Production method of thin film passive element formed on printed circuit board and thin film passive element produced by the method
    1.
    发明申请
    Production method of thin film passive element formed on printed circuit board and thin film passive element produced by the method 审中-公开
    通过该方法制造的印刷电路板上形成的薄膜无源元件和薄膜无源元件的制造方法

    公开(公告)号:US20020171530A1

    公开(公告)日:2002-11-21

    申请号:US10113621

    申请日:2002-03-28

    Abstract: The present invention provides a thin film capacitance element having minimal deviation of capacitance value in a high accuracy formed on a printed circuit board (core material). The thin film capacitance element formed on a printed circuit board is composed of a lower electrode layer formed on the printed circuit board through an insulation layer, a dielectric layer formed on the lower electrode layer, an upper electrode layer formed on the dielectric layer and an electric pad for leading out the lower electrode layer, wherein the lower electrode layer is longer than the upper electrode layer in the horizontal direction and connected to the electric pad for leading out the lower electrode layer outside, and wherein the top surface of the upper electrode layer and the top surface of the electric pad for leading out the lower electrode layer are formed substantially in the same height.

    Abstract translation: 本发明提供一种在印刷电路板(芯材)上形成的高精度的电容值偏差最小的薄膜电容元件。 形成在印刷电路板上的薄膜电容元件由通过绝缘层形成在印刷电路板上的下电极层,形成在下电极层上的电介质层,形成在电介质层上的上电极层和 用于引出下电极层的电焊盘,其中下电极层在水平方向上比上电极层长,并且连接到用于将下电极层引出外部的电焊盘,并且其中上电极的顶表面 并且用于引出下电极层的电焊盘的顶表面基本上形成为相同的高度。

Patent Agency Ranking