公开(公告)号：US06595220B2

公开(公告)日：2003-07-22

申请号：US09797822

申请日：2001-03-05

申请人： Toshiro Maekawa ,  Satomi Hamada ,  Riichiro Aoki ,  Shoichi Kodama ,  Hiromi Yajima

发明人： Toshiro Maekawa ,  Satomi Hamada ,  Riichiro Aoki ,  Shoichi Kodama ,  Hiromi Yajima

IPC分类号： B08B300

CPC分类号： H01L21/67051 ,  Y10S134/902

摘要： An apparatus for conveying a workpiece as used to convey the workpiece such as a semiconductor wafer, a glass substrate or liquid crystal panel, between processing apparatuses when the workpiece is processed in the plurality of processing apparatuses. The amount of liquid on a surface of a workpiece is adjusted to a predetermined amount, and the workpiece, which retains the predetermined amount of liquid, is conveyed between processes. The adjusting includes both supplying a sufficient amount of liquid onto the surface of the workpiece, which is in a certain state, and removing a certain amount of liquid from the surface of the workpiece.

摘要翻译： 一种用于在多个处理装置中处理工件时在处理装置之间输送用于输送工件（例如半导体晶片，玻璃基板或液晶面板）的工件的装置。 将工件表面上的液体量调整到预定量，并且保持预定量的液体的工件在工艺之间传送。 该调整包括在工件的处于一定状态的表面上提供足够量的液体，并从工件的表面去除一定量的液体。

公开(公告)号：US06221171B1

公开(公告)日：2001-04-24

申请号：US08868889

申请日：1997-06-04

申请人： Toshiro Maekawa ,  Satomi Hamada ,  Riichiro Aoki ,  Shoichi Kodama ,  Hiromi Yajima

发明人： Toshiro Maekawa ,  Satomi Hamada ,  Riichiro Aoki ,  Shoichi Kodama ,  Hiromi Yajima

IPC分类号： G08B102

CPC分类号： H01L21/67051 ,  Y10S134/902

摘要： A method and apparatus for conveying workpiece is used for conveying a workpiece such as a semiconductor wafer, glass substrate or liquid crystal panel between processing apparatuses when the workpiece is processed in a plurality of processing apparatuses. The method includes adjusting the amount of liquid on a surface of a workpiece to a predetermined amount, and conveying the workpiece which retains the predetermined amount of liquid between processes. The surface of the workpiece is kept wet by the liquid on the workpiece. The adjusting includes supplying a sufficient amount of liquid onto the surface of the workpiece which is in a certain state, and removing a certain amount of liquid from the surface of the workpiece.

摘要翻译： 当在多个处理装置中处理工件时，用于输送工件的方法和装置用于在处理装置之间输送诸如半导体晶片，玻璃基板或液晶面板的工件。 该方法包括将工件表面上的液体量调整到预定量，并且在工艺之间输送保留预定量液体的工件。 工件的表面被工件上的液体保持湿润。 该调整包括将足够量的液体供给到处于一定状态的工件的表面上，并从工件的表面去除一定量的液体。

公开(公告)号：US20080166949A1

公开(公告)日：2008-07-10

申请号：US11980667

申请日：2007-10-31

申请人： Hiromi Yajima ,  Yukio Imoto ,  Shoichi Kodama ,  Riichiro Aoki ,  Takashi Omichi ,  Toyomi Nishi ,  Tetsuji Togawa

发明人： Hiromi Yajima ,  Yukio Imoto ,  Shoichi Kodama ,  Riichiro Aoki ,  Takashi Omichi ,  Toyomi Nishi ,  Tetsuji Togawa

IPC分类号： B24B1/00 ,  B24B27/00

CPC分类号： H01L21/67161 ,  B08B1/04 ,  B24B27/0023 ,  B24B37/04 ,  B24B37/345 ,  B24B51/00 ,  B24B55/12 ,  F24F3/161 ,  H01L21/67028 ,  H01L21/67046 ,  H01L21/67057 ,  H01L21/67167 ,  H01L21/67219 ,  H01L21/67745 ,  H01L21/67778 ,  H03M13/39 ,  H04N5/4401 ,  H04N5/455

摘要： A polishing apparatus includes an arrangement of a plurality of units to deal with various operations and a robot having at least one arm. The plurality of units are disposed around the robot and include a loading unit for receiving thereon a, e.g. dry, workpiece to be polished, a polishing system including at least one polishing unit for polishing the workpiece, a washing system and a drying system at least including one washing unit for washing and drying the polished workpiece, and an unloading unit for receiving thereon a resultant clean and dry polished workpiece.

