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公开(公告)号：US4744193A
公开(公告)日：1988-05-17
申请号：US927469
申请日：1986-11-06
IPC分类号： E04B1/66 , C08G18/16 , C08G18/30 , E02D3/12 , E02D31/04 , E03B11/14 , E04G23/02 , E02D31/02 , E02D37/00
CPC分类号： E02D31/04 , C08G18/168 , C08G18/302 , E02D3/12 , E04G23/02 , E04G23/0203 , C08G2190/00
摘要： A mixture consisting essentially of (1) an organic polyisocyanate compound and/or a prepolymer having terminal isocyanate residues, which is derived from the reaction of an organic polyisocyanate with a polyhydroxyl compound, and (2) 2-pyrrolidone, is injected for grouting into water-leaking cracks or openings of concrete structures such as water tanks, subway constructions and tunnels. The injected mixture diffuses into the cracks or openings and is cured in short time by reacting with water at the leaking sites. The resultant polyurethane foam securely seals the water leaking sites.
摘要翻译： 基本上由（1）有机多异氰酸酯化合物和/或具有末端异氰酸酯残基的预聚物（其衍生自有机多异氰酸酯与多羟基化合物的反应）和（2）2-吡咯烷酮组成的混合物被注入到 水泄漏裂缝或混凝土结构的开口，如水箱，地铁建筑物和隧道。 注入的混合物扩散到裂缝或开口中，并在短时间内通过与泄漏部位的水反应而固化。 所得的聚氨酯泡沫可以牢固地密封泄水部位。
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公开(公告)号：US20100328920A1
公开(公告)日：2010-12-30
申请号：US12801279
申请日：2010-06-01
IPC分类号： H05K1/11
CPC分类号： H05K1/142 , H01L2224/48091 , H01L2224/48137 , H01L2924/3011 , H05K1/0215 , H05K1/0219 , H05K1/025 , H05K3/0061 , H05K3/403 , H05K3/4053 , H05K2201/0919 , H05K2201/09236 , H05K2201/09318 , H05K2201/09354 , H05K2201/09845 , H05K2203/049 , H01L2924/00014 , H01L2924/00
摘要： A high-speed transmission circuit board connection structure includes a first high-speed transmission circuit board including a laminated substrate including a first signal transmission wiring formed on a surface thereof and a ground plane formed inside thereof, a second high-speed transmission circuit board including a circuit substrate and a second signal transmission wiring formed on a surface of the circuit substrate, a conductive board connecting member for fixing the first and second high-speed transmission circuit boards to a surface thereof, and a bonding wire for electrically connecting the first signal transmission wiring and the second signal transmission wiring. The ground plane is exposed on a side end face of the laminated substrate, and a conductive film is formed on the side end face such that the ground plane of the first high-speed transmission circuit board is electrically connected to the board connecting member with the conductive film.
摘要翻译： 高速传输电路板连接结构包括：第一高速传输电路板，包括：层叠基板，其包括形成在其表面上的第一信号传输布线和形成在其内部的接地平面;第二高速传输电路板，包括 电路基板和形成在电路基板的表面上的第二信号传输布线，用于将第一和第二高速传输电路板固定到其表面的导电板连接部件，以及用于将第一信号 传输线和第二信号传输线。 接地面暴露在层叠基板的侧端面上，在侧端面上形成导电膜，使得第一高速传输电路板的接地面与板连接部件电连接 导电膜。
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公开(公告)号：US08395906B2
公开(公告)日：2013-03-12
申请号：US12801279
申请日：2010-06-01
IPC分类号： H05K1/11
CPC分类号： H05K1/142 , H01L2224/48091 , H01L2224/48137 , H01L2924/3011 , H05K1/0215 , H05K1/0219 , H05K1/025 , H05K3/0061 , H05K3/403 , H05K3/4053 , H05K2201/0919 , H05K2201/09236 , H05K2201/09318 , H05K2201/09354 , H05K2201/09845 , H05K2203/049 , H01L2924/00014 , H01L2924/00
摘要： A high-speed transmission circuit board connection structure includes a first high-speed transmission circuit board including a laminated substrate including a first signal transmission wiring formed on a surface thereof and a ground plane formed inside thereof, a second high-speed transmission circuit board including a circuit substrate and a second signal transmission wiring formed on a surface of the circuit substrate, a conductive board connecting member for fixing the first and second high-speed transmission circuit boards to a surface thereof, and a bonding wire for electrically connecting the first signal transmission wiring and the second signal transmission wiring. The ground plane is exposed on a side end face of the laminated substrate, and a conductive film is formed on the side end face such that the ground plane of the first high-speed transmission circuit board is electrically connected to the board connecting member with the conductive film.
