公开(公告)号：US10681813B2

公开(公告)日：2020-06-09

申请号：US16027466

申请日：2018-07-05

Applicant: United Technologies Corporation

Inventor： Wayde R. Schmidt ,  Sameh Dardona ,  Slade R. Culp ,  Marcin Piech

IPC: H05K1/16 ,  H05K3/20

Abstract: Method for manufacturing an electronic component is provided. The method includes manufacturing elements that are produced by an additive manufacturing process. Moreover, the elements are produced in the same plane or out of plain with one or more foil substrates. The elements may be various structures, including, for example, connectors, electrical components (e.g., a resistor, a capacitor, a switch, and/or the like), and/or any other suitable electrical elements and/or structures.

公开(公告)号：US20200147897A1

公开(公告)日：2020-05-14

申请号：US16185201

申请日：2018-11-09

Applicant: United Technologies Corporation

Inventor： Wayde R. Schmidt ,  Paul Sheedy ,  John A. Sharon ,  Dustin D. Caldwell ,  Slade R. Culp

IPC: B29C65/56 ,  B33Y10/00 ,  B33Y80/00 ,  B29C64/10 ,  B33Y50/00 ,  B29C64/386 ,  B22F3/00

Abstract: An additive manufactured multi-portion article includes a first portion of an article manufactured by a first additive manufacturing process; and a second portion of the article manufactured by a second additive manufacturing process different than the first additive manufacturing process, the second portion attached to the first portion.

公开(公告)号：US10821678B2

公开(公告)日：2020-11-03

申请号：US16185201

申请日：2018-11-09

Applicant: United Technologies Corporation

Inventor： Wayde R. Schmidt ,  Paul Sheedy ,  John A. Sharon ,  Dustin D. Caldwell ,  Slade R. Culp

IPC: B29C65/56 ,  B33Y10/00 ,  B33Y50/00 ,  B33Y80/00 ,  B29C64/386 ,  B29C64/10 ,  B22F3/00

Abstract: An additive manufactured multi-portion article includes a first portion of an article manufactured by a first additive manufacturing process; and a second portion of the article manufactured by a second additive manufacturing process different than the first additive manufacturing process, the second portion attached to the first portion.

公开(公告)号：US10006304B2

公开(公告)日：2018-06-26

申请号：US15036989

申请日：2014-11-14

Applicant: UNITED TECHNOLOGIES CORPORATION

Inventor： Wayde R. Schmidt ,  Slade R. Culp

IPC: F01D21/00 ,  F01D17/08 ,  F01D5/14 ,  F01D17/04 ,  G01K1/14 ,  G01D11/30 ,  G01K7/02 ,  G01L19/08 ,  B32B15/04 ,  B32B15/14 ,  B32B15/18 ,  B64D45/00 ,  G01L19/16 ,  G01M15/14 ,  B22F3/105 ,  B22F7/06 ,  B33Y10/00 ,  B33Y80/00 ,  B23K20/10

CPC classification number: F01D17/085 ,  B22F3/1055 ,  B22F7/06 ,  B23K20/103 ,  B32B15/043 ,  B32B15/14 ,  B32B15/18 ,  B32B2603/00 ,  B32B2605/18 ,  B33Y10/00 ,  B33Y80/00 ,  B64D45/00 ,  B64D2045/0085 ,  F01D5/147 ,  F01D17/04 ,  F01D17/08 ,  F05D2220/32 ,  G01D11/30 ,  G01K1/14 ,  G01K7/02 ,  G01K2205/00 ,  G01L19/083 ,  G01L19/16 ,  G01M15/14 ,  Y02P10/295 ,  Y02T50/672

Abstract: One exemplary embodiment of this disclosure relates to an article having a multi-layer wall structure having an embedded sensor. Further, the multi-layer wall structure and the sensor are bonded together.

公开(公告)号：US10717229B2

公开(公告)日：2020-07-21

申请号：US15722829

申请日：2017-10-02

Applicant: United Technologies Corporation

Inventor： Sameh Dardona ,  Paul Sheedy ,  Wayde R. Schmidt ,  Dustin D. Caldwell ,  Slade R. Culp

IPC: B29C64/129 ,  B33Y10/00 ,  B33Y70/00 ,  B33Y80/00 ,  H01F41/02 ,  H01F1/00 ,  H01F1/44 ,  H01F41/16 ,  B29C64/106 ,  B29K105/16 ,  B29K505/00

Abstract: A system for direct writing a conformal or free-form magnet includes producing a magnetic ink compound by mixing an photopolymer base and a magnetic material powder, extruding a layer of the magnetic ink compound through a nozzle on to a target substrate to form a layer, soft-curing the layer by exposing the layer to a first light, repeatedly extruding a layer and soft-curing the layer, then post-curing the magnet by exposing the magnet to a second light and an elevated temperature.

公开(公告)号：US20160305271A1

公开(公告)日：2016-10-20

申请号：US15036989

申请日：2014-11-14

Applicant: UNITED TECHNOLOGIES CORPORATION

Inventor： Wayde R. Schmidt ,  Slade R. Culp

IPC: F01D17/08 ,  F01D17/04 ,  B64D45/00 ,  G01K1/14 ,  G01D11/30 ,  G01K7/02 ,  G01L19/16 ,  F01D5/14 ,  G01M15/14

CPC classification number: F01D17/085 ,  B22F3/1055 ,  B22F7/06 ,  B23K20/103 ,  B32B15/043 ,  B32B15/14 ,  B32B15/18 ,  B32B2603/00 ,  B32B2605/18 ,  B33Y10/00 ,  B33Y80/00 ,  B64D45/00 ,  B64D2045/0085 ,  F01D5/147 ,  F01D17/04 ,  F01D17/08 ,  F05D2220/32 ,  G01D11/30 ,  G01K1/14 ,  G01K7/02 ,  G01K2205/00 ,  G01L19/083 ,  G01L19/16 ,  G01M15/14 ,  Y02P10/295 ,  Y02T50/672

Abstract: One exemplary embodiment of this disclosure relates to an article having a multi-layer wall structure having an embedded sensor. Further, the multi-layer wall structure and the sensor are bonded together.

