公开(公告)号：US5860181A

公开(公告)日：1999-01-19

申请号：US716889

申请日：1996-09-20

申请人： Toshiro Maekawa ,  Satomi Hamada ,  Koji Ono ,  Atsushi Shigeta ,  Masako Kodera

发明人： Toshiro Maekawa ,  Satomi Hamada ,  Koji Ono ,  Atsushi Shigeta ,  Masako Kodera

IPC分类号： B08B1/00 ,  B08B1/04 ,  B24B53/007 ,  H01L21/00 ,  H01L21/304 ,  H01L21/687 ,  A46B13/02 ,  A47L25/00

CPC分类号： H01L21/68728 ,  B08B1/00 ,  B08B1/007 ,  B08B1/04 ,  B24B53/017 ,  H01L21/67046 ,  H01L21/67051

摘要： A method of and an apparatus for cleaning workpiece is suitable for cleaning a substrate such as a semiconductor substrate, a glass substrate, or a liquid crystal panel to a high level of cleanliness. The method of cleaning a workpiece comprises the steps of holding a workpiece, scrubbing the workpiece with a cleaning member, and rubbing the cleaning member against a member having a rough surface to carry out a self-cleaning of the cleaning member. The cleaning member which is contaminated by having scrubbed the workpiece is rubbed against the rough surface, and the rough surface scrapes the contaminant off the cleaning member. Therefore, the contaminant can effectively be removed from the cleaning member, and hence the cleaning member has a high self-cleaning effect.

摘要翻译： 用于清洁工件的方法和装置适用于清洁诸如半导体衬底，玻璃衬底或液晶面板的衬底以达到高清洁度。 清洁工件的方法包括以下步骤：保持工件，用清洁构件擦拭工件，并将清洁构件摩擦抵靠具有粗糙表面的构件，以进行清洁构件的自清洁。 被擦洗工件污染的清洁部件与粗糙表面摩擦，粗糙表面将污染物从清洁部件上刮下。 因此，可以有效地从清洁部件去除污染物，因此清洁部件具有高的自清洁效果。

公开(公告)号：US20080017220A1

公开(公告)日：2008-01-24

申请号：US11902163

申请日：2007-09-19

申请人： Masako Kodera ,  Kenya Ito ,  Masayuki Kamezawa ,  Satomi Hamada ,  Ichiro Katakabe

发明人： Masako Kodera ,  Kenya Ito ,  Masayuki Kamezawa ,  Satomi Hamada ,  Ichiro Katakabe

IPC分类号： C23G1/00

CPC分类号： H01L21/67173 ,  B08B1/04 ,  B08B3/02 ,  B08B3/04 ,  B08B3/08 ,  B08B3/12 ,  C23G3/00 ,  H01L21/67046 ,  H01L21/67051 ,  H01L21/67057 ,  H01L21/67219

摘要： The present invention relates to a cleaning apparatus which can reduce a potential difference between metals or alloys used to form interconnects on a substrate for thereby minimizing corrosion which may occur during and after a substrate cleaning process. The cleaning apparatus for cleaning a substrate having metal interconnects comprises a cleaning mechanism for cleaning the substrate, and a functional water supply mechanism for supplying functional water to the cleaning mechanism. The cleaning mechanism cleans a surface of the substrate with use of the functional water.

摘要翻译： 本发明涉及一种清洁装置，其可以减少用于在基板上形成互连件的金属或合金之间的电位差，从而最小化在基板清洗处理期间和之后可能发生的腐蚀。 用于清洁具有金属互连件的基板的清洁装置包括用于清洁基板的清洁机构和用于向清洁机构供应功能性水的功能性供水机构。 清洁机构使用功能性水清洗基材的表面。

公开(公告)号：US06221171B1

公开(公告)日：2001-04-24

申请号：US08868889

申请日：1997-06-04

申请人： Toshiro Maekawa ,  Satomi Hamada ,  Riichiro Aoki ,  Shoichi Kodama ,  Hiromi Yajima

发明人： Toshiro Maekawa ,  Satomi Hamada ,  Riichiro Aoki ,  Shoichi Kodama ,  Hiromi Yajima

IPC分类号： G08B102

CPC分类号： H01L21/67051 ,  Y10S134/902

摘要： A method and apparatus for conveying workpiece is used for conveying a workpiece such as a semiconductor wafer, glass substrate or liquid crystal panel between processing apparatuses when the workpiece is processed in a plurality of processing apparatuses. The method includes adjusting the amount of liquid on a surface of a workpiece to a predetermined amount, and conveying the workpiece which retains the predetermined amount of liquid between processes. The surface of the workpiece is kept wet by the liquid on the workpiece. The adjusting includes supplying a sufficient amount of liquid onto the surface of the workpiece which is in a certain state, and removing a certain amount of liquid from the surface of the workpiece.

