MEMORY STRUCTURE
    1.
    发明申请
    MEMORY STRUCTURE 审中-公开

    公开(公告)号:US20200119027A1

    公开(公告)日:2020-04-16

    申请号:US16177812

    申请日:2018-11-01

    Abstract: A memory structure including a substrate, at least one stacked gate structure, a first spacer conductive layer, and a first contact is provided. The stacked gate structure is located on the substrate and includes a control gate. The control gate extends in a first direction. The first spacer conductive layer is located on one sidewall of the control gate and is electrically insulated from the control gate. The first spacer conductive layer includes a first merged spacer portion and a first non-merged spacer portion. A line width of the first merged spacer portion is greater than a line width of the first non-merged spacer portion. The first contact is connected to the first merged spacer portion. The memory structure can have a larger process window of contact.

    STRUCTURE OF SEMICONDUCTOR DEVICE AND METHOD FOR FABRICATING THE SAME

    公开(公告)号:US20210265376A1

    公开(公告)日:2021-08-26

    申请号:US16798126

    申请日:2020-02-21

    Abstract: A semiconductor device includes a substrate, having cell region and high-voltage region. A memory cell is on the substrate within the cell region. The memory cell includes a memory gate structure and a selection gate structure on the substrate. A first spacer is sandwiched between or respectively on sidewalls of the memory cell structure and the selection gate structure. First high-voltage transistor is on the substrate within the high-voltage region. A first composite gate structure of the first high-voltage transistor includes a first gate structure on the substrate, an insulating layer with a predetermined thickness on the substrate in a -like structure or an L-like structure at cross-section, and a second gate structure on the insulating layer along the -like structure or the L-like structure. The selection gate structure and the second gate structure are originated from a same preliminary conductive layer.

Patent Agency Ranking