摘要翻译： 抛光装置包括用于处理各种操作的多个单元的布置以及具有至少一个臂的机器人。 所述多个单元设置在所述机器人周围，并且包括用于在其上接收的加载单元。 干燥的待抛光工件，包括至少一个用于抛光工件的抛光单元的抛光系统，至少包括一个用于洗涤和干燥抛光的工件的洗涤单元的洗涤系统和干燥系统，以及用于在其上接收的卸载单元 得到清洁和干燥的抛光工件。

公开(公告)号：US07198552B2

公开(公告)日：2007-04-03

申请号：US11294365

申请日：2005-12-06

申请人： Toyomi Nishi ,  Tetsuji Togawa ,  Harumitsu Saito ,  Manabu Tsujimura ,  Hiromi Yajima ,  Kazuaki Himukai ,  Shoichi Kodama ,  Yukio Imoto ,  Riichiro Aoki ,  Masako Watase ,  Atsushi Shigeta ,  Shiro Mishima ,  Gisuke Kouno

发明人： Toyomi Nishi ,  Tetsuji Togawa ,  Harumitsu Saito ,  Manabu Tsujimura ,  Hiromi Yajima ,  Kazuaki Himukai ,  Shoichi Kodama ,  Yukio Imoto ,  Riichiro Aoki ,  Masako Watase ,  Atsushi Shigeta ,  Shiro Mishima ,  Gisuke Kouno

IPC分类号： B24B1/00

CPC分类号： B24B37/345 ,  B08B1/04 ,  B08B15/02 ,  B24B27/0023 ,  B24B51/00 ,  B24B55/12 ,  F24F3/161 ,  H01L21/67017 ,  H01L21/67028 ,  H01L21/67057 ,  H01L21/67219

摘要： A polishing apparatus for polishing a surface of a workpiece includes a housing unit, a partition wall partitioning an interior of the housing unit into a first chamber and a second chamber, a polishing section disposed in the first chamber and having a turntable with an abrasive cloth mounted on an upper surface thereof and a top ring positioned above the turntable for supporting the workpiece to be polished and pressing the workpiece against the abrasive cloth, and a cleaning section disposed in the second chamber and cleaning the workpiece which has been polished. The polishing apparatus further includes a transferring device for transferring the workpiece which has been polished from the polishing section to the cleaning section through an opening and an exhaust system for exhausting ambient air from each of the polishing section and cleaning section separately and independently.

摘要翻译： 用于抛光工件表面的抛光装置包括壳体单元，将壳体单元的内部分隔成第一室和第二室的分隔壁，设置在第一室中的抛光部分，并且具有带有研磨布的转台 安装在其上表面和位于转台上方的顶环，用于支撑待抛光的工件并将工件压靠在研磨布上，以及设置在第二室中并清洁已经被抛光的工件的清洁部。 抛光装置还包括转印装置，用于通过用于从每个抛光部分和清洁部分分别且独立地排出周围空气的开口和排气系统将已经从抛光部分抛光的工件传送到清洁部分。

公开(公告)号：US07708618B2

公开(公告)日：2010-05-04

申请号：US11980667

申请日：2007-10-31

申请人： Hiromi Yajima ,  Yukio Imoto ,  Shoichi Kodama ,  Riichiro Aoki ,  Takashi Omichi ,  Toyomi Nishi ,  Tetsuji Togawa

发明人： Hiromi Yajima ,  Yukio Imoto ,  Shoichi Kodama ,  Riichiro Aoki ,  Takashi Omichi ,  Toyomi Nishi ,  Tetsuji Togawa

IPC分类号： B24B51/00

CPC分类号： H01L21/67161 ,  B08B1/04 ,  B24B27/0023 ,  B24B37/04 ,  B24B37/345 ,  B24B51/00 ,  B24B55/12 ,  F24F3/161 ,  H01L21/67028 ,  H01L21/67046 ,  H01L21/67057 ,  H01L21/67167 ,  H01L21/67219 ,  H01L21/67745 ,  H01L21/67778 ,  H03M13/39 ,  H04N5/4401 ,  H04N5/455

摘要： A polishing apparatus includes an arrangement of a plurality of units to deal with various operations and a robot having at least one arm. The plurality of units are disposed around the robot and include a loading unit for receiving thereon a, e.g. dry, workpiece to be polished, a polishing system including at least one polishing unit for polishing the workpiece, a washing system and a drying system at least including one washing unit for washing and drying the polished workpiece, and an unloading unit for receiving thereon a resultant clean and dry polished workpiece.

