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公开(公告)号:US11119625B1
公开(公告)日:2021-09-14
申请号:US17099872
申请日:2020-11-17
Applicant: UNITED MICROELECTRONICS CORP.
Inventor: Zheng-Yang Li , Chung-Jung Chen , Chun-Man Li , Li-Hsin Yang , Ching-Pei Lin , Ji-Fu Kung
IPC: G06F3/0481 , G06F3/0484
Abstract: A remote control device for a manufacturing equipment and a method for detecting manual control are provided. The method for detecting the manual control on the manufacturing equipment includes the following steps. A cursor pattern is created. When the user interface is automatically controlled, a history location of the cursor pattern shown on a user interface of the manufacturing equipment is detected to obtain a location distribution. The location distribution is stored. A current location of the cursor pattern shown on the user interface is detected. If the current location is not within the location distribution, it is deemed that the user interface is manually controlled.
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公开(公告)号:US11955309B2
公开(公告)日:2024-04-09
申请号:US17369077
申请日:2021-07-07
Applicant: UNITED MICROELECTRONICS CORP.
Inventor: Zheng-Yang Li , Chian-Chen Kuo , Yi-Cheng Lu , Ji-Fu Kung
IPC: H01L21/00 , H01J27/18 , H01J37/08 , H01J37/302 , H01J37/305 , H01L21/67
CPC classification number: H01J37/08 , H01J27/18 , H01J37/302 , H01J37/3053 , H01L21/67 , H01L21/67069 , H01J2237/083
Abstract: An automatic adjustment method and an automatic adjustment device of a beam of a semiconductor apparatus, and a training method of a parameter adjustment model are provided. The automatic adjustment method of the beam of the semiconductor apparatus includes the following steps. The semiconductor apparatus generates the beam. A wave curve of the beam is obtained. The wave curve is segmented into several sections. The slope of each of the sections is obtained. Several environmental factors of the semiconductor apparatus are obtained. According to the slopes and the environmental factors, at least one parameter adjustment command of the semiconductor apparatus is analyzed through the parameter adjustment model.
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