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公开(公告)号：US11315964B2
公开(公告)日：2022-04-26
申请号：US16265084
申请日：2019-02-01
发明人： Hsin-Hui Lee , Han-Liang Tseng , Jiunn-Liang Yu , Kwang-Ming Lin , Yin Chen , Si-Twan Chen , Hsueh-Jung Lin , Wen-Chih Lu , Ting-Jung Lu
IPC分类号： H01L27/144 , H01L31/18 , H01L31/0232 , H01L31/0216
摘要： An optical sensor includes pixels disposed in a substrate. A light collimating layer is disposed on the substrate and includes a transparent layer, a light-shielding layer, and transparent pillars. The transparent layer blanketly disposed on the substrate covers the pixels and the region between the pixels. The light-shielding layer is disposed on the transparent layer and between the transparent pillars. The transparent pillars penetrating through the light-shielding layer are correspondingly disposed on the pixels.
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公开(公告)号：US11177397B2
公开(公告)日：2021-11-16
申请号：US16738151
申请日：2020-01-09
发明人： Hsin-Hui Lee , Han-Liang Tseng , Jiunn-Liang Yu , Kwang-Ming Lin , Yin Chen , Si-Twan Chen , Hsueh-Jung Lin , Wen-Chih Lu , Chih-Hsien Chen
IPC分类号： H01L31/0216 , H01L31/18 , H01L31/02 , G06K9/00
摘要： A method for forming semiconductor devices includes providing a substrate with a conductive pad formed thereon; forming a transparent structure over the substrate, wherein the transparent structure includes a plurality of collimating pillars adjacent to the conductive pad; forming a light-shielding structure over the plurality of collimating pillars and the conductive pad; performing a cutting process to remove one or more materials directly above the conductive pad, while leaving remaining material to cover the conductive pad, wherein the material includes a portion of the light-shielding structure; and performing an etching process to remove the remaining material to expose the conductive pad.
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公开(公告)号：US10770602B1
公开(公告)日：2020-09-08
申请号：US16280281
申请日：2019-02-20
发明人： Hsin-Hui Lee , Han-Liang Tseng , Jiunn-Liang Yu , Kwang-Ming Lin , Yin Chen , Si-Twan Chen , Hsueh-Jung Lin , Wen-Chih Lu , Ting-Jung Lu
IPC分类号： H01L31/0232 , H01L31/0216 , H01L27/144
摘要： An optical sensor includes pixels disposed in a substrate and a light collimating layer disposed on the substrate. The light collimating layer includes a first light-shielding layer, first transparent pillars, a second light-shielding layer, and second transparent pillars. The first light-shielding layer is disposed on the substrate. The first transparent pillars through the first light-shielding layer are correspondingly disposed on the pixels. The second light-shielding layer is disposed on the first light-shielding layer and the first transparent pillars. The second transparent pillars through the second light-shielding layer are correspondingly disposed on the first transparent pillars. The top surface area of each of the first transparent pillars is not equal to the bottom surface area of each of the second transparent pillars.
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公开(公告)号：US11989966B2
公开(公告)日：2024-05-21
申请号：US17497362
申请日：2021-10-08
发明人： Hsin-Hui Lee , Han-Liang Tseng , Jiunn-Liang Yu , Kwang-Ming Lin , Yin Chen , Si-Twan Chen , Hsueh-Jung Lin , Wen-Chih Lu , Chih-Hsien Chen
IPC分类号： G06V40/13 , H01L31/02 , H01L31/0216 , H01L31/18
CPC分类号： G06V40/13 , H01L31/02016 , H01L31/02164 , H01L31/18
摘要： A method for forming semiconductor devices includes providing a substrate with a conductive pad formed thereon; forming a transparent structure over the substrate, wherein the transparent structure includes a plurality of collimating pillars adjacent to the conductive pad; forming a light-shielding structure over the plurality of collimating pillars and the conductive pad; performing a cutting process to remove one or more materials directly above the conductive pad, while leaving remaining material to cover the conductive pad, wherein the material includes a portion of the light-shielding structure; and performing an etching process to remove the remaining material to expose the conductive pad.
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公开(公告)号：US10935805B2
公开(公告)日：2021-03-02
申请号：US16264005
申请日：2019-01-31
发明人： Hsin-Hui Lee , Han-Liang Tseng , Jiunn-Liang Yu , Kwang-Ming Lin , Yin Chen , Si-Twan Chen , Hsueh-Jung Lin , Wen-Chih Lu , Ting-Jung Lu
摘要： An optical sensor includes a plurality of pixels disposed in a substrate and a light collimating layer. The light collimating layer is disposed on the substrate. The light collimating layer includes a light-shielding layer, a plurality of transparent pillars, and a plurality of first dummy transparent pillars. The light-shielding layer is disposed on the substrate. The plurality of transparent pillars pass through the light-shielding layer and are disposed correspondingly on the plurality of pixels. The plurality of first dummy transparent pillars that pass through the light-shielding layer are disposed on a first peripheral region of the light collimating layer, wherein the plurality of first dummy transparent pillars surround the plurality of transparent pillars from a top view.
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公开(公告)号：US10763288B1
公开(公告)日：2020-09-01
申请号：US16277585
申请日：2019-02-15
发明人： Hsin-Hui Lee , Han-Liang Tseng , Jiunn-Liang Yu , Kwang-Ming Lin , Yin Chen , Si-Twan Chen , Hsueh-Jung Lin , Wen-Chih Lu , Ting-Jung Lu
IPC分类号： H01L33/00 , H01L21/00 , H01L27/146 , H01L27/32 , H01L31/0216 , H01L29/786
摘要： A semiconductor device is provided. The semiconductor device includes a substrate. The substrate includes a plurality of pixels. The semiconductor device also includes a light collimator layer disposed on the substrate. The light collimator layer includes a transparent connection feature disposed on the substrate, and a plurality of transparent pillars disposed on the transparent connection feature. The plurality of transparent pillars cover the plurality of pixels, and the transparent connection feature connects to the plurality of transparent pillars. The plurality of transparent pillars and the transparent connection feature are made of a first material which includes a transparent material. The light collimator layer also includes a plurality of first light-shielding features disposed on the transparent connection feature. The top surface of one of the transparent pillars is level with the top surface of one of the first light-shielding features.
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公开(公告)号：US10572070B2
公开(公告)日：2020-02-25
申请号：US16016869
申请日：2018-06-25
发明人： Chih-Cherng Liao , Shih-Hao Liu , Wu-Hsi Lu , Ming-Cheng Lo , Chung-Ren Lao , Yun-Chou Wei , Yin Chen , Hsin-Hui Lee , Hsueh-Jung Lin , Wen-Chih Lu , Ting-Jung Lu
摘要： An optical device is provided. The optical device includes a substrate including a plurality of pixel units, a dielectric layer disposed on the substrate, a patterned light-transmitting layer disposed on the dielectric layer and corresponding to the plurality of pixel units, and a plurality of continuous light-shielding layers disposed on the dielectric layer and located on both sides of the patterned light-transmitting layer. A method for fabricating an optical device is also provided.
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