公开(公告)号：US20140152177A1

公开(公告)日：2014-06-05

申请号：US14234187

申请日：2012-02-03

申请人： Tsugihiro Matsuda ,  Nobuyoshi Takeuchi ,  Yoshinori Kakuno ,  Masahiro Miki ,  Hideo Nagai ,  Takaari Uemoto

发明人： Tsugihiro Matsuda ,  Nobuyoshi Takeuchi ,  Yoshinori Kakuno ,  Masahiro Miki ,  Hideo Nagai ,  Takaari Uemoto

IPC分类号： F21K99/00

CPC分类号： F21K9/1355 ,  F21K9/23 ,  F21K9/232 ,  F21K9/238 ,  F21K9/90 ,  F21V19/003 ,  F21V23/006 ,  F21V29/15 ,  F21V29/507 ,  F21Y2115/10

摘要： In a lamp: an LED module and a circuit unit for lighting are housed within an envelope composed of a globe and a case; the LED module is attached to an end of an extension member that extends from a mount, which closes an opening at one end of the case, into the globe; the circuit unit is mounted inside the case; an insulation member disposed inside the case ensures insulation between the mount, which is made of metal, and the circuit unit; the insulation member has a bottomed cylinder portion inserted into the mount, and a protrusion portion formed on an outer circumference of the based cylinder portion that protrudes toward an inner surface of the mount; and the insulation member is attached to the mount by the protrusion portion pressing against the inner surface of the mount.

摘要翻译： 在灯中：用于照明的LED模块和电路单元容纳在由球体和壳体组成的信封内; LED模块附接到延伸构件的端部，该延伸构件从将壳体的一端封闭开口的安装件延伸到球体中; 电路单元安装在壳体内; 设置在壳体内的绝缘构件确保由金属制成的安装座与电路单元之间的绝缘; 所述绝缘构件具有插入所述安装件中的有底圆筒部分，以及形成在所述基座筒部的外周上朝向所述安装件的内表面突出的突出部分; 并且所述绝缘构件通过所述突出部分抵靠所述安装件的内表面附接到所述安装件。

公开(公告)号：US20130249381A1

公开(公告)日：2013-09-26

申请号：US13818314

申请日：2011-10-18

申请人： Nobuyoshi Takeuchi ,  Tsugihiro Matsuda ,  Hideo Nagai ,  Masahiro Miki ,  Takaari Uemoto ,  Yoshinori Kakuno

发明人： Nobuyoshi Takeuchi ,  Tsugihiro Matsuda ,  Hideo Nagai ,  Masahiro Miki ,  Takaari Uemoto ,  Yoshinori Kakuno

IPC分类号： H05B33/02

CPC分类号： H05B33/02 ,  F21K9/232 ,  F21V3/00 ,  F21V19/004 ,  F21Y2115/10 ,  H01L2224/45144 ,  H01L2224/48091 ,  H01L2224/48137 ,  H01L2224/49107 ,  H01L2224/73265 ,  H01L2924/181 ,  H01L2924/00014 ,  H01L2924/00012 ,  H01L2924/00

摘要： A light bulb shaped lamp includes: an LED module including: a base mount; and a semiconductor light-emitting device mounted on the base mount; and lead wires for supplying power to the LED module. The base mount is supported by the lead wires.

摘要翻译： 一种灯泡状灯，包括：LED模块，包括：基座; 以及安装在所述基座上的半导体发光装置; 以及用于向LED模块供电的导线。 底座由导线支撑。

公开(公告)号：US08981636B2

公开(公告)日：2015-03-17

申请号：US14234187

申请日：2012-02-03

申请人： Tsugihiro Matsuda ,  Nobuyoshi Takeuchi ,  Yoshinori Kakuno ,  Masahiro Miki ,  Hideo Nagai ,  Takaari Uemoto

发明人： Tsugihiro Matsuda ,  Nobuyoshi Takeuchi ,  Yoshinori Kakuno ,  Masahiro Miki ,  Hideo Nagai ,  Takaari Uemoto

IPC分类号： F21K99/00 ,  F21V23/00

CPC分类号： F21K9/1355 ,  F21K9/23 ,  F21K9/232 ,  F21K9/238 ,  F21K9/90 ,  F21V19/003 ,  F21V23/006 ,  F21V29/15 ,  F21V29/507 ,  F21Y2115/10

摘要： In a lamp: an LED module and a circuit unit for lighting are housed within an envelope composed of a globe and a case; the LED module is attached to an end of an extension member that extends from a mount, which closes an opening at one end of the case, into the globe; the circuit unit is mounted inside the case; an insulation member disposed inside the case ensures insulation between the mount, which is made of metal, and the circuit unit; the insulation member has a bottomed cylinder portion inserted into the mount, and a protrusion portion formed on an outer circumference of the based cylinder portion that protrudes toward an inner surface of the mount; and the insulation member is attached to the mount by the protrusion portion pressing against the inner surface of the mount.

