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公开(公告)号：US10586712B2
公开(公告)日：2020-03-10
申请号：US15755396
申请日：2016-08-17
Applicant: ULVAC, INC.
Inventor： Takashi Kageyama , Tetsuya Shimada , Koji Takahashi , Yuu Nakamuta , Manabu Harada
Abstract: According to a mode of the present invention, a method of manufacturing an electronic component includes: preparing a component main-body 110 including a first surface having an electrode-formed region having a plurality of bump electrodes 103, a second surface opposite to the first surface, and side peripheral surfaces connecting the first surface and the second surface; forming a mask section M1 on at least a peripheral portion of the first surface, the mask section surrounding the electrode-formed region, a height of the mask section being equal to or more than a height of the plurality of bump electrodes; bonding the mask section of the first surface to an adhesive layer 30 on a holder for holding a component; forming a protective film 105 on the component main-body, the protective film covering the second surface and the side peripheral surfaces; and removing the mask section M1 from the first surface.
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公开(公告)号：US10429964B2
公开(公告)日：2019-10-01
申请号：US15307545
申请日：2015-04-28
Applicant: ULVAC, INC.
Inventor： Manabu Harada , Hidenori Yanagitsubo , Atsuhito Ihori , Toshihiro Suzuki , Masahiro Matsumoto , Noriaki Tani , Masashi Kubo
Abstract: A touch panel of the present invention includes a touch panel substrate, a cover substrate provided to overlap the touch panel, and a connection part including a scattering layer laminated from the cover substrate side toward the touch panel substrate side and is provided between the touch panel substrate and the cover substrate in an area other than a display area.
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公开(公告)号：US09891731B2
公开(公告)日：2018-02-13
申请号：US14647034
申请日：2014-07-10
Applicant: ULVAC, Inc.
Inventor： Manabu Harada , Atsuhito Ihori , Toshihiro Suzuki , Hidenori Yanagitsubo , Masahiro Matsumoto , Masashi Kubo , Makoto Arai
CPC classification number: G06F3/041 , G02B5/22 , G02B5/26 , G02B5/286 , G06F2203/04103 , G06F2203/04107
Abstract: A touch panel of the present invention includes: a cover substrate; a connector being provided on an area of the cover substrate other than a display area, and including a color layer and a shield layer, the shield layer being formed from a multilayer structure, the multilayer structure being configured so that a metal layer and a dielectric layer which is thicker than the metal layer are alternately laminated; and a touch panel substrate being arranged to face the cover substrate with the connector interposed therebetween.
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4.发明申请TOUCH PANEL, METHOD OF PRODUCING THE SAME, OPTICAL THIN FILM SUBSTRATE AND METHOD OF PRODUCING THE SAME 有权触控面板及其制造方法，光薄膜基板及其制造方法公开(公告)号：US20160109971A1
公开(公告)日：2016-04-21
申请号：US14647034
申请日：2014-07-10
Applicant: ULVAC, INC.
Inventor： Manabu Harada , Atsuhito Ihori , Toshihiro Suzuki , Hidenori Yanagitsubo , Masahiro Matsumoto , Masashi Kubo , Makoto Arai
CPC classification number: G06F3/041 , G02B5/22 , G02B5/26 , G02B5/286 , G06F2203/04103 , G06F2203/04107
Abstract: A touch panel of the present invention includes: a cover substrate; a connector being provided on an area of the cover substrate other than a display area, and including a color layer and a shield layer, the shield layer being formed from a multilayer structure, the multilayer structure being configured so that a metal layer and a dielectric layer which is thicker than the metal layer are alternately laminated; and a touch panel substrate being arranged to face the cover substrate with the connector interposed therebetween.
Abstract translation: 本发明的触摸面板包括：盖基板; 在所述盖基板的除了显示区域的区域上设置的连接器，所述连接器包括彩色层和屏蔽层，所述屏蔽层由多层结构形成，所述多层结构被配置为使得金属层和电介质 比金属层厚的层交替层叠; 并且触摸面板基板被布置为与所述盖基板相对，并且所述连接器插入在所述盖基板之
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