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公开(公告)号：US20230392275A1
公开(公告)日：2023-12-07
申请号：US18144482
申请日：2023-05-08
Applicant: THE BOEING COMPANY
Inventor： Vijaykumar S. IJERI , Om PRAKASH , Stephen P. GAYDOS
Abstract: In certain aspects, a coated steel substrate comprises a single or multiple-layer electroplated aluminum coating over a steel substrate. The multiple-layer electroplated aluminum coating comprises one or more porous layers and one or more compact layers. The one or more porous layers comprise a material selected from a group consisting of aluminum and aluminum alloys. The one or more compact layers comprise a material selected from a group consisting of aluminum and aluminum alloys. In certain aspects, a method of depositing a multiple-layer aluminum coating over a steel substrate includes electroplating one or more porous aluminum layers over the steel substrate. The one or more porous aluminum layers comprise a material selected from a group consisting of aluminum and aluminum alloys. One or more compact aluminum layers are electroplated over the steel substrate. The one or more compact aluminum layers comprise a material selected from a group consisting of aluminum and aluminum alloys.
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公开(公告)号：US11826981B2
公开(公告)日：2023-11-28
申请号：US18121125
申请日：2023-03-14
Applicant: THE BOEING COMPANY
Inventor： Stephen P. Gaydos , Vijaykumar S. Ijeri , Om Prakash , Shashi Kant Tiwari , Raghuvir Singh , Sharma Paswan , Lokesh C. Pathak
CPC classification number: B32B15/013 , C25D3/565 , C25D5/10 , C25D5/18 , C25D5/623 , B32B2250/42 , B32B2311/20
Abstract: The present disclosure provides electrolyte solutions for electrodeposition of zinc-manganese alloys, methods of forming electrolyte solutions, methods of electrodepositing zinc-manganese alloys, and multilayered zinc-manganese alloys. An electrolyte solution for electroplating can include a metal salt, boric acid, an alkali metal chloride, polyethylene glycol, and a hydroxy benzaldehyde. An electrolyte solution can be formed by dissolving a metal salt, boric acid, an alkali metal chloride, polyethylene glycol, and a hydroxy benzaldehyde in water or an aqueous solution. Electrodepositing zinc-manganese alloys on a substrate can include introducing a cathode and an anode into an electrolyte solution comprising a metal salt, boric acid, an alkali metal chloride, polyethylene glycol, and a hydroxy benzaldehyde. Electrodepositing can further include passing a current between the cathode and the anode through the electrolyte solution to deposit zinc and manganese onto the cathode.
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公开(公告)号：US20240349729A1
公开(公告)日：2024-10-24
申请号：US18683457
申请日：2022-04-12
Applicant: JOMOO KITCHEN & BATH CO., LTD
Inventor： Xiaofa LIN , Xiaoshan LIN , Xiaolong LIU , Xiaowei LIN , Dongliang PENG , Yining ZHANG
IPC: A01N59/16 , A01N25/34 , A01N33/12 , A01P1/00 , C25D3/08 , C25D3/12 , C25D5/00 , C25D5/14 , C25D5/34 , C25D5/56
CPC classification number: A01N59/16 , A01N25/34 , A01N33/12 , A01P1/00 , C25D3/08 , C25D3/12 , C25D5/14 , C25D5/34 , C25D5/56 , C25D5/605 , C25D5/623
Abstract: An antiviral environment-friendly composite plating layer, a preparation method therefor, and an antiviral environment-friendly product. The antiviral environment-friendly composite plating layer includes: a semi-bright nickel layer, a microporous nickel layer and an environment-friendly black chromium composite antiviral layer; the semi-bright nickel layer is provided on a base material having antiviral requirements; the microporous nickel layer is provided on the surface of the side of the semi-bright nickel layer away from the base material; the environment-friendly black chromium composite antiviral layer is provided on the surface of the side of the microporous nickel layer away from the base material; the environment-friendly black chromium composite antiviral layer has a nanoneedle structure and is formed by a composite raw material containing an antiviral ammonium salt, and the concentration of the antiviral ammonium salt in the composite raw material is 50-100 g/L.
