Cathode unit for magnetron sputtering apparatus and magnetron sputtering apparatus

    公开(公告)号:US12293905B2

    公开(公告)日:2025-05-06

    申请号:US17928510

    申请日:2022-03-18

    Applicant: ULVAC, INC.

    Abstract: A cathode unit includes first and second magnet units that are driven to rotate around an axis on a side opposed to a sputtering surface of a target. The first magnet unit is configured to cause a first leakage magnetic field to act on a space in front of the sputtering surface including a target center inward. The second magnet unit is configured to cause a second leakage magnetic field to act locally in the space in front of the sputtered surface located between the target center and the outer edge of the target and to enable self-holding discharge under low pressure of plasma confined by the second leakage magnetic field.

Patent Agency Ranking