公开(公告)号：US20130118680A1

公开(公告)日：2013-05-16

申请号：US13738526

申请日：2013-01-10

Applicant: UNIMICRON TECHNOLOGY CORPORATION

Inventor： Chin-Ming Liu

IPC: H05K13/00

CPC classification number: H05K13/00 ,  H01L2224/0554 ,  H01L2224/05568 ,  H01L2224/05573 ,  H01L2224/16225 ,  H01L2224/32225 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/73204 ,  H01L2224/73265 ,  H01L2924/00014 ,  H01L2924/15174 ,  H01L2924/15311 ,  H05K3/0097 ,  H05K3/4682 ,  H05K2203/0152 ,  H05K2203/1536 ,  Y10T156/10 ,  H01L2924/00 ,  H01L2224/05599 ,  H01L2224/0555 ,  H01L2224/0556

Abstract: A method for fabricating a packaging substrate includes: stacking two metal layers;encapsulating the two metal layers with assistant dielectric layers; forming built-up structures on the assistant dielectric layers, respectively; and separating the built-up structures along the interface between the two metal layers so as to form two packaging substrates. Owing to the adhesive characteristic of the assistant dielectric layers, the two metal layers are unlikely to separate from each other during formation of the built-up structures. But after portions of the dielectric layer around the periphery of the metal layers are cut and removed, the two metal layers can be readily separated from each other. The two metal layers can be patterned to form wiring layers, metal bumps, or supporting structures to avoid waste of materials. A packaging substrate and a fabrication method thereof are provided.

Abstract translation: 一种用于制造封装衬底的方法包括：堆叠两个金属层; 用辅助电介质层封装两个金属层; 分别在辅助电介质层上形成堆积结构; 并且沿着两个金属层之间的界面分离堆积结构，以形成两个封装基板。 由于辅助电介质层的粘合特性，在形成构造结构期间，两个金属层不可能彼此分离。 但是，在金属层周围的电介质层的部分被切割和去除之后，两个金属层可以容易地彼此分离。 可以将两个金属层图案化以形成布线层，金属凸块或支撑结构，以避免材料浪费。 提供了一种封装基板及其制造方法。