摘要翻译： 在灯中：用于照明的LED模块和电路单元容纳在由球体和壳体组成的信封内; LED模块附接到延伸构件的端部，该延伸构件从将壳体的一端封闭开口的安装件延伸到球体中; 电路单元安装在壳体内; 设置在壳体内的绝缘构件确保由金属制成的安装座与电路单元之间的绝缘; 所述绝缘构件具有插入所述安装件中的有底圆筒部，以及形成在所述基座筒部的外周上朝向所述安装件的内表面突出的突出部; 并且所述绝缘构件通过所述突出部分抵靠所述安装件的内表面附接到所述安装件。

公开(公告)号：US09016900B2

公开(公告)日：2015-04-28

申请号：US13882204

申请日：2011-11-04

申请人： Nobuyoshi Takeuchi ,  Tsugihiro Matsuda ,  Hideo Nagai ,  Masahiro Miki ,  Takaari Uemoto

发明人： Nobuyoshi Takeuchi ,  Tsugihiro Matsuda ,  Hideo Nagai ,  Masahiro Miki ,  Takaari Uemoto

IPC分类号： F21V29/00 ,  F21V23/00 ,  F21K99/00 ,  F21V19/00 ,  F21Y101/02 ,  F21V3/04 ,  F21Y103/00 ,  F21Y105/00

CPC分类号： F21V23/002 ,  F21K9/232 ,  F21V3/061 ,  F21V19/003 ,  F21V23/001 ,  F21V29/85 ,  F21Y2103/10 ,  F21Y2105/10 ,  F21Y2115/10 ,  H01L2224/45144 ,  H01L2224/48091 ,  H01L2224/48137 ,  H01L2224/4903 ,  H01L2224/49107 ,  H01L2224/73265 ,  H01L2924/181 ,  H01L2924/19107 ,  H01L2924/00014 ,  H01L2924/00 ,  H01L2924/00012

摘要： A light bulb shaped lamp according to the present invention includes: a hollow globe; an LED module including a base platform and an LED chip mounted on the base platform, the LED module being provided in the globe; a lead wire for supplying power to the LED module; and a stem extending toward the interior of the globe, in which the base platform is directly fixed to the stem.

摘要翻译： 根据本发明的灯泡形灯包括：中空球体; LED模块，其包括基座平台和安装在所述基台上的LED芯片，所述LED模块设置在所述球体中; 用于向LED模块供电的引线; 以及朝向球体内部延伸的杆，其中基座平台直接固定到杆上。

公开(公告)号：US08911108B2

公开(公告)日：2014-12-16

申请号：US13818440

申请日：2011-10-14

申请人： Tsugihiro Matsuda ,  Nobuyoshi Takeuchi ,  Hideo Nagai ,  Masahiro Miki ,  Takaari Uemoto

发明人： Tsugihiro Matsuda ,  Nobuyoshi Takeuchi ,  Hideo Nagai ,  Masahiro Miki ,  Takaari Uemoto

IPC分类号： F21S4/00 ,  F21V15/01 ,  F21K99/00 ,  F21V25/02 ,  F21V3/00 ,  F21Y101/02 ,  F21Y103/00 ,  F21Y105/00 ,  H01L25/075

CPC分类号： F21V15/01 ,  F21K9/232 ,  F21V3/00 ,  F21V25/02 ,  F21Y2103/10 ,  F21Y2105/10 ,  F21Y2115/10 ,  H01L25/0753 ,  H01L2224/45144 ,  H01L2224/48137 ,  H01L2224/48463 ,  H01L2224/49107 ,  H01L2224/73265 ,  H01L2924/00

摘要： A light bulb shaped lamp includes: a hollow globe having an opening; an LED module having a base platform and an LED chip mounted on the base platform, the LED module being housed in the globe; a stem extending from the opening of the globe to the vicinity of the LED module; and a regulating component which regulates movement of the LED module with respect to the stem.

