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    Article with Composite Shield and Process of Producing an Article with a Composite Shield
    1.
    发明申请
    Article with Composite Shield and Process of Producing an Article with a Composite Shield 审中-公开
    具有复合盾牌的文章和制作具有复合盾牌的物品的过程

    公开(公告)号：US20160300638A1

    公开(公告)日：2016-10-13

    申请号：US14684266

    申请日：2015-04-10

    申请人： Tyco Electronics Corporation ,  Tyco Electronics UK Ltd.

    发明人： Jialing Wang ,  Erling Hansen ,  Mark F. Wartenberg ,  Jennifer L. Robison ,  Sreeni Kurup ,  Richard B. Lloyd ,  Ting Gao

    IPC分类号： H01B1/24 ,  H01B1/22 ,  H05K9/00 ,  B29C47/00 ,  B29C47/06

    CPC分类号： H01B1/24 ,  B29C48/022 ,  B29C48/10 ,  B29C48/21 ,  B29K2105/0023 ,  B29K2995/0005 ,  B29L2031/3462 ,  H01B1/22 ,  H05K9/0098

    摘要： An article and process are described. The article includes a conductive heat-recoverable composite shield or a conductive heat-recovered composite shield formed from a conductive heat-recoverable composite shield. The conductive composite shield and/or the conductive heat-recovered composite shield formed from a conductive heat-recoverable composite shield comprises a non-conductive matrix and conductive particles within the non-conductive matrix. The article has a resistivity of less than 0.05 ohm·cm. A process of producing the conductive heat-recovered composite shield includes extruding the conductive heat-recoverable composite shield and heating the conductive heat-recoverable composite shield thereby forming the conductive heat-recovered composite shield.

    摘要翻译： 描述了一个文章和过程。 该物品包括由导热性可回收复合护罩形成的导热性可回收复合屏蔽层或导电性热回收复合屏蔽层。 导电复合屏蔽层和/或由导电热恢复复合屏蔽层形成的导电热回收复合屏蔽包括非导电基体和非导电基体内的导电颗粒。 该物品的电阻率小于0.05欧姆·厘米。 导电性热回收复合屏蔽体的制造方法包括：挤出导电性可热成膜复合屏蔽体，对导热性复合屏蔽层进行加热，形成导电性热回收复合屏蔽体。

    Composite Formulation and Composite Product
    2.
    发明申请
    Composite Formulation and Composite Product 审中-公开
    复合制剂及复合制品

    公开(公告)号：US20160012933A1

    公开(公告)日：2016-01-14

    申请号：US14329654

    申请日：2014-07-11

    申请人： Tyco Electronics Corporation

    发明人： Jaydip Das ,  Ting Gao ,  Jialing Wang ,  Nicola Pugliano ,  Kavitha Bharadwaj ,  Richard B. Lloyd

    IPC分类号： H01B1/22

    CPC分类号： H01B1/22 ,  C08K3/08 ,  C08K7/00 ,  C08K7/06 ,  C08K2003/085

    摘要： A composite formulation and composite product are disclosed. The composite formulation includes a polymer matrix, tin-containing particles blended within the polymer matrix at a concentration, by weight, of at least 25%, copper-containing particles blended within the polymer matrix at a concentration, by weight, of at least 40%, and one or both of solder flux and density-lowering particles blended into the polymer matrix. The tin-containing particles and the copper-containing particles have one or more intermetallic phases from metal-metal diffusion of the tin-containing particles and the copper-containing particles being blended at a temperature within the intermetallic annealing temperature range for the tin-containing particles and the copper-containing particles.

    摘要翻译： 公开了复合制剂和复合产品。 复合制剂包括聚合物基质，在聚合物基质内以至少25％的重量浓度共混在含有聚合物基质中的含铜颗粒，其浓度为至少40重量％ ％，以及掺入聚合物基质中的焊剂和降低密度的颗粒中的一种或两种。 含锡颗粒和含铜颗粒在含锡颗粒的金属 - 金属扩散之间具有一个或多个金属间相，并且含铜颗粒在含锡的金属间退火温度范围内的温度下混合 颗粒和含铜颗粒。

    Composite formulation and composite article
    3.
    发明授权
    Composite formulation and composite article 有权

    公开(公告)号：US10485149B2

    公开(公告)日：2019-11-19

    申请号：US15275100

    申请日：2016-09-23

    申请人： Tyco Electronics Corporation

    发明人： Megan Hoarfrost Beers ,  Jialing Wang ,  Jaydip Das ,  Richard B. Lloyd ,  James Toth ,  Ting Gao

