Positive resist composition and method of pattern formation using the same
    4.
    发明授权
    Positive resist composition and method of pattern formation using the same 有权
    正型抗蚀剂组合物和使用其的图案形成方法

    公开(公告)号:US07252924B2

    公开(公告)日:2007-08-07

    申请号:US10801723

    申请日:2004-03-17

    IPC分类号: G03F7/00 G03F7/004

    摘要: A positive resist composition comprising: at least two resins which differ in glass transition temperature by at least 5° C.; and a compound which generates an acid upon irradiation with actinic rays or radiation, wherein each of the two resins comprises at least either of a repeating unit derived from an acrylic acid derivative monomer and a repeating unit derived from an methacrylic acid derivative monomer and further comprises an alicyclic structure and at least one group that increases a solubility of the resin in alkaline developer by the action of an acid.

    摘要翻译: 一种正型抗蚀剂组合物,其包含:玻璃化转变温度不同至少5℃的至少两种树脂; 以及在用光化射线或辐射照射时产生酸的化合物,其中两种树脂中的每一种包含衍生自丙烯酸衍生物单体的重复单元和衍生自甲基丙烯酸衍生物单体的重复单元中的至少一种,并且还包含 脂环结构和至少一个通过酸作用增加树脂在碱性显影剂中的溶解度的基团。

    Photosensitive resin composition, production method of cured relief pattern using the same and semiconductor device
    7.
    发明授权
    Photosensitive resin composition, production method of cured relief pattern using the same and semiconductor device 有权
    感光树脂组合物,使用其的固化浮雕图案的制造方法以及半导体装置

    公开(公告)号:US07615331B2

    公开(公告)日:2009-11-10

    申请号:US11851751

    申请日:2007-09-07

    IPC分类号: G03F7/004 G03F7/30

    CPC分类号: G03F7/0392 G03F7/40

    摘要: A photosensitive resin composition contains: a polymer represented by the formula (I) as defined herein, in which 0.5 mol % or more of A in the polymer represented by the formula (I) is a protective group; a photosensitizing agent; a compound containing a methacryloyl or acryloyl group within a molecule of the compound; and a solvent.

    摘要翻译: 感光性树脂组合物含有:由式(I)表示的聚合物中的0.5mol%以上的A为保护基的式(I)所示的聚合物, 光敏剂; 在化合物的分子内含有甲基丙烯酰基或丙烯酰基的化合物的化合物; 和溶剂。