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公开(公告)号：US20170105287A1
公开(公告)日：2017-04-13
申请号：US14881034
申请日：2015-10-12
发明人： Michael A. Oar , Shallu Soneja , Gokce Gulsoy
摘要： Electronic components and processes of producing electronic components are disclosed. A process of producing a component includes positioning a substrate having a non-planar surface, applying a metalizing material on the surface, and energetically beam-melting the metalizing material to produce a metalized electrical contact on the component. A component includes a substrate having a non-planar surface, and a printed and energetically beam-melted metalized electrical contact positioned on the non-planar surface. Additionally or alternatively, a component includes a substrate having a surface, and a rotationally-applied and energetically beam-melted metalized electrical contact positioned on the substrate.
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公开(公告)号：US20170100916A1
公开(公告)日：2017-04-13
申请号：US14881041
申请日：2015-10-12
发明人： Lavanya Bharadwaj , Barry C. Mathews , Dominique Freckmann , Shallu Soneja , Michael A. Oar , Gokce Gulsoy , Helge Schmidt , Michael Leidner , Soenke Sachs
CPC分类号： B32B15/04 , B32B37/06 , B32B37/08 , B32B2307/554 , B32B2457/00 , H01L21/324 , H05K1/0207 , H05K3/125 , H05K2203/092 , H05K2203/1131
摘要： Electronic components and processes of producing electronic components are disclosed. The electronic component includes a substrate and a thermal grain modified layer positioned on the substrate. The thermal grain modified layer includes a modified grain structure. The modified grain structure includes a thermal grain modification additive. A method for forming the electronic component is also disclosed.
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公开(公告)号：US20170100744A1
公开(公告)日：2017-04-13
申请号：US14881051
申请日：2015-10-12
发明人： Shallu Soneja , Min Zheng , Dov Nitzan , Lavanya Bharadwaj , Barry C. Mathews , Michael A. Oar , Gokce Gulsoy
IPC分类号： B05D3/06
CPC分类号： B05D3/06 , C23C26/00 , C23C28/021 , C23C28/026 , H01R13/03
摘要： Electronic components and processes of producing electronic components are disclosed. The electronic component includes a substrate, a first layer on the substrate, a rapidly solidified layer on the first layer and a conductive layer positioned on the rapidly solidified layer. The rapidly solidified layer includes a metastable phase.
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4.发明申请公开(公告)号：US20180063967A1
公开(公告)日：2018-03-01
申请号：US15249148
申请日：2016-08-26
CPC分类号： C08J7/047 , B23K1/0016 , B23K1/005 , B23K1/0056 , B23K1/20 , B23K1/203 , B23K35/02 , B23K35/26 , B23K35/262 , B23K2101/32 , B23K2101/42 , B23K2103/172 , H05K1/0284 , H05K1/0373 , H05K1/092 , H05K1/097 , H05K3/1283 , H05K3/341 , H05K3/3489 , H05K3/3494 , H05K2201/09118 , H05K2201/10287 , Y02P70/613
摘要： A method of connecting a wire to a conductive trace formed on a substrate having a predetermined softening point and the functional layered composite formed therefrom. The method comprises applying a conductive ink onto the substrate; curing, drying, or sintering the conductive ink to form the conductive trace with at least one connection pad; applying an activated rosin-type flux and solder to the connection pad and to one end of a metallic wire; placing the end of the wire in contact with the connection pad; applying a source of heat to the wire; melting the solder material to form an interconnection between the wire and the connection pad; removing the source of heat; and allowing the interconnection to cool before moving the wire. The melting point of the solder is either below the softening point of the substrate or above the softening point by about 20° C. or less.
