC分类号： B41J2/3355 , B41J2/33585
摘要： Provided are a thermal head that has a cavity portion at a position corresponding to heating resistors and is capable of improving thermal efficiency while ensuring strength of the cavity portion, and a printer including the thermal head. The thermal head (1) includes: a supporting substrate (3) including a concave portion (2) in a surface thereof; an upper substrate (5) bonded in a stacked state to the surface of the supporting substrate (3); and a heating resistor (7) provided at a position, which corresponds to the concave portion (2), of a surface of the upper substrate (5), in which a centerline average roughness of at least a region of a back surface of the upper substrate (5) is set to be less than 5 nm, the region being opposed to the concave portion (2).
摘要翻译： 提供一种热敏头，其在对应于加热电阻器的位置处具有空腔部分，并且能够在确保空腔部分的强度的同时提高热效率，以及包括热敏头的打印机。 热敏头（1）包括：在其表面包括凹部（2）的支撑基板（3） 将上层基板（5）以堆叠状态接合到所述支撑基板（3）的表面; 以及设置在上基板（5）的表面的与凹部（2）对应的位置处的加热电阻器（7），其中，所述上基板（5）的背面的至少一个区域的中心线平均粗糙度 上基板（5）被设定为小于5nm，该区域与凹部（2）相对。
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6.发明授权公开(公告)号：US08189022B2
公开(公告)日：2012-05-29
申请号：US12613873
申请日：2009-11-06
IPC分类号： B41J2/335
CPC分类号： B41J2/33525 , B41J2/33585 , B41J2/3359 , Y10T156/1002
摘要： To improve print quality, a plurality of heating resistors (14) are arranged with spaces therebetween on a heat storage layer (13) laminated on a surface of a supporting substrate (11) via an adhesive layer (12) made of an elastic material. A cavity portion (19) is formed at a region between the supporting substrate (11) and the heat storage layer (13), the region being opposed to a heat generating portion of each of the plurality of heating resistors (14). The elastic material constituting the adhesive layer (12) is arranged so that the elastic material is in a bonded state with respect to at least a part of a surface of the heat storage layer (13) opposed to the cavity portion (19).
摘要翻译： 为了提高打印质量，通过经由弹性材料制成的粘合剂层（12）在叠层在支撑基板（11）的表面上的储热层（13）上布置有多个加热电阻器（14）。 在支撑基板（11）和蓄热层（13）之间的区域形成有空腔部分（19），该区域与多个加热电阻器（14）中的每一个的发热部分相对。 构成粘合剂层（12）的弹性材料被布置成使得弹性材料相对于与空腔部分（19）相对的储热层（13）的表面的至少一部分处于接合状态。
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公开(公告)号：US20120073123A1
公开(公告)日：2012-03-29
申请号：US13200251
申请日：2011-09-21
IPC分类号： H01C17/00
CPC分类号： H01C17/065 , B41J2/335 , B41J2/33585 , B41J2/3359 , Y10T29/49082
摘要： A method of manufacturing a thermal head, comprising: forming a concave portion opened in one surface of a support substrate and an upper substrate to be disposed on the support substrate in a stacked state, the support substrate and the upper substrate each being of a plate shape; a step of measuring a width dimension of the concave portion formed in the concave portion forming step; bonding the support substrate and the upper substrate to each other in the stacked state so as to close an opening of the concave portion; thinning the upper substrate bonded onto the support substrate in the bonding, to a thickness set based on the width dimension of the concave portion measured in the measuring; and forming a heating resistor on a surface of the thinned upper substrate in a region opposed to the concave portion.
摘要翻译： 一种热敏头的制造方法，其特征在于，包括：在层叠状态下形成在支撑基板的一个面上开口的凹部和设置在所述支撑基板上的上基板，所述支撑基板和所述上基板各自为板 形状; 测量形成在凹部形成步骤中的凹部的宽度尺寸的步骤; 将支撑基板和上基板以堆叠状态彼此接合，以封闭凹部的开口; 在接合时将粘合到支撑基板上的上基板细化为基于在测量中测量的凹部的宽度尺寸设定的厚度; 以及在与所述凹部相对的区域中在所述变薄的上基板的表面上形成发热电阻体。
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公开(公告)号：US20120073122A1
公开(公告)日：2012-03-29
申请号：US13200250
申请日：2011-09-21
IPC分类号： H01C17/00
CPC分类号： H01C17/065 , B41J2/335 , B41J2/33585 , B41J2/3359
摘要： A method of manufacturing a thermal head, comprising: forming a concave portion opened in one surface of at least one of a support substrate and an upper substrate to be disposed on the support substrate in a stacked state, the support substrate and the upper substrate each being of a plate shape; measuring a width dimension of the concave portion; bonding the support substrate and the upper substrate to each other in the stacked state so as to close an opening of the concave portion; forming a heating resistor on a surface of the upper substrate bonded onto the support substrate, in a region opposed to the concave portion; and forming a protective film for covering and protecting the heating resistor on the upper substrate, at a thickness which is set based on the width dimension of the concave portion and a thickness dimension of the upper substrate.
