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公开(公告)号:US20240328024A1
公开(公告)日:2024-10-03
申请号:US18193711
申请日:2023-03-31
申请人: Toyota Motor Engineering & Manufacturing North America, Inc. , The Board of Trustees of the University of Illinois
发明人: Sujan Dewanjee , Gaurav Singhal , Nenad Milijkovic , Paul Braun , Danny Lohan , Shailesh Joshi
摘要: In one embodiment, a method of fabricating a porous structure includes applying a first electroplating current at first current density for a first period of time, wherein the first electroplating current is a constant current, and applying a second electroplating current at a second current density for a second period of time following the first period of time, wherein the second electroplating current is a pulsed current and the first electroplating current and the second electroplating current grows the porous structure on a surface of the substrate.
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公开(公告)号:US20240332124A1
公开(公告)日:2024-10-03
申请号:US18129409
申请日:2023-03-31
申请人: Toyota Motor Engineering & Manufacturing North America, Inc. , The Board of Trustees of the University of Illinois
发明人: Sujan Dewanjee , Gaurav Singhal , Nenad Milijkovic , Paul V. Braun , Danny Lohan , Shailesh Joshi
IPC分类号: H01L23/373 , H01L21/311 , H01L21/3205
CPC分类号: H01L23/3736 , H01L21/31138 , H01L21/32051
摘要: Porous structures and processes for generating porous structures are disclosed. In one embodiment, a porous structure includes a target surface, a photoresist material deposited onto the target surface, and a metal electrodeposited onto the target surface and the photoresist material. An electrodeposition of metal generates a metal porous structure and the photoresist material is removed through reactive ion etching, generating at least one microchannel through the metal porous structure.
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