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公开(公告)号：US5030373A
公开(公告)日：1991-07-09
申请号：US490719
申请日：1990-03-08
申请人： Toshiya Kimura , Koichi Wakashima , Hidebumi Ohnuki , Shigeki Nakajima , Katsutoshi Itani , Akira Hirai
发明人： Toshiya Kimura , Koichi Wakashima , Hidebumi Ohnuki , Shigeki Nakajima , Katsutoshi Itani , Akira Hirai
摘要： An aqueous solution containing 0.1 g/l or more of piperidine or a derivative, 100-500 g/l of sulfuric acid, 10-50 g/l of hydrogen peroxide and 0.5 g/l or more of phosphoric acid is used for treating the surface of copper or copper alloy used in manufacturing of printed circuit.
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公开(公告)号：US5223087A
公开(公告)日：1993-06-29
申请号：US505228
申请日：1990-04-05
申请人： Katsutoshi Itani , Akira Hirai
发明人： Katsutoshi Itani , Akira Hirai
CPC分类号： C22B15/0008 , C23F1/30 , C23F1/44
摘要： A chemical solubilizing agent for tin or a tin alloy used for electroconductive materials is provided. Said chemical solubilizing agent is an acidic solution containing hydrogen peroxide and an inorganic acid and 0.5-50 g liter of said acidic solution of at least one nitrogen-containing compound selected from the group consisting of heterocyclic compounds not having a double bond in the respective heterocyclic rings, cyclopentylamines and cyclohexylamines.
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3.发明授权Compositions containing a diazine and a halogen compound for catalyzing copper etching solutions 失效包含用于催化铜蚀刻溶液的二嗪和卤素化合物的组合物
公开(公告)号：US4110237A
公开(公告)日：1978-08-29
申请号：US810730
申请日：1977-06-28
申请人： Akira Matsumoto , Katsutoshi Itani
发明人： Akira Matsumoto , Katsutoshi Itani
摘要： This invention provides copper and copper alloy etching solutions comprising a mixed aqueous solution of a peroxysulfate with a diazine compound and a halogen compound added as the catalyst. There is also provided a process for etching copper and copper alloys with said etching solutions.
摘要翻译： 本发明提供铜和铜合金蚀刻溶液，其包含过氧硫酸盐与二嗪化合物的混合水溶液和作为催化剂加入的卤素化合物。 还提供了用所述蚀刻溶液蚀刻铜和铜合金的工艺。
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公开(公告)号：US3936332A
公开(公告)日：1976-02-03
申请号：US510535
申请日：1974-09-30
申请人： Akira Matsumoto , Katsutoshi Itani
发明人： Akira Matsumoto , Katsutoshi Itani
摘要： This invention provides cooper and copper alloy etching solutions comprising a mixed aqueous solution of a peroxysulfate with a diazine compound and a halogen compound added as the catalyst. There is also provided a process for etching copper and copper alloys with said etching solutions.
摘要翻译： 本发明提供了包含过氧硫酸盐与二嗪化合物的混合水溶液和作为催化剂加入的卤素化合物的铜和铜合金蚀刻溶液。 还提供了用所述蚀刻溶液蚀刻铜和铜合金的工艺。
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5.发明授权Method for stabilizing acidic aqueous hydrogen peroxide solution containing copper 失效用于稳定含有酸的酸性水性过氧化氢溶液的方法
公开(公告)号：US5211927A
公开(公告)日：1993-05-18
申请号：US798591
申请日：1991-11-26
申请人： Katsutoshi Itani , Yoko Miyashiro
发明人： Katsutoshi Itani , Yoko Miyashiro
IPC分类号： C01B15/037
CPC分类号： C01B15/037
摘要： An acidic aqueous hydrogen peroxide solution containing copper can be stabilized by adding an amino acid having the formula ##STR1## wherein Ar is an aromatic group.
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6.发明授权Etching solutions for copper and copper alloys and etching process using the same 失效铜和铜合金的蚀刻解决方案和使用它们的蚀刻工艺
公开(公告)号：US3939089A
公开(公告)日：1976-02-17
申请号：US510536
申请日：1974-09-30
申请人： Akira Matsumoto , Katsutoshi Itani
发明人： Akira Matsumoto , Katsutoshi Itani
CPC分类号： C23F1/18
摘要： This invention provides etching solutions for copper and copper alloys comprising a mixed aqueous solution of a peroxysulfate with a purine compound and a halogen compound added as the catalyst. There is also provided a process for etching copper or copper alloys with said etching solutions.
摘要翻译： 本发明提供铜和铜合金的蚀刻溶液，其包含过氧硫酸盐与嘌呤化合物的混合水溶液和作为催化剂加入的卤素化合物。 还提供了利用所述蚀刻溶液蚀刻铜或铜合金的工艺。
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