摘要:
An apparatus for treating an exhaust gas that includes a pre-treatment section that removes a powdery component, a water-soluble component or a hydrolytic component from the exhaust gas. The exhaust gas contains a fluorine compound and CO. A heating oxidative decomposing section performs heating oxidative decomposition of at least one of the fluorine compound and CO to detoxify the exhaust gas. The apparatus also has a post-treatment section for post-treating an acid gas such as HF which has been produced by the heating oxidative decomposition.
摘要:
The present invention relates to a method and apparatus for treating an exhaust gas containing a fluorine compound. A method according to the present invention includes heating the exhaust gas in the presence of O2, and then adding H2O to the exhaust gas to decompose or oxidize the fluorine compound. An apparatus according to the present invention includes a heating section (30) for heating the exhaust gas, an exhaust gas supply (11) for supplying the exhaust gas to the heating section (30), an H2O adding section (40) located just downstream of the heating section (30) for adding H2O to the exhaust gas by supplying H2O or H2 to the exhaust gas; and an acid gas removal section (13) for removing an acid gas produced by a reaction between the exhaust gas and H2O.
摘要翻译:本发明涉及一种处理含氟化合物的废气的方法和装置。 根据本发明的方法包括在O 2存在下加热废气,然后向排气中加入H 2 O 2以分解或氧化氟化合物 。 根据本发明的装置包括:用于加热废气的加热部分(30),用于将排气供应到加热部分(30)的排气供应源(11),H 2 O添加部分(40),其位于加热部分(30)的下游,用于通过提供H 2 O或H 2 O将H 2 O 2添加到排气中 SUB>到废气; 和用于除去由废气和H 2 O 2之间的反应产生的酸性气体的酸性气体去除部分(13)。
摘要:
An apparatus for treatment of a waste gas, containing fluorine-containing compounds, comprises: a solids treating device for separating solids from the waste gas; an addition device for adding H2 and/or H2O, or H2 and/or H2O and O2, as a decomposition assist gas to the waste gas leaving the solids treating device; a thermal decomposition device that is packed with γ-alumina heated at 600-900° C., and which thermally decomposes the waste gas to which the decomposition assist gas has been added; an acidic gas treating device for removing acidic gases from the thermally decomposed waste gas; and channels or lines for connecting these devices in sequence. The apparatus preferably includes an air ejector which is capable of adjusting an internal pressure of the apparatus.
摘要翻译:一种用于处理含有氟化合物的废气的设备,包括:用于从废气中分离固体的固体处理装置; 用于加入H 2和/或H 2 O,或H 2 H 2和/或H 2 H 2的加成装置, O和O 2作为离开固体处理装置的废气的分解辅助气体; 热分解装置,其被加热至600-900℃的γ-氧化铝填充,并且将分解辅助气体的废气热分解; 用于从热分解废气中除去酸性气体的酸性气体处理装置; 以及用于连接这些设备的通道或线路。 该装置优选地包括能够调节装置的内部压力的空气喷射器。
摘要:
An apparatus for treatment of a waste gas, containing fluorine-containing compounds, comprises: a solids treating device for separating solids from the waste gas; an addition device for adding H2 and/or H2O, or H2 and/or H2O and O2, as a decomposition assist gas to the waste gas leaving the solids treating device; a thermal decomposition device that is packed with γ-alumina heated at 600–900° C., and which thermally decomposes the waste gas to which the decomposition assist gas has been added; an acidic gas treating device for removing acidic gases from the thermally decomposed waste gas; and channels or lines for connecting these devices in sequence. The apparatus preferably includes an air ejector which is capable of adjusting an internal pressure of the apparatus.
摘要翻译:一种用于处理含有氟化合物的废气的设备,包括:用于从废气中分离固体的固体处理装置; 用于加入H 2和/或H 2 O,或H 2 H 2和/或H 2 H 2的加成装置, O和O 2作为离开固体处理装置的废气的分解辅助气体; 热分解装置,其被加热到600-900℃的γ-氧化铝填充,并且使分解辅助气体被加入的废气热分解; 用于从热分解废气中除去酸性气体的酸性气体处理装置; 以及用于连接这些设备的通道或线路。 该装置优选地包括能够调节装置的内部压力的空气喷射器。
摘要:
An exhaust system (2) is used for evacuating a chamber of a manufacturing apparatus (1) for manufacturing semiconductor devices, liquid crystal panels, LEDs, or solar cells. The exhaust system (2) includes a vacuum pump apparatus (3) for evacuating the chamber, an exhaust gas treatment apparatus (5) for treating an exhaust gas discharged from the chamber, and a controller (6) for controlling the vacuum pump apparatus (3) and/or the exhaust gas treatment apparatus (5). Information of operation process of the manufacturing apparatus (1), and the kind of gas and the flow rate of the gas supplied to the manufacturing apparatus (1) is inputted into the controller (6) to control the vacuum pump apparatus (3) and/or the exhaust gas treatment apparatus (5).
摘要:
An exhaust system (2) is used for evacuating a chamber of a manufacturing apparatus (1) for manufacturing semiconductor devices, liquid crystal panels, LEDs, or solar cells. The exhaust system (2) includes a vacuum pump apparatus (3) for evacuating the chamber, an exhaust gas treatment apparatus (5) for treating an exhaust gas discharged from the chamber, and a controller (6) for controlling the vacuum pump apparatus (3) and/or the exhaust gas treatment apparatus (5). Information of operation process of the manufacturing apparatus (1), and the kind of gas and the flow rate of the gas supplied to the manufacturing apparatus (1) is inputted into the controller (6) to control the vacuum pump apparatus (3) and/or the exhaust gas treatment apparatus (5).