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公开(公告)号：US20240328024A1
公开(公告)日：2024-10-03
申请号：US18193711
申请日：2023-03-31
Applicant: Toyota Motor Engineering & Manufacturing North America, Inc. , The Board of Trustees of the University of Illinois
Inventor： Sujan Dewanjee , Gaurav Singhal , Nenad Milijkovic , Paul Braun , Danny Lohan , Shailesh Joshi
Abstract: In one embodiment, a method of fabricating a porous structure includes applying a first electroplating current at first current density for a first period of time, wherein the first electroplating current is a constant current, and applying a second electroplating current at a second current density for a second period of time following the first period of time, wherein the second electroplating current is a pulsed current and the first electroplating current and the second electroplating current grows the porous structure on a surface of the substrate.
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公开(公告)号：US11760063B2
公开(公告)日：2023-09-19
申请号：US17260456
申请日：2019-07-19
Applicant: TOYO KOHAN CO., LTD.
Inventor： Shinichirou Horie , Etsuro Tsutsumi , Toshifumi Koyanagi , Koh Yoshioka
CPC classification number: B32B15/015 , C25D3/12 , C25D5/12 , C25D5/16 , C25D5/605 , C25D5/623 , C25D5/627 , C25D7/00 , B32B2307/406 , B32B2307/538 , B32B2307/72 , Y10T428/12944
Abstract: There is provided a roughened nickel-plated sheet having a roughened nickel layer as an outermost surface layer on at least one surface of a metal base material, wherein the brightness L* of the surface of the roughened nickel layer is 30 to 50, the glossiness of 85° of the surface of the roughened nickel layer is 1.5 to 50.
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Patent Agency Ranking
公开(公告)号：US11674235B2
公开(公告)日：2023-06-13
申请号：US16366064
申请日：2019-03-27
Applicant: Hutchinson Technology Incorporated
Inventor： Douglas P. Riemer , Peter F. Ladwig
IPC: C25D3/48 , C25D3/62 , C25D5/04 , C25D5/18 , C25D7/00 , H05K3/18 , H05K1/09 , C25D5/10 , C25D5/00
CPC classification number: C25D7/00 , C25D3/48 , H05K1/09 , H05K3/188 , C25D5/10 , C25D5/623 , H05K2201/0347 , H05K2203/0723
Abstract: A method of plating a copper substrate with gold that reduces or eliminates the presence of microvoids at the interface of the gold/copper substrate is described. Suitably, live entry of the substrate into the plating bath is performed with application of external current to the bath such that no portion of the substrate is exposed to the bath for more than one second without the application of the external current. Increase of the applied current for gold strike to the mass-transfer-limit for gold reduction accomplishes the full measure of improvement in eliminating microvoids.
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7.发明公开公开(公告)号：US20240300215A1
公开(公告)日：2024-09-12
申请号：US18279492
申请日：2022-03-02
Applicant: MITSUBISHI MATERIALS CORPORATION
Inventor： Daiki Furuyama , Takuma Katase , Kohei Otogawa , Junta Inoue
IPC: B32B15/01 , B22F1/054 , B22F1/17 , B32B15/20 , B32B37/06 , B32B37/16 , C25D5/00 , C25D7/06 , H01L23/00
CPC classification number: B32B15/01 , B22F1/054 , B22F1/17 , B32B15/20 , B32B37/06 , B32B37/16 , C25D5/623 , C25D7/0614 , H01L24/29 , H01L24/83 , B22F2301/10 , B32B2264/1055 , B32B2307/542 , B32B2307/748 , B32B2457/00 , H01L2224/29083 , H01L2224/29147 , H01L2224/83203
Abstract: This bonding sheet (10, 20) with a preform layer (13) is a bonding sheet (10, 20) for bonding a substrate (16) and an electronic component (17), the bonding sheet (10, 20) includes a copper sheet (11) and a porous preform layer (13) including copper particles (12) provided on one surface or both surfaces of the copper sheet (11), in which surfaces of the copper particles (12) are coated with copper nanoparticles (12a) having an average particle diameter smaller than an average particle diameter of the copper particles (12), the average particle diameter of the copper nanoparticles (12a) calculated from a BET value is 9.59 nm or more and 850 nm or less, and an average porosity of the preform layer (13) is 11% or more and 78% or less.