    IPC分类号： H05K9/00 ,  B32B27/08 ,  B32B27/20 ,  B32B27/30 ,  B32B27/34 ,  C08K3/08 ,  C08K9/10 ,  C08K7/00 ,  H01B1/22

    摘要： A composite formulation and a composite article are provided. The composite article includes at least two layers of a composite formulation including a polymer matrix and conductive particles distributed within the polymer matrix, the conductive particles forming, by volume, between 20% and 50% of the composite formulation. The conductive particles in each of the at least two layers include at least one morphology selected from the group consisting of fibrous, dendritic, and flake, and the morphology of the conductive particles in one of the at least two layers differs from the morphology of the conductive particles in another one of the at least two layers. The composite formulation includes a polymer matrix and between 30% and 45%, by volume, tin-coated copper conductive particles at a copper/tin ratio of between 3/1 and 3/2, the conductive particles including at least two morphologies selected from the group consisting of fibrous, dendritic, and flake.

    Electrical Device
    4.
    发明申请
    Electrical Device 有权
    电气设备

    公开(公告)号：US20160042845A1

    公开(公告)日：2016-02-11

    申请号：US14796644

    申请日：2015-07-10

    申请人： Tyco Electronics Corporation

    发明人： Jaydip Das ,  Ting Gao ,  Nicola Pugliano ,  Mark F. Wartenberg ,  Diane G. Bigler ,  Mario G. Sepulveda ,  Kavitha Bharadwaj ,  Richard B. Lloyd

    IPC分类号： H01C7/02 ,  H01C17/00 ,  H01C1/14

    CPC分类号： H01C7/028 ,  C09J9/02 ,  H01B1/22 ,  H01C1/1406 ,  H01C7/027 ,  H01C17/00 ,  H01C17/06526 ,  H01C17/06586

    摘要： An electrical device having first and second electrodes and a layer of a conductive composite electrically in contact with the first and second electrodes. The conductive composite is a mixture of a semi-crystalline polymer and a conductive filler, the conductive filler including a plurality of particles containing an inner material including a first metal; and an outer material surrounding the inner material, the outer material including a second metal; and an intermetallic compound formed between the inner material and the outer material. The intermetallic compound has features from the inner material and the outer material. The device can be a circuit protection device. Also provided is a method of making a conductive composite by dry mixing the components.

    摘要翻译： 一种具有第一和第二电极的电气装置和与第一和第二电极电接触的导电复合层。 所述导电复合材料是半结晶聚合物和导电填料的混合物，所述导电填料包括含有包含第一金属的内部材料的多个颗粒; 以及包围所述内部材料的外部材料，所述外部材料包括第二金属; 以及在内部材料和外部材料之间形成的金属间化合物。 金属间化合物具有内部材料和外部材料的特征。 该装置可以是电路保护装置。 还提供了通过干燥混合组分制备导电复合材料的方法。

    Cable Shielding Assembly and Process of Producing Cable Shielding Assembly
    6.
    发明申请
    Cable Shielding Assembly and Process of Producing Cable Shielding Assembly 审中-公开
    电缆屏蔽组件及电缆屏蔽组件生产工艺

    公开(公告)号：US20160302334A1

    公开(公告)日：2016-10-13

    申请号：US14684276

    申请日：2015-04-10

    申请人： Tyco Electronics Corporation

    发明人： Jialing Wang ,  Richard B. Lloyd ,  Ting Gao ,  Jaydip Das

    IPC分类号： H05K9/00 ,  H01B13/22 ,  H01B3/00 ,  H01B7/02 ,  H01B3/30

    CPC分类号： H05K9/0098 ,  H01B1/22 ,  H01B1/24 ,  H01B3/004 ,  H01B3/30 ,  H01B7/0216 ,  H01B11/1066 ,  H01B11/1808 ,  H01B13/22 ,  H01P3/06

    摘要： Cable shielding assemblies and processes of producing cable shielding assemblies are described. The cable shielding assemblies include a conductor and a conductive composite shield extending around at least a portion of the conductor, the conductive composite shield having a non-conductive matrix and conductive particles within the non-conductive matrix. The conductive composite shield has a resistivity of less than 0.05 ohm·cm. The processes of producing cable shielding assembles include positioning the conductive composite shield. The positioning is at least partially around a conductor, at least partially around a dielectric material, at least partially surrounded by a jacket material, or a combination thereof.

    摘要翻译： 描述了制造电缆屏蔽组件的电缆屏蔽组件和工艺。 电缆屏蔽组件包括导体和围绕导体的至少一部分延伸的导电复合屏蔽件，导电复合屏蔽件具有非导电矩阵和非导电矩阵内的导电颗粒。 导电复合屏蔽层的电阻率小于0.05欧姆·厘米。 制造电缆屏蔽组件的过程包括定位导电复合屏蔽。 该定位至少部分地围绕导体，至少部分地围绕电介质材料，至少部分地被护套材料包围，或其组合。