公开(公告)号：US20170100916A1

公开(公告)日：2017-04-13

申请号：US14881041

申请日：2015-10-12

申请人： Tyco Electronics Corporation ,  TE Connectivity Germany GmbH

发明人： Lavanya Bharadwaj ,  Barry C. Mathews ,  Dominique Freckmann ,  Shallu Soneja ,  Michael A. Oar ,  Gokce Gulsoy ,  Helge Schmidt ,  Michael Leidner ,  Soenke Sachs

IPC分类号： B32B15/04 ,  B32B37/08 ,  B32B37/06

CPC分类号： B32B15/04 ,  B32B37/06 ,  B32B37/08 ,  B32B2307/554 ,  B32B2457/00 ,  H01L21/324 ,  H05K1/0207 ,  H05K3/125 ,  H05K2203/092 ,  H05K2203/1131

摘要： Electronic components and processes of producing electronic components are disclosed. The electronic component includes a substrate and a thermal grain modified layer positioned on the substrate. The thermal grain modified layer includes a modified grain structure. The modified grain structure includes a thermal grain modification additive. A method for forming the electronic component is also disclosed.

公开(公告)号：US10933675B2

公开(公告)日：2021-03-02

申请号：US16185841

申请日：2018-11-09

申请人： TE Connectivity Corporation ,  TE Connectivity Germany GmbH ,  Tyco Electronics (Shanghai) Co. Ltd.

发明人： Shallu Soneja ,  Gokce Gulsoy ,  Yiliang Wu ,  Xiao Zhou ,  Helge Schmidt ,  Soenke Sachs ,  Felix Greiner

IPC分类号： B23K26/00 ,  B41M3/00 ,  B23K1/00 ,  B23K1/005 ,  B23K26/354 ,  B23K3/06 ,  B23K1/20 ,  B23K1/19 ,  B23K103/10 ,  B23K101/42 ,  B23K103/08

摘要： A method of producing a solderable aluminum contact comprises formulating an ink, applying the ink to an aluminum substrate to form an ink layer on a surface of the aluminum substrate, and melting the ink layer. The ink includes a solderable element that is conductive. The melting of the ink layer forms an alloy on the surface of the aluminum substrate including the solderable element.

公开(公告)号：US20170326841A1

公开(公告)日：2017-11-16

申请号：US15663608

申请日：2017-07-28

申请人： TE Connectivity Corporation ,  TE Connectivity Germany GmbH

发明人： Lavanya Bharadwaj ,  Barry C. Mathews ,  Dominique Freckmann ,  Shallu Soneja ,  Michael A. Oar ,  Gokce Gulsoy ,  Helge Schmidt ,  Michael Leidner ,  Soenke Sachs

IPC分类号： B32B15/04 ,  B32B37/06 ,  H05K1/02 ,  H01L21/324 ,  B32B37/08 ,  H05K3/12

CPC分类号： B32B15/04 ,  B32B37/06 ,  B32B37/08 ,  B32B2307/554 ,  B32B2457/00 ,  H01L21/324 ,  H05K1/0207 ,  H05K3/125 ,  H05K2203/092 ,  H05K2203/1131

摘要： Electronic components and processes of producing electronic components are disclosed. The electronic component includes a substrate and a thermal grain modified layer positioned on the substrate. The thermal grain modified layer includes a modified grain structure. The modified grain structure includes a thermal grain modification additive. A method for forming the electronic component is also disclosed.

公开(公告)号：US20190143726A1

公开(公告)日：2019-05-16

申请号：US16185841

申请日：2018-11-09

申请人： TE Connectivity Corporation ,  TE Connectivity Germany GmbH ,  Tyco Electronics (Shanghai) Co. Ltd.

发明人： Shallu Soneja ,  Gokce Gulsoy ,  Yiliang Wu ,  Xiao Zhou ,  Helge Schmidt ,  Soenke Sachs ,  Felix Greiner

IPC分类号： B41M3/00 ,  B23K1/00

摘要： A method of producing a solderable aluminum contact comprises formulating an ink, applying the ink to an aluminum substrate to form an ink layer on a surface of the aluminum substrate, and melting the ink layer. The ink includes a solderable element that is conductive. The melting of the ink layer forms an alloy on the surface of the aluminum substrate including the solderable element.

公开(公告)号：US20170105287A1

公开(公告)日：2017-04-13

申请号：US14881034

申请日：2015-10-12

申请人： Tyco Electronics Corporation

发明人： Michael A. Oar ,  Shallu Soneja ,  Gokce Gulsoy

IPC分类号： H05K3/32 ,  H05K1/09

CPC分类号： H05K3/32 ,  H01R13/03 ,  H05K1/09

摘要： Electronic components and processes of producing electronic components are disclosed. A process of producing a component includes positioning a substrate having a non-planar surface, applying a metalizing material on the surface, and energetically beam-melting the metalizing material to produce a metalized electrical contact on the component. A component includes a substrate having a non-planar surface, and a printed and energetically beam-melted metalized electrical contact positioned on the non-planar surface. Additionally or alternatively, a component includes a substrate having a surface, and a rotationally-applied and energetically beam-melted metalized electrical contact positioned on the substrate.

公开(公告)号：US20170100744A1

公开(公告)日：2017-04-13

申请号：US14881051

申请日：2015-10-12

申请人： Tyco Electronics Corporation

发明人： Shallu Soneja ,  Min Zheng ,  Dov Nitzan ,  Lavanya Bharadwaj ,  Barry C. Mathews ,  Michael A. Oar ,  Gokce Gulsoy

IPC分类号： B05D3/06

CPC分类号： B05D3/06 ,  C23C26/00 ,  C23C28/021 ,  C23C28/026 ,  H01R13/03

摘要： Electronic components and processes of producing electronic components are disclosed. The electronic component includes a substrate, a first layer on the substrate, a rapidly solidified layer on the first layer and a conductive layer positioned on the rapidly solidified layer. The rapidly solidified layer includes a metastable phase.