摘要翻译： 一种热敏头的制造方法，其特征在于，包括：在层叠状态下形成在支撑基板上设置在支撑基板和上基板中的至少一个的一个面的开口部的凹部，所述支撑基板和所述上基板各自 是板状; 测量凹部的宽度尺寸; 将支撑基板和上基板以堆叠状态彼此接合，以封闭凹部的开口; 在与所述凹部对置的区域中，在所述上基板的与所述支撑基板接合的表面上形成发热电阻体; 并且形成用于覆盖和保护上基板上的加热电阻器的保护膜，其厚度基于凹部的宽度尺寸和上基板的厚度尺寸设定。
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公开(公告)号：US08122591B2
公开(公告)日：2012-02-28
申请号：US12386843
申请日：2009-04-23
IPC分类号： H05B3/00
CPC分类号： B41J2/33535 , B41J2/33585 , B41J2/3359 , Y10T29/49082 , Y10T29/49083 , Y10T29/49346 , Y10T29/49401
摘要： In order to provide a manufacturing method for a heating resistor element component, with which an insulating film (undercoat) can be easily handled, damage caused in the insulating film can be reduced, and a high yield can be ensured, the manufacturing method comprises the steps of: processing, on a surface of a supporting substrate (2), a plurality of concave portions (8) each forming a hollow portion (7) at intervals; processing, on the surface of the supporting substrate (2), a concave part (10) for each region straddling the plurality of concave portions (8) in an arrangement direction of the concave portions (8); placing an insulating film (3) made of sheet glass in each concave part (10); and bonding the insulating film (3) to the supporting substrate (2).
摘要翻译： 为了提供可以容易地处理绝缘膜（底涂层）的加热电阻元件部件的制造方法，可以降低绝缘膜产生的损伤，并且可以确保高产率，该制造方法包括 步骤：在支撑基板（2）的表面上，间隔地形成有形成中空部（7）的多个凹部（8） 在所述支撑基板（2）的表面上，在所述凹部（8）的排列方向上对与所述多个凹部（8）交叉的各区域的凹部（10）进行加工。 在每个凹部（10）中放置由玻璃板制成的绝缘膜（3）; 并将绝缘膜（3）接合到支撑基板（2）上。
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公开(公告)号：US20110216147A1
公开(公告)日：2011-09-08
申请号：US12932125
申请日：2011-02-17
CPC分类号： B41J2/33585 , Y10T156/10
摘要： Provided is a thermal head that is high in durability and reliability with increased printing efficiency as well as increased manufacturing yields. The thermal head (1) includes: a support substrate (12) including a concave portion (23) having an opening portion (23a) formed in a surface of the support substrate (12); an upper substrate (14) having an external dimension which is smaller than an external dimension of the support substrate (12) and is slightly larger than an external dimension of the opening portion (23a), for closing the opening portion (23a) when bonded to the surface of the support substrate (12) in a stacked state; and a heating resistor (15) formed on a surface of the upper substrate (14) in a position opposed to the concave portion (23) of the support substrate (12).
摘要翻译： 提供了一种具有高耐久性和可靠性的热敏头，其具有提高的打印效率以及增加的制造成品率。 热敏头（1）包括：支撑基板（12），其包括在支撑基板（12）的表面中形成有开口部分（23a）的凹部（23）; 外部尺寸小于所述支撑基板（12）的外部尺寸并且比所述开口部（23a）的外部尺寸略大的上部基板（14），用于在接合时封闭所述开口部（23a） 以堆叠状态到所述支撑基板（12）的表面; 以及形成在与所述支撑基板（12）的所述凹部（23）相对的位置的所述上基板（14）的表面上的发热电阻体（15）。
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