公开(公告)号：US11891686B2

公开(公告)日：2024-02-06

申请号：US16485862

申请日：2018-02-13

Applicant: UNIVERSITY OF THE WEST OF SCOTLAND

Inventor： Shigeng Song ,  Desmond Gibson ,  David Hutson

IPC: C23C14/35 ,  C03C17/34 ,  C23C14/04 ,  G02B5/28 ,  H01J37/34 ,  C23C14/54

CPC classification number: C23C14/35 ,  C03C17/3417 ,  C23C14/044 ,  C23C14/54 ,  C23C14/542 ,  C23C14/545 ,  C23C14/546 ,  G02B5/285 ,  H01J37/347 ,  H01J37/3408 ,  H01J37/3476 ,  C03C2218/156 ,  C03C2218/322 ,  C03C2218/34

Abstract: Apparatus for depositing one or more variable interference filters onto one or more substrates comprises a vacuum chamber, at least one magnetron sputtering device and at least one movable mount for supporting the one or more substrates within the vacuum chamber. The at least one magnetron sputtering device is configured to sputter material from a sputtering target towards in the mount, thereby defining a sputtering zone within the vacuum chamber. At least one static sputtering mask is located between the sputtering target and the mount. The at least one static sputtering mask is configured such that, when each substrate is moved through the sputtering zone on the at least one movable mount, a layer of material having a non-uniform thickness is deposited on each said substrate.

公开(公告)号：US11466362B2

公开(公告)日：2022-10-11

申请号：US16607838

申请日：2018-04-25

Applicant: UNIVERSITY OF THE WEST OF SCOTLAND

Inventor： Desmond Gibson ,  Shigeng Song

IPC: C23C14/35 ,  C23C14/58 ,  C23C14/04 ,  C23C14/34 ,  C23C14/50 ,  C23C14/54 ,  G02B5/20 ,  G02B5/28 ,  H01J37/34

Abstract: Apparatus for depositing germanium and carbon onto one or more substrates comprises a vacuum chamber, at least first and second magnetron sputtering devices and at least one movable mount for supporting the one or more substrates within the vacuum chamber. The first magnetron sputtering device is configured to sputter germanium towards the at least one mount from a first sputtering target comprising germanium, thereby defining a germanium sputtering zone within the vacuum chamber. The second magnetron sputtering device is configured to sputter carbon towards the at least one mount from a second sputtering target comprising carbon, thereby defining a carbon sputtering zone within the vacuum chamber. The at least one mount and the at least first and second magnetron sputtering devices are arranged such that, when each substrate is moved through the germanium sputtering zone on the at least one movable mount, germanium is deposited on the said substrate, and when each substrate is moved through the carbon sputtering zone on the at least one movable mount, carbon is deposited on the said substrate.