公开(公告)号：US20130183800A1

公开(公告)日：2013-07-18

申请号：US13763846

申请日：2013-02-11

Applicant: UNIMICRON TECHNOLOGY CORP.

Inventor： Shih-Ping Hsu

IPC: H01L21/50

CPC classification number: H01L21/50 ,  H01L23/49822 ,  H01L23/5389 ,  H01L24/19 ,  H01L2224/04105 ,  H01L2224/20 ,  H01L2924/01033 ,  H01L2924/01082 ,  H01L2924/14 ,  H01L2924/18162 ,  H01L2924/351 ,  H01L2924/3511 ,  H05K1/185 ,  H05K3/0058 ,  H05K3/4644 ,  H05K2201/0129 ,  H05K2201/10674 ,  Y10T29/5137 ,  Y10T29/53178 ,  H01L2924/00

Abstract: A circuit board structure and a fabrication method thereof are disclosed. The circuit board structure includes a carrying board having a first and an opposite second surface and having at least one through cavity formed therein; a semiconductor chip disposed in the through cavity of the carrying board; an adhesive material filling the gap between the through cavity of the carrying board and the semiconductor chip to fix the semiconductor chip in the through cavity; and a reinforcing layer disposed on the second surface of the carrying board and the inactive surface of the semiconductor chip, thereby increasing the strength of the carrying board as well as the reliability of the circuit board.

Abstract translation: 公开了一种电路板结构及其制造方法。 电路板结构包括具有第一和相对的第二表面并具有形成在其中的至少一个通孔的承载板; 设置在承载板的通孔中的半导体芯片; 填充承载板的通孔与半导体芯片之间的间隙的粘合材料，以将半导体芯片固定在通孔中; 以及设置在承载板的第二表面和半导体芯片的非活动表面上的增强层，从而增加了承载板的强度以及电路板的可靠性。

公开(公告)号：US09484224B2

公开(公告)日：2016-11-01

申请号：US13763846

申请日：2013-02-11

Applicant: Unimicron Technology Corp.

Inventor： Shih-Ping Hsu

IPC: H05K3/36 ,  H01L21/50 ,  H01L23/498 ,  H01L23/538 ,  H01L23/00 ,  H05K1/18 ,  H05K3/00 ,  H05K3/46

CPC classification number: H01L21/50 ,  H01L23/49822 ,  H01L23/5389 ,  H01L24/19 ,  H01L2224/04105 ,  H01L2224/20 ,  H01L2924/01033 ,  H01L2924/01082 ,  H01L2924/14 ,  H01L2924/18162 ,  H01L2924/351 ,  H01L2924/3511 ,  H05K1/185 ,  H05K3/0058 ,  H05K3/4644 ,  H05K2201/0129 ,  H05K2201/10674 ,  Y10T29/5137 ,  Y10T29/53178 ,  H01L2924/00

Abstract: A circuit board structure and a fabrication method thereof are disclosed. The circuit board structure includes a carrying board having a first and an opposite second surface and having at least one through cavity formed therein; a semiconductor chip disposed in the through cavity of the carrying board; an adhesive material filling the gap between the through cavity of the carrying board and the semiconductor chip to fix the semiconductor chip in the through cavity; and a reinforcing layer disposed on the second surface of the carrying board and the inactive surface of the semiconductor chip, thereby increasing the strength of the carrying board as well as the reliability of the circuit board.

Abstract translation: 公开了一种电路板结构及其制造方法。 电路板结构包括具有第一和相对的第二表面并具有形成在其中的至少一个通孔的承载板; 设置在承载板的通孔中的半导体芯片; 填充承载板的通孔与半导体芯片之间的间隙的粘合材料，以将半导体芯片固定在通孔中; 以及设置在承载板的第二表面和半导体芯片的非活动表面上的增强层，从而增加了承载板的强度以及电路板的可靠性。

公开(公告)号：US20130028450A1

公开(公告)日：2013-01-31

申请号：US13646249

申请日：2012-10-05

Applicant: STMicroelectronics S.r.l. ,  Unimicron Technology Corp.

Inventor： Mario Cortese ,  Mark A. Azzopardi ,  Shih-Ping Hsu ,  Kun-Chen Tsai ,  Ivan Micallef

IPC: H04R1/00 ,  B32B38/08 ,  B32B3/02 ,  B32B38/04 ,  H01L27/20 ,  H05K1/11

CPC classification number: B81B7/0064 ,  B81B2201/0257 ,  B81C2203/0118 ,  H01L24/73 ,  H01L2224/32225 ,  H01L2224/48091 ,  H01L2224/48137 ,  H01L2224/48227 ,  H01L2224/48228 ,  H01L2224/73265 ,  H01L2924/1461 ,  H01L2924/3025 ,  H04R19/005 ,  Y10T156/1056 ,  Y10T428/24562 ,  H01L2924/00012 ,  H01L2924/00014 ,  H01L2924/00

Abstract: A lid for a MEMS device and the relative manufacturing method. The lid includes: a first board with opposite first and second surfaces having first and second metal layers disposed thereon, respectively, wherein a through cavity extends through the first board and the first and second metal layers; a second board with opposite third and fourth surfaces; an adhesive layer sandwiched between the second surface of the first board and the third surface of the second board to couple the first and second boards together such that the through cavity is closed by the second board, thereby forming a recess; and a first conductor layer coating the bottom and the side surfaces of the recess.

Abstract translation: MEMS器件的盖子及相关制造方法。 所述盖包括：分别具有相对的第一和第二表面的第一板，其分别设置有第一和第二金属层，其中通孔延伸穿过所述第一板和所述第一和第二金属层; 具有相对的第三和第四表面的第二板; 夹在第一板的第二表面和第二板的第三表面之间的粘合剂层，以将第一和第二板连接在一起，使得通孔被第二板封闭，从而形成凹部; 以及涂覆凹部的底部和侧表面的第一导体层。