摘要翻译： 当在多个处理装置中处理工件时，用于输送工件的方法和装置用于在处理装置之间输送诸如半导体晶片，玻璃基板或液晶面板的工件。 该方法包括将工件表面上的液体量调整到预定量，并且在工艺之间输送保留预定量液体的工件。 工件的表面被工件上的液体保持湿润。 该调整包括将足够量的液体供给到处于一定状态的工件的表面上，并从工件的表面去除一定量的液体。

公开(公告)号：US6106635A

公开(公告)日：2000-08-22

申请号：US35770

申请日：1998-03-06

申请人： Satomi Hamada ,  Toshiro Maekawa

发明人： Satomi Hamada ,  Toshiro Maekawa

IPC分类号： B08B1/04 ,  B08B3/02 ,  B08B3/12 ,  B08B1/02 ,  B08B3/04

CPC分类号： B08B1/007 ,  B08B1/04 ,  B08B3/024 ,  B08B3/12 ,  H01L21/67051 ,  B08B2203/0288 ,  Y10S134/902

摘要： A washing method provides a liquid jet washing by jetting a liquid against a rotating thin-plate-shaped workpiece from a nozzle which shifts while being positioned opposite a front or back surface of the workpiece, thus removing dust adhering to the front or back surface and thereby washing the workpiece. The locus of the shifting nozzle is caused to pass in the vicinity of, but not over, the center of rotation of the workpiece. Electronic circuitry present at the central portion of workpiece is prevented from suffering electrostatic breakage caused by collision with washing liquid. At the same time, an appropriate quantity of washing liquid is made to collide with the entire surface of a workpiece, so that the workpiece can be washed satisfactorily.

摘要翻译： 洗涤方法通过从喷嘴喷射液体抵靠旋转的薄板状工件提供液体喷射洗涤，该喷嘴在与工件的前表面或后表面相对定位的同时移动，从而去除附着在前表面或后表面上的灰尘， 从而洗涤工件。 移位喷嘴的轨迹被引导到工件的旋转中心附近但不超过工件的旋转中心。 存在于工件中心部分的电子电路不会受到与洗涤液体碰撞引起的静电破坏。 同时，使适量的洗涤液与工件的整个表面碰撞，从而可以令人满意地清洗工件。

公开(公告)号：US06595220B2

公开(公告)日：2003-07-22

申请号：US09797822

申请日：2001-03-05

申请人： Toshiro Maekawa ,  Satomi Hamada ,  Riichiro Aoki ,  Shoichi Kodama ,  Hiromi Yajima

发明人： Toshiro Maekawa ,  Satomi Hamada ,  Riichiro Aoki ,  Shoichi Kodama ,  Hiromi Yajima

IPC分类号： B08B300

CPC分类号： H01L21/67051 ,  Y10S134/902

摘要： An apparatus for conveying a workpiece as used to convey the workpiece such as a semiconductor wafer, a glass substrate or liquid crystal panel, between processing apparatuses when the workpiece is processed in the plurality of processing apparatuses. The amount of liquid on a surface of a workpiece is adjusted to a predetermined amount, and the workpiece, which retains the predetermined amount of liquid, is conveyed between processes. The adjusting includes both supplying a sufficient amount of liquid onto the surface of the workpiece, which is in a certain state, and removing a certain amount of liquid from the surface of the workpiece.

摘要翻译： 一种用于在多个处理装置中处理工件时在处理装置之间输送用于输送工件（例如半导体晶片，玻璃基板或液晶面板）的工件的装置。 将工件表面上的液体量调整到预定量，并且保持预定量的液体的工件在工艺之间传送。 该调整包括在工件的处于一定状态的表面上提供足够量的液体，并从工件的表面去除一定量的液体。

公开(公告)号：US5966765A

公开(公告)日：1999-10-19

申请号：US955292

申请日：1997-10-21

申请人： Satomi Hamada ,  Toshiro Maekawa ,  Toshiya Takeuchi

发明人： Satomi Hamada ,  Toshiro Maekawa ,  Toshiya Takeuchi

IPC分类号： H01L21/00 ,  A46B13/02

CPC分类号： H01L21/67046

摘要： A cleaning apparatus is used for cleaning a thin disk-shaped workpiece such as a semiconductor wafer, a liquid crystal display or the like. The cleaning apparatus comprises a support mechanism for supporting a workpiece and rotating the workpiece about its own axis, and a cleaning member for being in sliding contact with at least one of opposite surfaces of the workpiece. The support mechanism comprises a plurality of spindles, and a plurality of rotatable holding portions provided on upper ends of the spindles and having respective circumferential edges engageable with a circumferential edge of the workpiece. The plurality of spindles are clustered into groups around the workpiece, and two adjacent groups of the spindles are positioned to form a wide spacing between two adjacent groups of the spindles, and a path along which the workpiece is supplied to and removed from the support mechanism is positioned in the wide spacing.

