Abstract:
Disclosed is a semiaromatic polyamide resin composition including a semiaromatic polyamide (A) and a polyhydric alcohol (B), wherein a mass ratio (A/B) between the semiaromatic polyamide (A) and the polyhydric alcohol (B) is 99.95/0.05 to 90/10; and the semiaromatic polyamide (A) includes as constituent components thereof an aromatic dicarboxylic acid component and an aliphatic diamine component, and has a melting point of 300 to 350° C.