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公开(公告)号：US11761106B2
公开(公告)日：2023-09-19
申请号：US17384552
申请日：2021-07-23
Applicant: TOYODA GOSEI CO., LTD.
Inventor： Yuji Hotta , Koji Nakatani , Hiroaki Ono , Shiho Fujii , Noritake Isomura
CPC classification number: C25D3/06 , B32B15/043 , B32B15/082 , C23C18/1633 , C25D5/14 , C25D5/623 , C25D5/627 , B32B2250/05 , B32B2311/12 , B32B2311/22 , B32B2605/00 , B60R13/00
Abstract: A method for producing a black plated resin part includes the steps of electroplating a resin substrate provided with an underlying plating layer in a trivalent chromium plating bath containing thiocyanic acid, to thereby form, on the underlying plating layer, a black chromium plating layer composed of trivalent chromium and having a thickness of 0.15 μm or more; and immersing the resin substrate provided with the black chromium plating layer in warm water at 30° C. or higher for a predetermined time. In the method, the amount of thiocyanic acid contained in the trivalent chromium plating bath, the temperature of the warm water, and the time of immersion of the resin substrate in the warm water are adjusted so that the black chromium plating layer exhibits a b* value of −1.7 or less based on the L*a*b* color system.
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公开(公告)号：US20230211582A1
公开(公告)日：2023-07-06
申请号：US18121125
申请日：2023-03-14
Applicant: THE BOEING COMPANY
Inventor： Stephen P. GAYDOS , Vijaykumar S. IJERI , Om PRAKASH , Shashi Kant TIWARI , Raghuvir SINGH , Sharma PASWAN , Lokesh C. PATHAK
CPC classification number: B32B15/013 , C25D5/18 , C25D5/10 , C25D5/623 , C25D3/565 , B32B2311/20 , B32B2250/42
Abstract: The present disclosure provides electrolyte solutions for electrodeposition of zinc-manganese alloys, methods of forming electrolyte solutions, methods of electrodepositing zinc-manganese alloys, and multilayered zinc-manganese alloys. An electrolyte solution for electroplating can include a metal salt, boric acid, an alkali metal chloride, polyethylene glycol, and a hydroxy benzaldehyde. An electrolyte solution can be formed by dissolving a metal salt, boric acid, an alkali metal chloride, polyethylene glycol, and a hydroxy benzaldehyde in water or an aqueous solution. Electrodepositing zinc-manganese alloys on a substrate can include introducing a cathode and an anode into an electrolyte solution comprising a metal salt, boric acid, an alkali metal chloride, polyethylene glycol, and a hydroxy benzaldehyde. Electrodepositing can further include passing a current between the cathode and the anode through the electrolyte solution to deposit zinc and manganese onto the cathode.
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公开(公告)号：US11661665B2
公开(公告)日：2023-05-30
申请号：US16863282
申请日：2020-04-30
Applicant: THE BOEING COMPANY
Inventor： Vijaykumar S. Ijeri , Om Prakash , Stephen P. Gaydos
Abstract: In certain aspects, a coated steel substrate comprises a single or multiple-layer electroplated aluminum coating over a steel substrate. The multiple-layer electroplated aluminum coating comprises one or more porous layers and one or more compact layers. The one or more porous layers comprise a material selected from a group consisting of aluminum and aluminum alloys. The one or more compact layers comprise a material selected from a group consisting of aluminum and aluminum alloys. In certain aspects, a method of depositing a multiple-layer aluminum coating over a steel substrate includes electroplating one or more porous aluminum layers over the steel substrate. The one or more porous aluminum layers comprise a material selected from a group consisting of aluminum and aluminum alloys. One or more compact aluminum layers are electroplated over the steel substrate. The one or more compact aluminum layers comprise a material selected from a group consisting of aluminum and aluminum alloys.
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