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公开(公告)号：US11906302B2
公开(公告)日：2024-02-20
申请号：US18302151
申请日：2023-04-18
申请人： UNITY SEMICONDUCTOR
IPC分类号： G01B9/0209 , G01B9/02 , G01B11/06
CPC分类号： G01B9/0209 , G01B9/02083 , G01B9/02088 , G01B11/0625 , G01B2210/56
摘要： A method and related system for measuring a surface of a substrate including at least one structure using low coherence optical interferometry, the method being implemented with a system having an interferometric device, a light source, an imaging sensor, and a processing module, the method including: - acquiring, with the imaging sensor, an interferometric signal formed by the interferometric device between a reference beam and a measurement beam reflected by the surface at a plurality of measurement points in a field of view; the following steps being carried out by the processing module: classifying, by a learning technique, the acquired interferometric signals according to a plurality of classes, each class being associated with a reference interferometric signal representative of a typical structure; and analysing the interferometric signals to derive information on the structure at the measurement points, as a function of the class of each interferometric signal.
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公开(公告)号：US11287246B2
公开(公告)日：2022-03-29
申请号：US16967649
申请日：2019-01-25
摘要： A method and related device for measuring the profile of a surface of an object to be measured having zones made from at least two different materials, the object to be measured forming part of a plurality of substantially identical objects, the plurality of objects also including at least one reference object having at least one reference surface, the method including the following steps: determining a correction function, from a first profile signal of a first reference surface and a second profile signal from a second reference surface, the second reference surface being metallized; acquiring a profile signal from the surface of the object to be measured; and applying the correction function to the profile signal from the surface of the object to be measured to obtain a corrected profile signal; the profile signals being obtained from interferometric measurements.
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公开(公告)号：US11942379B1
公开(公告)日：2024-03-26
申请号：US18359661
申请日：2023-07-26
申请人： Unity Semiconductor
CPC分类号： H01L22/12 , G01N21/9501 , H01L22/20
摘要： A measurement system and an inspection method for detecting a defective bonding interface in a sample substrate including at least one element disposed on a support. The method comprises: placing the sample substrate in the measurement system, establishing an inclination map of the exposed surface, analyzing the inclination map and identifying a zone or zones of the exposed surface whose inclinations deviate by more than a given threshold from the inclination of the reference surface; and detecting the presence of a defective bond between the element and the support, depending on the result of the analysis of the inclination map.
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公开(公告)号：US11713960B2
公开(公告)日：2023-08-01
申请号：US17296117
申请日：2019-11-28
申请人： UNITY SEMICONDUCTOR
IPC分类号： G01B9/0209 , G01B9/02 , G01B11/06
CPC分类号： G01B9/0209 , G01B9/02083 , G01B9/02088 , G01B11/0625 , G01B2210/56
摘要： A method for measuring a surface of an object including at least one structure using low coherence optical interferometry, the method including the steps of acquiring an interferometric signal at a plurality of measurement points in a field of view and, for at least one measurement point, attributing the interferometric signal acquired to a class of interferometric signals from a plurality of classes, each of the classes being associated with a reference interferometric signal representative of a typical structure; and analysing the interferometric signal to derive therefrom an item of information on the structure at the measurement point, as a function of its class.
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