公开(公告)号：US10859448B2

公开(公告)日：2020-12-08

申请号：US15550466

申请日：2016-02-11

Applicant: UNIVERSITY OF FLORIDA RESEARCH FOUNDATION, INC.

Inventor： Casey A. Barnard ,  Jessica C. Meloy ,  Mark Sheplak

IPC: G01L1/14 ,  G01N11/02 ,  B81B7/00 ,  G01N11/00 ,  H01L23/00 ,  H05K1/18

Abstract: A sensor system comprising a Micro-Electro-Mechanical Systems (MEMS)-based capacitive floating element shear stress sensor, the associated packaging, and the interface circuitry required for operation as an instrumentation-grade sensing system is disclosed herein. One implementation of the interface circuitry is an analog synchronous modulation/demodulation scheme enabling time-resolved measurements of both mean and dynamic wall shear stress events, where a modulation section couples to the sensor for sensing wall shear stress at the surface of an object in a fluid and generates at least one bias signal from the sensor output signal. In response to the bias signal, a demodulation control circuit adjusts the phase of the bias signal and generates a demodulation control signal from the phase adjusted signal. Consequently, in response to the demodulation control signal, a demodulation section synchronizes the rectification of the sensor output signal, while the phase information is maintained.

公开(公告)号：US09554212B2

公开(公告)日：2017-01-24

申请号：US14258478

申请日：2014-04-22

Applicant: UNIVERSITY OF FLORIDA RESEARCH FOUNDATION, INC.

Inventor： Mark Sheplak ,  David Patrick Arnold

IPC: H04R25/00 ,  H04R19/04 ,  H05K1/16 ,  H04R1/04 ,  H04R31/00 ,  H05K1/02 ,  H05K1/18

CPC classification number: H04R31/006 ,  H01L2224/16225 ,  H04R1/04 ,  H04R19/04 ,  H04R31/003 ,  H04R2201/02 ,  H04R2201/029 ,  H04R2231/00 ,  H04R2400/00 ,  H05K1/0272 ,  H05K1/16 ,  H05K1/185 ,  H05K3/46 ,  H05K2201/10083 ,  Y10T29/49005 ,  Y10T29/49226

Abstract: A capacitive microphone and method of fabricating the same are provided. One or more holes can be formed in a first printed circuit board (PCB). A diaphragm can be surface micro-machined onto an interior surface of the first PCB at a region having the one or more holes. Interface electronics can also be interconnected to the interior surface of the PCB. One or more spacer PCBs can be attached to a second PCB to the first PCB, such that appropriate interconnections between interconnect vias are made. The second PCB and first PCB with spacers in between can be attached so as to create a cavity in which the diaphragm and interface electronics are located.

Abstract translation: 提供一种电容麦克风及其制造方法。 可以在第一印刷电路板（PCB）中形成一个或多个孔。 膜片可以在具有一个或多个孔的区域上被表面微加工到第一PCB的内表面上。 接口电子元件也可以互连到PCB的内表面。 一个或多个间隔PCB可以连接到第二PCB到第一PCB，使得形成互连通孔之间的适当互连。 可以将第二PCB和间隔件之间的第一PCB连接起来，以便形成隔膜和接口电子设备所在的空腔。