摘要翻译： 抛光装置包括用于处理各种操作的多个单元的布置以及具有至少一个臂的机器人。 所述多个单元设置在所述机器人周围，并且包括用于在其上接收的加载单元。 干燥的待抛光工件，包括至少一个用于抛光工件的抛光单元的抛光系统，至少包括一个用于洗涤和干燥抛光的工件的洗涤单元的洗涤系统和干燥系统，以及用于在其上接收的卸载单元 得到清洁和干燥的抛光工件。

公开(公告)号：US20060084369A1

公开(公告)日：2006-04-20

申请号：US11294365

申请日：2005-12-06

申请人： Toyomi Nishi ,  Tetsuji Togawa ,  Harumitsu Saito ,  Manabu Tsujimura ,  Hiromi Yajima ,  Kazuaki Himukai ,  Shoichi Kodama ,  Yukio Imoto ,  Riichiro Aoki ,  Masako Watase ,  Atsushi Shigeta ,  Shiro Mishima ,  Gisuke Kouno

发明人： Toyomi Nishi ,  Tetsuji Togawa ,  Harumitsu Saito ,  Manabu Tsujimura ,  Hiromi Yajima ,  Kazuaki Himukai ,  Shoichi Kodama ,  Yukio Imoto ,  Riichiro Aoki ,  Masako Watase ,  Atsushi Shigeta ,  Shiro Mishima ,  Gisuke Kouno

IPC分类号： B24B1/00

CPC分类号： B24B37/345 ,  B08B1/04 ,  B08B15/02 ,  B24B27/0023 ,  B24B51/00 ,  B24B55/12 ,  F24F3/161 ,  H01L21/67017 ,  H01L21/67028 ,  H01L21/67057 ,  H01L21/67219

摘要： A polishing apparatus for polishing a surface of a workpiece includes a housing unit, a partition wall partitioning an interior of the housing unit into a first chamber and a second chamber, a polishing section disposed in the first chamber and having a turntable with an abrasive cloth mounted on an upper surface thereof and a top ring positioned above the turntable for supporting the workpiece to be polished and pressing the workpiece against the abrasive cloth, and a cleaning section disposed in the second chamber and cleaning the workpiece which has been polished. The polishing apparatus further includes a transferring device for transferring the workpiece which has been polished from the polishing section to the cleaning section through an opening and an exhaust system for exhausting ambient air from each of the polishing section and cleaning section separately and independently.

摘要翻译： 用于抛光工件表面的抛光装置包括壳体单元，将壳体单元的内部分隔成第一室和第二室的分隔壁，设置在第一室中的抛光部分，并且具有带有研磨布的转台 安装在其上表面和位于转台上方的顶环，用于支撑待抛光的工件并将工件压靠在研磨布上，以及设置在第二室中并清洁已经被抛光的工件的清洁部。 抛光装置还包括转印装置，用于通过用于从每个抛光部分和清洁部分分别且独立地排出周围空气的开口和排气系统将已经从抛光部分抛光的工件传送到清洁部分。

公开(公告)号：US06500051B1

公开(公告)日：2002-12-31

申请号：US08884410

申请日：1997-06-27

申请人： Toyomi Nishi ,  Tetsuji Togawa ,  Harumitsu Saito ,  Manabu Tsujimura ,  Hiromi Yajima ,  Kazuaki Himukai ,  Shoichi Kodama ,  Yukio Imoto ,  Riichiro Aoki ,  Masako Watase ,  Atsushi Shigeta ,  Shiro Mishima ,  Gisuke Kouno