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5.发明申请公开(公告)号：US20170236610A1
公开(公告)日：2017-08-17
申请号：US15043468
申请日：2016-02-12
发明人： Yiliang Wu , Barry C. Mathews , Miguel A. Morales , Leonard Henry Radzilowski , Michael A. Oar , Ranjan Deepak Deshmukh , James Paul Scholz , Bruce Foster Bishop , Jerry L. Moore
IPC分类号： H01B1/02 , C09D11/037 , H01B13/00 , C09D11/52
CPC分类号： H01B1/02 , B82Y30/00 , C08G77/26 , C08K2003/0806 , C09D4/00 , C09D5/002 , C09D5/24 , C09D7/61 , C09D11/03 , C09D11/037 , C09D11/52 , C09D183/08 , H01B1/22 , H01B13/0026 , H05K1/097 , H05K3/1283 , H05K3/389 , H05K2203/1131 , C08K3/08 , C08L83/08 , C08K9/06
摘要： An alkoxysilane comprising a functional group is used as an additive in the silver nanoparticle ink, and as an adhesion promoter (or primer layer) on the surface of the substrate in order to enhance the adhesion of silver nanoparticle inks on temperature-sensitive plastic substrates. The combination of the functionalized alkoxysilane both in the ink and on the substrate's surface provides enhanced adhesion after annealing the ink at a low temperature. The adhesion of the annealed films improves from a 0B-3B level to 4B-5B when tested according to ASTM D3359. No degradation of adhesion and no change of color are observed after aging the annealed films in a humidity chamber.
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公开(公告)号：US20170233541A1
公开(公告)日：2017-08-17
申请号：US15043460
申请日：2016-02-12
发明人： Yiliang Wu , Barry C. Mathews , Michael A. Oar , Miguel A. Morales , Leonard Henry Radzilowski , James Paul Scholz , Bruce Foster Bishop , Jerry L. Moore
CPC分类号： C08J7/045 , B05D1/005 , B05D1/02 , B05D1/18 , B05D1/30 , B05D3/0254 , B05D3/144 , B05D5/12 , B05D7/02 , B05D7/546 , C08J2369/00 , C08J2429/04 , C08J2429/14 , C09D5/002 , C09D11/037 , C09D11/106 , C09D11/52 , C09D129/14 , C23C4/129 , H01B1/02 , H01B1/22 , H05K1/097 , H05K3/125 , H05K3/386 , H05K2203/1131
摘要： A primer layer comprising a polyvinyl butyral resin enhances adhesion of silver nanoparticle inks onto plastic substrates. The primer layer comprises a polyvinyl butyral (PVB) resin having a polyvinyl alcohol content between about 18 wt. % to about 21 wt. %. The PVB resin may also have a glass transition temperature greater than about 70° C. Optionally, the PVB primer layer may further be enhanced by cross-linking using a melamine-formaldehyde resin. Conductive traces formed on plastic substrates having the PVB primer layer exhibit an acceptable cross-hatch adhesion rating with little to no degradation of adhesion being observed after exposure to 4-days salt mist aging or 1-day high humidity aging.
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公开(公告)号：US09985344B2
公开(公告)日：2018-05-29
申请号：US14581707
申请日：2014-12-23
发明人： Bruce Foster Bishop , James Paul Scholz , Jerry L. Moore , Michael A. Oar , Leonard Henry Radzilowski
CPC分类号： H01Q1/364 , H01Q1/085 , H01Q1/22 , H01Q1/38 , H01Q1/40 , H05K3/125 , H05K3/246 , H05K2201/09681
摘要： Electronic articles, antennae, and processes of producing electronic articles are disclosed. The electronic article includes a rigid substrate having a non-planar region and a sintered conductive ink positioned on the non-planar region. The antenna is a specific type of electronic article covered by the disclosure. Additionally or alternatively, the antenna has a light transmission of at least 85%. The process includes positioning a substrate having a non-planar region, applying a conductive ink to the non-planar region, and sintering the conductive ink on the non-planar region thereby producing the sintered conductive ink on the electronic article and/or producing an antenna having a light transmission of at least 80%.
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8.发明申请公开(公告)号：US20170238425A1
公开(公告)日：2017-08-17
申请号：US15043473
申请日：2016-02-12
发明人： Barry C. Mathews , Yiliang Wu , Miguel A. Morales , Michael A. Oar , Leonard Henry Radzilowski , Juliana B. De Guzman
IPC分类号： H05K3/22
CPC分类号： H05K3/22 , C09D11/52 , H05K1/097 , H05K3/12 , H05K3/1283 , H05K2203/088 , H05K2203/1131
摘要： A method of fabricating highly conductive (low resistive) features with silver nanoparticle inks at low processing temperature including room temperature is provided, The method includes 1) printing a silver nanoparticle ink to form a conductive feature on a substrate; 2) drying/annealing the printed feature at a temperature compatible with the substrate; 3) treating the annealed feature in a humidity environment; and 4) optionally drying the treated conductive feature. The silver nanoparticle conductive features exhibit a decrease in resistivity from about a factor of 2 up to about a few orders of magnitude after exposure to the humidity treatment.
