摘要:
A metal oxide semiconductor field effect transistor structure is disclosed. A p-shape gate, disposed over a semiconductor substrate. A gate dielectric layer is disposed in between the p-shape gate and the semiconductor substrate. A drain region is disposed within the semiconductor substrate, wherein the drain region is surrounded by the p-shape gate. A source region is disposed within the semiconductor substrate, wherein the source region surrounds the p-shape gate. A silicide structure is disposed on the source/drain regions and the p-shape gate.
摘要:
A circuit structure for measuring a capacitive load. The capacitive load is coupled between a first and a second nodes, and drains of a first PMOS and a first NMOS transistors are coupled to the first node, and drains of a second PMOS and a second NMOS transistors are coupled to the second node, and a pad is coupled to the second node. First, sources of the first and the second PMOS transistors and sources of the first and the second NMOS transistors are biased at a power source and a ground respectively. A non-synchronized voltage is applied to gates of the first and the second PMOS transistors and to gates of the first and the second NMOS transistors simultaneously. By grounding and floating the pad, a current flowing through the capacitive load is obtained to calculate the capacitance.
摘要:
A non-volatile memory and a manufacturing method thereof are provided. The non-volatile memory includes a substrate, a gate structure, a first doped region, a second doped region and a pair of isolation structures. The gate structure is disposed on the substrate. The gate structure includes a charge storage structure, a gate and spacers. The charge storage structure is disposed on the substrate. The gate is disposed on the charge storage structure. The spacers are disposed on the sidewalls of the gate and the charge storage structure. The first doped region and the second doped region are respectively disposed in the substrate at two sides of the charge storage structure and at least located under the spacers. The isolation structures are respectively disposed in the substrate at two sides of the gate structure.
摘要:
An electrostatic discharge (ESD) protection device electronically connected to a pad is provided. The ESD protection device includes K PNP transistors and a protection circuit, wherein K is a positive integer. An emitter of the 1st PNP transistor is electronically connected to the pad, a base of the ith PNP transistor is electronically connected to an emitter of the (i+1)th PNP transistor, and collectors of the K PNP transistors are electronically connected to a ground, wherein i is an integer and 1≦i≦(K−1). The protection circuit is electronically connected between a base of the Kth PNP transistor and the ground and provides a discharge path. An electrostatic signal from the pad is conducted to the ground through the discharge path and the K PNP transistors.
摘要:
An operation method of a non-volatile memory suitable for a multi-level cell having a first storage position and a second storage position is provided. The operation method includes: setting a main voltage distribution group and a plurality of secondary voltage distribution groups, wherein each of the main voltage distribution group and the secondary voltage distribution groups includes N threshold-voltage distribution curves, and N is an integer greater than 2; selecting a first operation level and a second operation level according to a programming command; programming the first storage position according to the threshold-voltage distribution curve corresponding to the first operation level in the main voltage distribution group; selecting one of the secondary voltage distribution groups according to the first operation level and programming the second storage position according to the threshold-voltage distribution curve corresponding to the second operation level in the selected secondary voltage distribution group.
摘要:
An operation method of a non-volatile memory suitable for a multi-level cell having a first storage position and a second storage position is provided. The operation method includes: setting N threshold-voltage distribution curves, wherein the N threshold-voltage distribution curves correspond to N levels and N is an integer greater than 2; programming the first and the second storage positions to the 1st level and an auxiliary level respectively according to the 1st threshold-voltage distribution curve and a threshold-voltage auxiliary curve when the first and the second storage positions are programmed to the 1st and Nth levels; and programming the first and the second storage positions to the ith level according to the ith threshold-voltage distribution curve when the first and the second storage positions are not to be programmed to the 1st and Nth levels, wherein i is an integer and 1≦i≦N.
摘要:
A flash memory and a manufacturing method and an operating method thereof are provided. The flash memory includes a substrate, a charge-trapping structure, a first gate, a second gate, a third gate, a first doped region and a second doped region. The substrate has a protrusion portion. The charge-trapping structure is disposed over the substrate. The first gate and the second gate are disposed respectively over the charge-trapping structure at two sides of the protrusion portion. The top surfaces of the first gate and the second gate are lower than the top surface of the charge-trapping structure located on the top of the protrusion portion. The third gate is disposed over the charge-trapping structure located on the top of the protrusion portion. The first doped region and the second doped region are disposed respectively in the substrate at two sides of the protrusion portion.
摘要:
The memory device is described, which includes a substrate, a conductive layer, a plurality of charge storage layers and a plurality of doped regions. The substrate has a plurality of trenches formed therein. The conductive layer is disposed on the substrate and fills the trenches. The charge storage layers are disposed between the substrate and the conductive layer in the trenches respectively, wherein the charge storage layers are separated from each other. The doped regions are configured in the substrate under bottoms of the trenches, respectively.
摘要:
A method for measuring intrinsic capacitance of a MOS device is provided. The MOS device includes a first terminal, a second terminal, a third terminal and a fourth terminal. First, provide a first input signal to the second terminal and ground the third terminal and fourth terminal. Then, charge the first terminal and measure a first current required for charging the first terminal. Afterward, provide a second input signal to the second terminal, ground the third terminal and the fourth terminal, and measure a second current required for charging the first terminal, wherein the first input signal and the second input signal have the same low level, but different high levels. Finally, determine intrinsic capacitance between the first terminal and the second terminal according to the first current, the second current and a high level difference between the first input signal and the second input signal.
摘要:
A method of reading a dual-bit memory cell includes a controlling terminal, a first terminal, and a second terminal. The dual-bit memory cell has a first bit storage node and a second bit storage node near the first terminal and the second terminal respectively. First, a controlling voltage and a read voltage are applied to the controlling terminal and the first terminal respectively. The second terminal is grounded to measure a first output current value of the first terminal. Then, the controlling voltage and the read voltage are applied to the controlling terminal and the second terminal respectively. The first terminal is grounded to measure a second output current value of the second terminal. Afterward, the bit state of the first bit storage node and the bit state of the second bit storage node is read simultaneously according to the first output current value and the second output current value.