摘要翻译： 清洁装置用于清洁诸如半导体晶片，液晶显示器等的薄盘形工件。 清洁装置包括用于支撑工件并围绕其自身轴线旋转工件的支撑机构，以及用于与工件的相对表面中的至少一个滑动接触的清洁构件。 所述支撑机构包括多个主轴，以及设置在所述主轴的上端上的多个可旋转保持部，并且具有可与所述工件的周向边缘接合的各自的周向边缘。 多个锭子围绕工件聚集成组，并且两个相邻的心轴组被定位成在心轴的两个相邻组之间形成宽的间隔，并且沿工件被提供到支撑机构和从支撑机构移除的路径 位于宽间距。

公开(公告)号：US20080289652A1

公开(公告)日：2008-11-27

申请号：US11631244

申请日：2005-09-13

申请人： Satomi Hamada

发明人： Satomi Hamada

IPC分类号： B08B7/04 ,  B08B3/10

CPC分类号： H01L21/67046 ,  H01L21/02096 ,  H01L21/67057

摘要： A substrate cleaning apparatus comprises a cleaning apparatus 10 including an abutting member 14 which is pressed against a cleaning member 2 to clean the cleaning member 2, a drive control means 21 for controllably driving the abutting member 14 and a cleaning tank 12 which contains a cleaning liquid 11 and allows a portion of abutment between the cleaning member 2 and the abutting member 14 to be impregnated with the cleaning liquid 11. The substrate cleaning apparatus also comprises an image capturing means 16 which captures a surface image of the cleaning member 2 and an image processing means 17. A surface condition of the cleaning member 2 is monitored to determine the timing of replacement of the cleaning member 2. The substrate cleaning apparatus further comprises a measurement means 13 which measures the number of particles and/or a concentration of a component in the cleaning liquid 11 in the cleaning tank 12. Results of measurement by the measurement means 13 are fed back to a drive control means 21, to thereby prevent contamination of the cleaning member 2.

摘要翻译： 基板清洗装置包括：清洁装置10，包括抵靠构件14，抵靠构件14压靠清洁构件2以清洁清洁构件2;驱动控制装置21，用于可控地驱动抵接构件14;以及清洁箱12，其包含清洁 液体11并且允许清洁构件2和抵接构件14之间的一部分邻接被浸渍清洁液11.基板清洁装置还包括捕获清洁构件2的表面图像的图像捕获装置16和 图像处理装置17.监视清洁构件2的表面状态以确定更换清洁构件2的时间。基板清洁装置还包括测量装置13，其测量颗粒数量和/或浓度 清洗槽12内的清洗液11中的成分。由测定单元13测量的结果反馈到 驱动控制装置21，从而防止清洁部件2的污染。

公开(公告)号：US08608858B2

公开(公告)日：2013-12-17

申请号：US11631244

申请日：2005-09-13

申请人： Satomi Hamada

发明人： Satomi Hamada

IPC分类号： B08B7/00

CPC分类号： H01L21/67046 ,  H01L21/02096 ,  H01L21/67057

摘要： A substrate cleaning apparatus includes a cleaning apparatus 10 including an abutting member which is to be pressed against a cleaning member to clean the cleaning member, a drive control device for controllably driving the abutting member, and a cleaning tank which contains a cleaning liquid and allows a portion of abutment between the cleaning member and the abutting member to be impregnated with the cleaning liquid. The substrate cleaning apparatus also includes an image capturing device which captures a surface image of the cleaning member and an image processing device. A surface condition of the cleaning member is monitored to determine the timing of replacement of the cleaning member. The substrate cleaning apparatus further includes a measurement device which measures the number of particles and/or a concentration of a component in the cleaning liquid in the cleaning tank. Results of measurement by the measurement device are fed back to a drive control device, to thereby prevent contamination of the cleaning member.