发明人： Toyomi Nishi ,  Tetsuji Togawa ,  Harumitsu Saito ,  Manabu Tsujimura ,  Hiromi Yajima ,  Kazuaki Himukai ,  Shoichi Kodama ,  Yukio Imoto ,  Riichiro Aoki ,  Masako Watase ,  Atsushi Shigeta ,  Shiro Mishima ,  Gisuke Kouno

IPC分类号： B24B100

CPC分类号： B24B37/345 ,  B08B1/04 ,  B08B15/02 ,  B24B27/0023 ,  B24B51/00 ,  B24B55/12 ,  F24F3/161 ,  H01L21/67017 ,  H01L21/67028 ,  H01L21/67057 ,  H01L21/67219

摘要： A polishing apparatus for polishing a surface of a workpiece includes a housing unit, a partition wall partitioning an interior of the housing unit into a first chamber and a second chamber, a polishing section disposed in the first chamber and having a turntable with an abrasive cloth mounted on an upper surface thereof and a top ring positioned above the turntable for supporting the workpiece to be polished and pressing the workpiece against the abrasive cloth, and a cleaning section disposed in the second chamber and cleaning the workpiece which has been polished. The polishing apparatus further includes a transferring device for transferring the workpiece which has been polished from the polishing section to the cleaning section through an opening and an exhaust system for exhausting ambient air from each of the polishing section and cleaning section separately and independently.

摘要翻译： 用于抛光工件表面的抛光装置包括壳体单元，将壳体单元的内部分隔成第一室和第二室的分隔壁，设置在第一室中的抛光部分，并且具有带有研磨布的转台 安装在其上表面和位于转台上方的顶环，用于支撑待抛光的工件并将工件压靠在研磨布上，以及设置在第二室中并清洁已经被抛光的工件的清洁部。 抛光装置还包括转印装置，用于通过用于从每个抛光部分和清洁部分分别且独立地排出周围空气的开口和排气系统将已经从抛光部分抛光的工件传送到清洁部分。

公开(公告)号：US06997782B2

公开(公告)日：2006-02-14

申请号：US10255793

申请日：2002-09-27

申请人： Toyomi Nishi ,  Tetsuji Togawa ,  Harumitsu Saito ,  Manabu Tsujimura ,  Hiromi Yajima ,  Kazuaki Himukai ,  Shoichi Kodama ,  Yukio Imoto ,  Riichiro Aoki ,  Masako Watase ,  Atsushi Shigeta ,  Shiro Mishima ,  Gisuke Kouno

发明人： Toyomi Nishi ,  Tetsuji Togawa ,  Harumitsu Saito ,  Manabu Tsujimura ,  Hiromi Yajima ,  Kazuaki Himukai ,  Shoichi Kodama ,  Yukio Imoto ,  Riichiro Aoki ,  Masako Watase ,  Atsushi Shigeta ,  Shiro Mishima ,  Gisuke Kouno

IPC分类号： B24B1/00

CPC分类号： B24B37/345 ,  B08B1/04 ,  B08B15/02 ,  B24B27/0023 ,  B24B51/00 ,  B24B55/12 ,  F24F3/161 ,  H01L21/67017 ,  H01L21/67028 ,  H01L21/67057 ,  H01L21/67219

摘要： A polishing apparatus for polishing a surface of a workpiece includes a housing unit, a partition wall partitioning an interior of the housing unit into a first chamber and a second chamber, a polishing section disposed in the first chamber and having a turntable with an abrasive cloth mounted on an upper surface thereof and a top ring positioned above the turntable for supporting the workpiece to be polished and pressing the workpiece against the abrasive cloth, and a cleaning section disposed in the second chamber and cleaning the workpiece which has been polished. The polishing apparatus further includes a transferring device for transferring the workpiece which has been polished from the polishing section to the cleaning section through an opening and an exhaust system for exhausting ambient air from each of the polishing section and cleaning section separately and independently.