Abstract translation: 本公开的一个示例性实施例涉及具有嵌入式传感器的多层壁结构的制品。 此外，多层壁结构和传感器结合在一起。

公开(公告)号：US20190099940A1

公开(公告)日：2019-04-04

申请号：US15722829

申请日：2017-10-02

Applicant: United Technologies Corporation

Inventor： Sameh Dardona ,  Paul Sheedy ,  Wayde R. Schmidt ,  Dustin D. Caldwell ,  Slade R. Culp

IPC: B29C64/129 ,  B33Y10/00 ,  B33Y70/00 ,  B33Y80/00

CPC classification number: B29C64/129 ,  B29C64/106 ,  B29K2105/16 ,  B29K2505/00 ,  B29K2995/0008 ,  B33Y10/00 ,  B33Y70/00 ,  B33Y80/00 ,  H01F1/0027 ,  H01F1/44 ,  H01F41/0253 ,  H01F41/16

Abstract: A system for direct writing a conformal or free-form magnet includes producing a magnetic ink compound by mixing an photopolymer base and a magnetic material powder, extruding a layer of the magnetic ink compound through a nozzle on to a target substrate to form a layer, soft-curing the layer by exposing the layer to a first light, repeatedly extruding a layer and soft-curing the layer, then post-curing the magnet by exposing the magnet to a second light and an elevated temperature.

公开(公告)号：US20180317322A1

公开(公告)日：2018-11-01

申请号：US16027466

申请日：2018-07-05

Applicant: United Technologies Corporation

Inventor： Wayde R. Schmidt ,  Sameh Dardona ,  Slade R. Culp ,  Marcin Piech

IPC: H05K1/16 ,  H05K3/20

Abstract: An apparatus system and method for an electronic component made with additive manufacturing processes and a foil substrate is provided. The electronic component may include one or more foil substrates and one or more elements. The elements may be produced by an additive manufacturing process. Moreover, the elements may be produced in the same plane or out of plain with one or more foil substrates. The elements may also be various structures, including, for example, connectors, electrical components (e.g., a resistor, a capacitor, a switch, and/or the like), and/or any other suitable electrical elements and/or structures.

公开(公告)号：US20160135279A1

公开(公告)日：2016-05-12

申请号：US14935512

申请日：2015-11-09

Applicant: United Technologies Corporation

Inventor： Paul Sheedy ,  Sameh Dardona ,  Michael G. McCaffrey ,  Wayde R. Schmidt ,  Slade R. Culp

IPC: H05K1/02 ,  H05K1/18 ,  G01M15/14 ,  H05K1/03

CPC classification number: H05K1/0201 ,  F01D5/284 ,  F01D17/02 ,  F01D25/005 ,  F05D2300/211 ,  F05D2300/222 ,  G01M15/14 ,  H05K1/0306 ,  H05K1/18 ,  H05K2201/068

Abstract: An instrumented article includes a ceramic-based substrate and at least one conformal electronic device deposited on a surface of the ceramic-based substrate. A compliant layer is located between the ceramic-based substrate and the one or more conformal electronic devices. The compliant layer has a thermal expansion that is intermediate of the thermal expansions of, respectively, the ceramic-based substrate and the one or more conformal electronic devices.

Abstract translation: 仪器化制品包括沉积在陶瓷基底表面上的基于陶瓷的衬底和至少一个保形电子器件。 柔性层位于陶瓷基底和一个或多个适形电子器件之间。 柔性层具有分别为基于陶瓷的衬底和一个或多个保形电子器件的热膨胀中间的热膨胀。

公开(公告)号：US20160014900A1

公开(公告)日：2016-01-14

申请号：US14743820

申请日：2015-06-18

Applicant: United Technologies Corporation

Inventor： Wayde R. Schmidt ,  Sameh Dardona ,  Slade R. Culp ,  Marcin Piech

IPC: H05K1/16 ,  H05K3/46 ,  H05K3/40 ,  H05K1/09

CPC classification number: H05K1/16 ,  H05K3/202 ,  H05K2201/0355

Abstract: An apparatus system and method for an electronic component made with additive manufacturing processes and a foil substrate is provided. The electronic component may include one or more foil substrates and one or more elements. The elements may be produced by an additive manufacturing process. Moreover, the elements may be produced in the same plane or out of plain with one or more foil substrates. The elements may also be various structures, including, for example, connectors, electrical components (e.g., a resistor, a capacitor, a switch, and/or the like), and/or any other suitable electrical elements and/or structures.

Abstract translation: 提供了一种用添加剂制造方法制造的电子部件和箔基片的装置系统和方法。 电子部件可以包括一个或多个箔基板和一个或多个元件。 这些元件可以通过添加剂制造方法制造。 此外，元件可以在一个或多个箔基板上在相同的平面内或与平面之间制造。 元件还可以是各种结构，包括例如连接器，电气部件（例如，电阻器，电容器，开关等）和/或任何其它合适的电气元件和/或结构。