摘要翻译： 基板清洗装置包括清洁装置10，该清洁装置10包括抵靠构件，该邻接构件被压靠在清洁构件上以清洁清洁构件;驱动控制装置，用于可控制地驱动抵接构件;以及清洁槽，其包含清洁液体并允许 清洁部件与要浸渍清洗液体的抵接部件之间的邻接部分。 基板清洁装置还包括捕获清洁部件的表面图像的图像捕获装置和图像处理装置。 监视清洁构件的表面状态以确定清洁构件的更换的时间。 基板清洗装置还包括测量清洁槽中的清洁液中的颗粒数量和/或组分浓度的测量装置。 将测量装置的测量结果反馈到驱动控制装置，从而防止清洁部件的污染。

公开(公告)号：US20100212702A1

公开(公告)日：2010-08-26

申请号：US11922093

申请日：2006-09-07

申请人： Satomi Hamada

发明人： Satomi Hamada

IPC分类号： B08B3/00

CPC分类号： H01L21/02068 ,  H01L21/67046

摘要： An object of the present invention is to provide a cleaning member, a substrate cleaning apparatus and a substrate processing apparatus, which are adapted to work with a reduced amount of contaminants to be discharged from the cleaning member, to prevent inverse contamination in a substrate subject to the cleaning and to preserve a high cleaning power to the substrate in a stable manner. The object is accomplished by a cleaning member of a substrate cleaning apparatus for cleaning a surface of a substrate subject to the cleaning by using a relative motion between the surface of the substrate subject to the cleaning and the cleaning member brought into contact with the surface of the substrate, while supplying a cleaning liquid onto the surface of the substrate, the cleaning member comprising a core portion (23a) made of a waterproof material, wherein a surface of the core portion (23a) is covered with a porous polymeric material to define a coating layer (23b). The porous polymeric material to be used may be selected form a group consisting of PVA polymers, acrylic acid polymers, other addition polymers, acryl amide polymers, polyoxyethylene polymers, polyether polymers, condensation polymers, polyvinyl pyrrolidone, polystyrene aurfonic acid, urethane resins, and polyurethane resins.

摘要翻译： 本发明的目的是提供一种清洁构件，基板清洁装置和基板处理装置，其适用于从清洁构件排出的污染物量减少的量，以防止基板主体中的反向污染 以清洁并以稳定的方式保持对基材的高清洁力。 该目的是通过一种基板清洁装置的清洁部件实现的，该清洁部件用于通过使用经过清洁的基板的表面和与清洁部件的表面接触的清洁部件之间的相对运动来清洁经受清洁的基板的表面 所述基板在将清洁液体供应到所述基板的表面上的同时，所述清洁部件包括由防水材料制成的芯部（23a），其中所述芯部（23a）的表面被多孔聚合材料覆盖以限定 涂层（23b）。 所使用的多孔聚合物材料可以选自PVA聚合物，丙烯酸聚合物，其它加成聚合物，丙烯酰胺聚合物，聚氧乙烯聚合物，聚醚聚合物，缩聚物，聚乙烯吡咯烷酮，聚苯乙烯亚麻酸，聚氨酯树脂和 聚氨酯树脂。

公开(公告)号：US20090081810A1

公开(公告)日：2009-03-26

申请号：US11664684

申请日：2005-09-22

申请人： Satomi Hamada ,  Michihisa Kono

发明人： Satomi Hamada ,  Michihisa Kono

IPC分类号： H01L21/66 ,  C23F1/00

CPC分类号： H01L21/67051 ,  H01L21/68707

摘要： A substrate processing apparatus has a fluid supply means 20 for supplying fluid to a substrate W and a fluid collection means 21 for collecting the fluid in the vicinity of the substrate W, the fluid supply means 20 having a fluid spurt section 20a, the fluid collection means 21 having a fluid suction section 21a opening in the vicinity of the fluid spurt section 20a. Since the fluid collection means 21 suctions and collects the fluid floating around the substrate W as a result of the liquid having been supplied from the fluid spurt section 20a to the substrate W, it is possible to prevent the substrate W from being contaminated after the substrate W being processed with the fluid supplied from the fluid supply means 20.

摘要翻译： 基板处理装置具有用于向基板W供给流体的流体供给装置20和用于收集基板W附近的流体的流体收集装置21，流体供给装置20具有流体喷出部20a，流体收集 装置21具有在流体喷出部分20a附近开口的流体抽吸部分21a。 由于液体收集装置21由于从液体喷出部分20a供给到基底W而液体被吸收并收集在基底W周围浮动的流体，所以可以防止基底W在基底之后被污染 W被从流体供应装置20供应的流体处理。