摘要翻译： 高速传输电路板连接结构包括：第一高速传输电路板，包括：层叠基板，其包括形成在其表面上的第一信号传输布线和形成在其内部的接地平面;第二高速传输电路板，包括 电路基板和形成在电路基板的表面上的第二信号传输布线，用于将第一和第二高速传输电路板固定到其表面的导电板连接部件，以及用于将第一信号 传输线和第二信号传输线。 接地面暴露在层叠基板的侧端面上，在侧端面上形成导电膜，使得第一高速传输电路板的接地面与板连接部件电连接 导电膜。
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公开(公告)号：US20080247713A1
公开(公告)日：2008-10-09
申请号：US12076527
申请日：2008-03-19
IPC分类号： G02B6/36
CPC分类号： G02B6/4246 , G02B6/4206 , G02B6/4214
摘要： An optical transmission module includes a ferrule with a built-in optical fiber, an optical member for reflecting or transmitting plural different wavelength optical signals, a first optical element for emitting an optical signal into the optical fiber via the optical member, a second optical element for receiving an optical signal from the optical fiber via the optical member, a package accommodating the first and second optical elements, a circuit substrate for driving the first and second optical elements, the circuit substrate being electrically connected to the package, a case accommodating the package and the circuit substrate, and an inclined portion provided in an inner surface of the case, the circuit substrate being mounted on the inclined portion.
摘要翻译： 光传输模块包括具有内置光纤的套管，用于反射或传输多个不同波长光信号的光学部件，用于经由光学部件将光信号发射到光纤中的第一光学元件，第二光学元件 用于经由光学构件从光纤接收光信号，容纳第一和第二光学元件的封装，用于驱动第一和第二光学元件的电路基板，电连接到封装的电路基板，容纳 封装和电路基板，以及设置在壳体的内表面中的倾斜部分，电路基板安装在倾斜部分上。
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公开(公告)号：US20100215325A1
公开(公告)日：2010-08-26
申请号：US12662713
申请日：2010-04-29
IPC分类号： G02B6/36
CPC分类号： G02B6/4246 , G02B6/4206 , G02B6/4214
摘要： An optical transmission module, includes a case including a bottom plane, a circuit substrate including a first card edge provided at one end of the circuit substrate, the circuit substrate being provided in the case to be inclined with the bottom plane of the case, an optical element mounted on the circuit substrate, and a connector member including one end part provided toward a direction opposite to the circuit substrate and another end part provided toward the circuit substrate. The first card edge is electrically connected to another end of the connector member. The one end part of the connector member includes a second card edge, the second card edge is disposed to be parallel with the bottom plane of the case.
摘要翻译： 一种光传输模块，包括：壳体，包括底平面;电路基板，包括设置在所述电路基板的一端的第一卡边缘，所述电路基板设置在所述壳体中以与所述壳体的底面倾斜; 安装在电路基板上的光学元件，以及连接器构件，其包括朝向与电路基板相反的方向设置的一个端部，以及朝向电路基板设置的另一个端部。 第一卡边缘电连接到连接器构件的另一端。 连接器构件的一端部包括第二卡边缘，第二卡边缘设置成与壳体的底平面平行。
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公开(公告)号：US4449856A
公开(公告)日：1984-05-22
申请号：US345445
申请日：1982-02-03
申请人： Takehiko Tokoro , Shoichi Kashima , Mineo Murata
发明人： Takehiko Tokoro , Shoichi Kashima , Mineo Murata
IPC分类号： E02D3/12
CPC分类号： E02D3/12
摘要： A grout injection method and apparatus, characterized in that a grout comprised of two liquids and curable when the two liquids are combined are supplied, in a grout injection operation, to an injection pump, introduced through separate passages formed concentrically in the pipe, respectively, into an annular chamber formed within the pipe, and uniformly combined, contacted and mixed with each other in the annular mixing chamber before injection into the soil. The passages of the liquids communicating with the annular mixing chamber are blocked when the grout injection is not carried out.
摘要翻译： 一种灌浆注射方法和装置，其特征在于，由两种液体组成的水泥浆和两种液体组合时可固化的灌浆剂在灌浆注射操作中分别供给到通过分别在管道中同心形成的通道引入的注射泵， 进入形成在管内的环形室，并在注入土壤之前在环形混合室中彼此均匀地组合，接触和混合。 当不进行灌浆注入时，与环形混合室连通的液体的通道被堵塞。
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