公开(公告)号：US5534785A

公开(公告)日：1996-07-09

申请号：US495149

申请日：1995-06-27

申请人： Tsutomu Yoshizaki ,  Shigeyuki Maruyama ,  Tsuyoshi Ohno

发明人： Tsutomu Yoshizaki ,  Shigeyuki Maruyama ,  Tsuyoshi Ohno

IPC分类号： H01L21/66 ,  B65D85/30 ,  G01R1/04 ,  H01L23/12 ,  H01L23/32 ,  G01R1/073 ,  G01R31/02

CPC分类号： G01R1/0483

摘要： An IC bare chip carrier installs an IC bare chip for performing a burn-in test and a functional examination of the bare chip. The carrier consists of an installing unit for installing the bare chip and an interconnecting unit for electrically interconnecting chip electrodes of the bare chip with output electrodes of the interconnecting unit, to be connected to apparatus for the burn-in test and the functional examination. The installing unit is made of aluminium nitride having an expansion rate near of material, ceramic, of the IC bare chip, for making fabrication of installing surface of the IC bare chip easy. The interconnecting unit has an air exchange mechanism by which the IC bare chip can be laid in a space, made by combining the installing unit and the interconnecting unit, constantly filled with inert gas such as nitrogen. The IC bare chip is transported anytime and anywhere as installed in the carrier without being contaminated.

摘要翻译： IC裸芯片载体安装用于进行裸芯片的老化测试和功能检查的IC裸芯片。 载体由用于安装裸芯片的安装单元和用于将裸芯片的芯片电极与互连单元的输出电极互连的互连单元连接到用于老化测试和功能检查的设备。 该安装单元由具有IC裸芯片材料（陶瓷）附近的膨胀率的氮化铝制成，用于制造IC裸芯片的安装表面。 互连单元具有空气交换机构，通过该空气交换机构，IC裸芯片可以放置在通过组合安装单元和互连单元而形成的空间中，该空间不断地填充有惰性气体例如氮气。 集成电路裸芯片随时随地运送到载体上，不受污染。

公开(公告)号：US4717346A

公开(公告)日：1988-01-05

申请号：US942015

申请日：1986-12-12

申请人： Tsutomu Yoshizaki

发明人： Tsutomu Yoshizaki

IPC分类号： H05K7/10 ,  H01R9/09

CPC分类号： H05K7/1023

摘要： An integrated circuit (IC) socket comprising: a socket body of molded resin having a plurality of recesses for receiving a leadless chip carrier (LCC) type of IC device; and a cover which commonly covers the plurality of recesses for receiving an LCC type of IC device and presses said LCC type of IC device.

摘要翻译： 一种集成电路（IC）插座，包括：具有多个凹部的模制树脂插座体，用于接收无引线芯片载体（LCC）类型的IC器件; 以及通常覆盖用于接收LCC型IC器件的多个凹部并按压所述LCC型IC器件的盖。

公开(公告)号：US4616895A

公开(公告)日：1986-10-14

申请号：US774182

申请日：1985-09-09

申请人： Tsutomu Yoshizaki ,  Toshimasa Ishii

发明人： Tsutomu Yoshizaki ,  Toshimasa Ishii

IPC分类号： H01L23/32 ,  H05K7/10 ,  H01R13/627

CPC分类号： H05K7/1069

摘要： An integrated circuit (IC) socket comprising: a box-shaped housing of dielectric material open at the upper side thereof and having a recess for receiving a leadless chip carrier type of IC device; a plurality of contacts for contacting the electrodes of the IC device within the recess, each of the contacts comprising a springy conductive member and being disposed in the bottom of the housing so as to contact the electrodes formed in the bottom surface of the IC device; and two pairs of pressing members arranged at opposite corners for holding the IC device within the recess, each member comprising a springy member and a projection formed at the top end of the springy member for pressing the IC device. The projections on the pressing members are semicircular-shaped to permit easy insertion and removal, and to maintain downward pressure.

摘要翻译： 一种集成电路（IC）插座，包括：介质材料的盒形壳体，其上侧开口并具有用于接收无引线芯片载体型IC器件的凹部; 多个触点，用于接触凹槽内的IC器件的电极，每个触点包括弹性导电构件，并且设置在壳体的底部，以便与形成在IC器件的底表面中的电极接触; 以及两对按压构件，其布置在相对的拐角处，用于将IC器件保持在凹槽内，每个构件包括弹性构件和形成在弹性构件顶端的突起，用于按压IC器件。 按压构件上的突起是半圆形的，以允许容易的插入和移除，并保持向下的压力。

公开(公告)号：US4468616A

公开(公告)日：1984-08-28

申请号：US296312

申请日：1981-08-26

申请人： Tsutomu Yoshizaki

发明人： Tsutomu Yoshizaki

IPC分类号： G01R31/26 ,  G01R31/28 ,  G01R31/00

CPC分类号： G01R31/2862 ,  G01R31/2642

摘要： Testing equipment for electric components comprises: a high-temperature section including a homoiothermic chamber in which a plurality of components to be tested are heated, and a first printed board on which the components to be tested are mounted; a low-temperature section including a driving circuit for the components to be tested, a second printed board on which the driving ciruit is mounted, and electric power sources; and a connecting unit for electrical connection between the high-temperature and low-temperature sections. The connecting unit comprises: a third printed board disposed outside the homoiothermic chamber, a first surface of the third printed board facing the wall of the homoiothermic chamber with a space therebetween; a first connector jack mounted on the first surface of the third printed board through electrical conductor pins; and a second connector jack mounted on the second surface of the third printed board. The first and second printed boards are connected to the first and second connector jacks, respectively, and the electric power sources are connected to the third printed board.

摘要翻译： 用于电气部件的测试设备包括：包括其中多个待测试部件被加热的均热室的高温部分和安装有待测试部件的第一印刷板; 包括用于待测试部件的驱动电路的低温部分，安装有驱动电路的第二印刷电路板和电源; 以及用于在高温部分和低温部分之间进行电连接的连接单元。 连接单元包括：布置在均热室外部的第三印刷板，第三印刷板的面向均热室的壁的第一表面，其间具有空间; 第一连接器插座，通过电导体销安装在第三印刷电路板的第一表面上; 以及安装在第三印刷电路板的第二表面上的第二连接器插座。 第一和第二印刷电路板分别连接到第一和第二连接器插座，并且电源连接到第三印刷电路板。