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公开(公告)号：US20140041893A1
公开(公告)日：2014-02-13
申请号：US13955243
申请日：2013-07-31
IPC分类号： H05K5/06 , C08L53/00 , C08F299/02
CPC分类号： H05K5/065 , C08F299/02 , C08G2220/00 , C08J3/246 , C08J5/00 , C08L23/22 , C08L25/08 , C08L51/06 , C08L53/005 , C08L53/025 , C08L61/06 , C09K3/10 , C09K2003/1068 , C09K2200/0617 , C09K2200/0642 , H05K5/062 , Y10T428/1352
摘要： Methods, compositions, apparatuses, and systems are provided for a hybrid thermoplastic gel or sealant. The methods comprise providing (a) a base polymer having at least one functional group capable of crosslinking, (b) a functionalized extender, and (c) heat, and reacting the base polymer and functionalized extender in the presence of the heat to form the hybrid thermoplastic gel. The gel composition may comprise 5-40 wt % of a base polymer, 60-95 wt % of a functionalized extender, and 0-10 wt % of a crosslinker. A closure or interconnect system may comprise a housing, a cable, and a hybrid thermoplastic gel or sealant. A telecommunications apparatus may comprise a telecommunications component and a sealant that forms a seal with the telecommunications component. The sealant may comprise a sealant material having a first range of elongation followed by a second range of elongation.
摘要翻译： 提供了用于混合热塑性凝胶或密封剂的方法，组合物，装置和系统。 所述方法包括提供（a）具有至少一个能够交联的官能团的基础聚合物，（b）官能化的增量剂，和（c）在热的存在下加热和使基础聚合物和官能化的增量剂反应形成 混合热塑性凝胶。 凝胶组合物可以包含5-40重量％的基础聚合物，60-95重量％的官能化增量剂和0-10重量％的交联剂。 闭合或互连系统可以包括壳体，电缆和混合热塑性凝胶或密封剂。 电信设备可以包括与电信部件形成密封的电信部件和密封剂。 密封剂可以包括密封剂材料，其具有第一伸长范围，随后伸长第二范围。
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公开(公告)号：US20160183381A1
公开(公告)日：2016-06-23
申请号：US14581679
申请日：2014-12-23
CPC分类号： H05K3/28 , H01Q1/40 , H05K1/0284 , H05K1/097 , H05K1/16 , H05K2201/068 , H05K2201/10098 , H05K2201/10151
摘要： Electronic components and overmolding processes are disclosed. The electronic component, such as, an antenna, includes a substrate, an overmolding bonded to at least a portion of the substrate, the overmolding being a non-planar arrangement of a polymeric material, and a conductive ink positioned on the substrate between the substrate and the overmolding. The conductive ink is devoid or substantially devoid of delamination or fracture from the bonding of the overmolding to the substrate. The overmolding process includes providing a substrate, applying a conductive ink onto the substrate, and bonding an overmolding to at least a portion of the substrate, the overmolding being an arrangement of a polymeric material. The conductive ink is devoid or substantially devoid of delamination or fracture through the bonding of the overmolding to the substrate.
摘要翻译： 公开了电子元件和二次成型工艺。 诸如天线的电子部件包括基底，粘合到基底的至少一部分上的包覆成型，包覆成型是聚合材料的非平面布置，以及位于基底之间的导电墨 和包覆成型。 导电油墨缺乏或基本上没有从包覆成型与基材的粘合分层或断裂。 包覆成型方法包括提供基材，将导电油墨施加到基材上，以及将包覆成型粘合至基材的至少一部分，所述包覆成型是聚合物材料的布置。 导电油墨通过包覆成型与基材的结合而没有或基本上没有分层或断裂。
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