公开(公告)号：US5827110A

公开(公告)日：1998-10-27

申请号：US580312

申请日：1995-12-28

申请人： Hiromi Yajima ,  Yukio Imoto ,  Shoichi Kodama ,  Riichiro Aoki ,  Takashi Omichi ,  Toyomi Nishi ,  Tetsuji Togawa

发明人： Hiromi Yajima ,  Yukio Imoto ,  Shoichi Kodama ,  Riichiro Aoki ,  Takashi Omichi ,  Toyomi Nishi ,  Tetsuji Togawa

IPC分类号： B08B1/04 ,  B24B27/00 ,  B24B37/04 ,  B24B51/00 ,  B24B55/12 ,  H01L21/00 ,  B24B7/22

CPC分类号： B24B37/345 ,  B08B1/04 ,  B24B27/0023 ,  B24B37/04 ,  B24B51/00 ,  B24B55/12 ,  H01L21/67028 ,  H01L21/67057

摘要： A polishing facility integrates separate components of polishing such as wafer transport, polishing, cleaning and drying in one standardized facility to provide efficient polishing operation at low cost. The facility is designed to deal with a variety of different types of wafers, including different types of surface film, and is designed also to enables quick and low cost upgrading of the facility to meet advancing requirements of customers. The polishing facility can be placed within a cleanroom to provide efficient handling of polished wafers for further processing and fabrication tasks. Individual work component of polishing is arranged in one block having its own power supply and signal lines, and is controlled by a central controller having a dedicated software program for each work component. Therefore, if upgrading of the facility is required on any work component, only that work component requiring attention needs to be repaired/replaced, thus eliminating the need to shut down the entire facility as in conventional polishing setups. Each work component is modularized for easy replacement and inventory purposes. The overall effect of the integrated polishing facility is that the efficiency of the polishing operation is significantly improved at minimal cost of labor and capital investments.

摘要翻译： 抛光设备将单独的抛光部件如晶片输送，抛光，清洁和干燥在一个标准化设备中进行集成，以低成本提供有效的抛光操作。 该设施旨在处理各种不同类型的晶片，包括不同类型的表面膜，并且还被设计成能够实现设备的快速和低成本升级以满足客户的前进要求。 抛光设备可以放置在洁净室内，以提供抛光晶片的有效处理以进一步处理和制造任务。 抛光的单个工作部件布置在具有其自己的电源和信号线的一个块中，并且由具有用于每个工作部件的专用软件程序的中央控制器控制。 因此，如果需要在任何工作部件上升级设备，只需要修理/更换需要注意的工作部件，从而无需像传统的抛光设备那样关闭整个设备。 每个工作组件都是模块化的，以便于更换和库存目的。 综合抛光设备的整体效果是以最低的劳动成本和资金投入，大大提高了抛光操作的效率。

公开(公告)号：US5704827A

公开(公告)日：1998-01-06

申请号：US544534

申请日：1995-10-18

申请人： Toyomi Nishi ,  Manabu Tsujimura ,  Tamami Takahashi ,  Hiromi Yajima ,  Riichiro Aoki ,  Yukio Imoto ,  Shoichi Kodama ,  Kazuaki Himukai ,  Gisuke Kouno ,  Takanobu Nishimura

发明人： Toyomi Nishi ,  Manabu Tsujimura ,  Tamami Takahashi ,  Hiromi Yajima ,  Riichiro Aoki ,  Yukio Imoto ,  Shoichi Kodama ,  Kazuaki Himukai ,  Gisuke Kouno ,  Takanobu Nishimura

IPC分类号： B24B37/20 ,  B24B37/24 ,  H01L21/304 ,  B24B5/00

CPC分类号： B24B37/12

摘要： A polishing apparatus includes a detachable light weight cloth cartridge which shows little deformation under uneven loading during a polishing operation. Either mechanical or non-mechanical fixation of the cloth cartridge to a turntable is achieved. Mechanical fixation involves attaching the cloth cartridge to the turntable at peripheral and center sections of the cloth cartridge. Non-mechanical fixation involves attaching the cloth cartridge to the turntable by a vacuum arrangement. The assembly of the cloth cartridge and the turntable not only produces excellent flatness on polished semiconductor wafers by maintaining a level polishing surface, but also improves the production yield by preventing breakage of wafers during the polishing process.

摘要翻译： 抛光装置包括可拆卸轻量布料筒，其在抛光操作期间在不均匀载荷下几乎不变形。 实现了布料盒到转台的机械或非机械固定。 机械固定包括将布料盒连接到布料盒周边和中心部分的转台上。 非机械固定包括通过真空装置将布料盒附接到转台上。 布料盒和转盘的组装不仅通过保持抛光表面而在抛光的半导体晶片上产生优异的平整度，而且还通过防止抛光过程中的晶片破损而提高了生产率。