摘要翻译： 灯泡状灯包括：具有开口的中空球体; LED模块，其具有基座和安装在基座上的LED芯片，所述LED模块容纳在所述球体中; 从所述球体的开口延伸到所述LED模块附近的杆; 以及调节组件，其调节LED模块相对于杆的移动。

公开(公告)号：USD646810S1

公开(公告)日：2011-10-11

申请号：US29389739

申请日：2011-04-15

申请人： Nobuyoshi Takeuchi ,  Tsugihiro Matsuda ,  Masahiro Miki ,  Hideo Nagai ,  Takaari Uemoto

设计人： Nobuyoshi Takeuchi ,  Tsugihiro Matsuda ,  Masahiro Miki ,  Hideo Nagai ,  Takaari Uemoto

公开(公告)号：US08587011B2

公开(公告)日：2013-11-19

申请号：US13502662

申请日：2011-09-06

申请人： Tsugihiro Matsuda ,  Nobuyoshi Takeuchi ,  Hideo Nagai ,  Takaari Uemoto ,  Masahiro Miki ,  Atsushi Motoya

发明人： Tsugihiro Matsuda ,  Nobuyoshi Takeuchi ,  Hideo Nagai ,  Takaari Uemoto ,  Masahiro Miki ,  Atsushi Motoya

IPC分类号： H01L33/00

CPC分类号： H01L33/486 ,  F21K9/232 ,  F21V3/00 ,  F21Y2105/10 ,  F21Y2115/10 ,  H01L33/507 ,  H01L2924/0002 ,  H01L2933/0033 ,  H01L2924/00

摘要： A light-emitting device which emits light omnidirectionally is provided. A light-emitting device according to the present invention includes: a package which is translucent; an LED provided in a recess in the package; and a sealing member for sealing the LED and packaging the recess; and the recess includes a bottom surface on which the LED is mounted and a side surface surrounding a bottom surface, and light emitted by the LED is transmitted inside the package through the bottom surface and the side surface of the recess and is emitted to outside of the package from the back surface and the side surface of the package.

摘要翻译： 提供了全向发光的发光装置。 根据本发明的发光器件包括：半透明的封装; 设置在所述封装中的凹部中的LED; 以及用于密封LED并封装凹部的密封构件; 并且所述凹部包括其上安装有LED的底表面和围绕底表面的侧表面，并且由所述LED发射的光通过所述凹部的底表面和侧表面在所述封装内部传输并且被发射到 包装从包装的后表面和侧表面。

公开(公告)号：US08421111B2

公开(公告)日：2013-04-16

申请号：US13503242

申请日：2011-08-23

申请人： Tsugihiro Matsuda ,  Nobuyoshi Takeuchi ,  Hideo Nagai ,  Takaari Uemoto ,  Masahiro Miki ,  Atsushi Motoya

发明人： Tsugihiro Matsuda ,  Nobuyoshi Takeuchi ,  Hideo Nagai ,  Takaari Uemoto ,  Masahiro Miki ,  Atsushi Motoya

IPC分类号： H01L33/00

CPC分类号： H01L33/507 ,  F21K9/232 ,  F21V3/00 ,  F21Y2103/10 ,  F21Y2105/10 ,  F21Y2115/10 ,  H01L25/0753 ,  H01L33/486 ,  H01L33/505 ,  H01L33/508 ,  H01L2924/0002 ,  H01L2924/00012 ,  H01L2924/00

摘要： A light-emitting device including: a base which is translucent; a semiconductor light-emitting element provided on the base; a sealing member for sealing the semiconductor light-emitting element and including a first wavelength conversion material for converting a wavelength of light emitted by the semiconductor light-emitting element to a predetermined wavelength; and a groove provided on a side of the semiconductor light-emitting element, recessed from a top surface of the base on which the semiconductor light-emitting element is provided or a back surface of the base which is a surface opposite to the top surface, and for holding a second wavelength conversion material for converting the wavelength of the light emitted by the semiconductor light-emitting element to the predetermined wavelength.

摘要翻译： 一种发光器件，包括：半透明的基底; 设置在基座上的半导体发光元件; 用于密封半导体发光元件并且包括用于将由半导体发光元件发射的光的波长转换为预定波长的第一波长转换材料的密封构件; 以及设置在半导体发光元件的从设置有半导体发光元件的基座的顶面凹下的槽或与该顶面相反的表面的基座的后表面的槽， 并且用于保持用于将由半导体发光元件发射的光的波长转换为预定波长的第二波长转换材料。

公开(公告)号：US20120256538A1

公开(公告)日：2012-10-11

申请号：US13393397

申请日：2011-09-20

申请人： Nobuyoshi Takeuchi ,  Tsugihiro Matsuda ,  Hideo Nagai ,  Masahiro Miki ,  Takaari Uemoto

发明人： Nobuyoshi Takeuchi ,  Tsugihiro Matsuda ,  Hideo Nagai ,  Masahiro Miki ,  Takaari Uemoto

IPC分类号： H01L33/62 ,  H01L33/48

CPC分类号： F21K9/232 ,  F21V3/00 ,  F21Y2115/10 ,  H01L2224/45144 ,  H01L2224/48091 ,  H01L2224/48137 ,  H01L2224/49107 ,  H01L2224/4945 ,  H01L2224/73265 ,  H01L2924/00014 ,  H01L2924/00

摘要： A light-emitting device capable of effectively dissipating heat generated at an LED is provided. The light-emitting device according to the present invention includes: a base board and an LED chip mounted on the base board. The base board is a translucent base board made of a polycrystalline ceramic. A main region of the base board includes an element mounted region on which the LED chip is mounted, and an average grain size of the polycrystalline ceramic in the main region is between 10 μm and 40 μm inclusive. An end portion region of said base board is a region around an end portion, and an average grain size of the polycrystalline ceramic in the end portion region is preferably smaller than an average grain size of the polycrystalline ceramic in the element mounted region.

摘要翻译： 提供能够有效散发在LED产生的热量的发光装置。 根据本发明的发光装置包括：基板和安装在基板上的LED芯片。 基板是由多晶陶瓷制成的半透明基板。 基板的主区域包括安装有LED芯片的元件安装区域，并且主区域中的多晶陶瓷的平均晶粒尺寸在10μm和40μm之间。 所述基板的端部区域是端部周围的区域，并且端部区域中的多晶陶瓷的平均粒径优选小于元件安装区域中的多晶陶瓷的平均粒径。

公开(公告)号：US20120235181A1

公开(公告)日：2012-09-20

申请号：US13503242

申请日：2011-08-23

申请人： Tsugihiro Matsuda ,  Nobuyoshi Takeuchi ,  Hideo Nagai ,  Takaari Uemoto ,  Masahiro Miki ,  Atsushi Motoya

发明人： Tsugihiro Matsuda ,  Nobuyoshi Takeuchi ,  Hideo Nagai ,  Takaari Uemoto ,  Masahiro Miki ,  Atsushi Motoya

IPC分类号： H01L33/08

CPC分类号： H01L33/507 ,  F21K9/232 ,  F21V3/00 ,  F21Y2103/10 ,  F21Y2105/10 ,  F21Y2115/10 ,  H01L25/0753 ,  H01L33/486 ,  H01L33/505 ,  H01L33/508 ,  H01L2924/0002 ,  H01L2924/00012 ,  H01L2924/00

摘要： A light-emitting device including: a base which is translucent; a semiconductor light-emitting element provided on the base; a sealing member for sealing the semiconductor light-emitting element and including a first wavelength conversion material for converting a wavelength of light emitted by the semiconductor light-emitting element to a predetermined wavelength; and a groove provided on a side of the semiconductor light-emitting element, recessed from a top surface of the base on which the semiconductor light-emitting element is provided or a back surface of the base which is a surface opposite to the top surface, and for holding a second wavelength conversion material for converting the wavelength of the light emitted by the semiconductor light-emitting element to the predetermined wavelength.

摘要翻译： 一种发光器件，包括：半透明的基底; 设置在基座上的半导体发光元件; 用于密封半导体发光元件并且包括用于将由半导体发光元件发射的光的波长转换为预定波长的第一波长转换材料的密封构件; 以及设置在半导体发光元件的从设置有半导体发光元件的基座的顶面凹下的槽或与该顶面相反的表面的基座的后表面的槽， 并且用于保持用于将由半导体发光元件发射的光的波长转换为预定波长的第二波长转换材料。