公开(公告)号：US20160155653A1

公开(公告)日：2016-06-02

申请号：US14622271

申请日：2015-02-13

Applicant: Varian Semiconductor Equipment Associates, Inc.

Inventor： Bradley M. Pomerleau ,  Eric D. Wilson

IPC: H01L21/673 ,  G05D7/06

CPC classification number: G05D7/0635 ,  H01L21/67201

Abstract: A system and method for reducing particulate contamination during the loading and unloading of semiconductor substrates into a load lock chamber of a semiconductor processing tool. One sensor that measures the differential pressure between the inside of the load lock and the outside atmosphere is provided. The method uses an algorithm that predicts when to stop the load lock vent so that a small, positive, repeatable pressure burst is delivered each time the door opens. This algorithm will automatically adjust for changes in the vent rate and response times of system vent components.

Abstract translation: 一种用于在半导体衬底装载和卸载半导体加工工具的装载锁定室期间减少颗粒污染的系统和方法。 提供了一种测量负载锁的内部和外部气氛之间的压差的传感器。 该方法使用一种算法来预测何时停止加载锁定通风口，以便每次门打开时都会传送一个小的，积极的，可重复的压力脉冲串。 该算法将自动调整排气速率和系统排气部件响应时间的变化。

公开(公告)号：US20200027698A1

公开(公告)日：2020-01-23

申请号：US16588148

申请日：2019-09-30

Applicant: Varian Semiconductor Equipment Associates, Inc.

Inventor： Eric D. Wilson ,  George M. Gammel ,  Sruthi Chennadi ,  Daniel Tieger ,  Shane Conley

IPC: H01J37/317 ,  H01J37/244

Abstract: An apparatus for monitoring of an ion beam. The apparatus may include a processor; and a memory unit coupled to the processor, including a display routine, where the display routine operative on the processor to manage monitoring of the ion beam. The display routine may include a measurement processor to receive a plurality of spot beam profiles of the ion beam, the spot beam profiles collected during a fast scan of the ion beam and a slow mechanical scan of a detector, conducted simultaneously with the fast scan. The fast scan may comprise a plurality of scan cycles having a frequency of 10 Hz or greater along a fast scan direction, and the slow mechanical scan being performed in a direction parallel to the fast scan direction. The measurement processor may also send a display signal to display at least one set of information, derived from the plurality of spot beam profiles.

公开(公告)号：US10431421B2

公开(公告)日：2019-10-01

申请号：US15803344

申请日：2017-11-03

Applicant: Varian Semiconductor Equipment Associates, Inc.

Inventor： Eric D. Wilson ,  George M. Gammel ,  Sruthi Chennadi ,  Daniel Tieger ,  Shane Conley

IPC: H01J37/317 ,  H01J37/244

Abstract: An apparatus for monitoring of an ion beam. The apparatus may include a processor; and a memory unit coupled to the processor, including a display routine, where the display routine operative on the processor to manage monitoring of the ion beam. The display routine may include a measurement processor to receive a plurality of spot beam profiles of the ion beam, the spot beam profiles collected during a fast scan of the ion beam and a slow mechanical scan of a detector, conducted simultaneously with the fast scan. The fast scan may comprise a plurality of scan cycles having a frequency of 10 Hz or greater along a fast scan direction, and the slow mechanical scan being performed in a direction parallel to the fast scan direction. The measurement processor may also send a display signal to display at least one set of information, derived from the plurality of spot beam profiles.

公开(公告)号：US10825645B2

公开(公告)日：2020-11-03

申请号：US16057260

申请日：2018-08-07

Applicant: Varian Semiconductor Equipment Associates, Inc.

Inventor： Eric D. Wilson ,  David E. Suuronen ,  Michael W. Osborne ,  Julian G. Blake

IPC: H01J37/20 ,  H01J37/317 ,  H01L21/683 ,  G01R29/12 ,  H01L21/67 ,  G01R31/28 ,  G01R29/24

Abstract: A system and method for reduced workpiece adhesion during removal from a semiconductor processing station. The system provides an electrostatic charge detector that measures the residual charge on an electrostatically clamped workpiece prior to removal from a processing station inside the semiconductor processing tool. One embodiment uses an algorithm that to predict when to remove the workpiece without electrostatic adhesion based upon the decay rate of the residual electrostatic charge (Q) on the workpiece. Other embodiments also provide for a processing station static charge buildup health check and an excessive static charge check on incoming workpieces.

公开(公告)号：US20190057835A1

公开(公告)日：2019-02-21

申请号：US16057260

申请日：2018-08-07

Applicant: Varian Semiconductor Equipment Associates, Inc.

Inventor： Eric D. Wilson ,  David E. Suuronen ,  Michael W. Osborne ,  Julian G. Blake

IPC: H01J37/20 ,  H01J37/317 ,  H01L21/683 ,  G01R29/12

Abstract: A system and method for reduced workpiece adhesion during removal from a semiconductor processing station. The system provides an electrostatic charge detector that measures the residual charge on an electrostatically clamped workpiece prior to removal from a processing station inside the semiconductor processing tool. One embodiment uses an algorithm that to predict when to remove the workpiece without electrostatic adhesion based upon the decay rate of the residual electrostatic charge (Q) on the workpiece. Other embodiments also provide for a processing station static charge buildup health check and an excessive static charge check on incoming workpieces.

公开(公告)号：US09817407B2

公开(公告)日：2017-11-14

申请号：US14622271

申请日：2015-02-13

Applicant: Varian Semiconductor Equipment Associates, Inc.

Inventor： Bradley M. Pomerleau ,  Eric D. Wilson

IPC: H01L21/673 ,  G05D7/06 ,  H01L21/67

CPC classification number: G05D7/0635 ,  H01L21/67201

Abstract: A system and method for reducing particulate contamination during the loading and unloading of semiconductor substrates into a load lock chamber of a semiconductor processing tool. One sensor that measures the differential pressure between the inside of the load lock and the outside atmosphere is provided. The method uses an algorithm that predicts when to stop the load lock vent so that a small, positive, repeatable pressure burst is delivered each time the door opens. This algorithm will automatically adjust for changes in the vent rate and response times of system vent components.

公开(公告)号：US20190139740A1

公开(公告)日：2019-05-09

申请号：US15803344

申请日：2017-11-03

Applicant: Varian Semiconductor Equipment Associates, Inc.

Inventor： Eric D. Wilson ,  George M. Gammel ,  Sruthi Chennadi ,  Daniel Tieger ,  Shane Conley

IPC: H01J37/317 ,  H01J37/244

CPC classification number: H01J37/3171 ,  H01J37/244 ,  H01J2237/24405 ,  H01J2237/24535 ,  H01J2237/24542 ,  H01J2237/30477 ,  H01J2237/31703

Abstract: An apparatus for monitoring of an ion beam. The apparatus may include a processor; and a memory unit coupled to the processor, including a display routine, where the display routine operative on the processor to manage monitoring of the ion beam. The display routine may include a measurement processor to receive a plurality of spot beam profiles of the ion beam, the spot beam profiles collected during a fast scan of the ion beam and a slow mechanical scan of a detector, conducted simultaneously with the fast scan. The fast scan may comprise a plurality of scan cycles having a frequency of 10 Hz or greater along a fast scan direction, and the slow mechanical scan being performed in a direction parallel to the fast scan direction. The measurement processor may also send a display signal to display at least one set of information, derived from the plurality of spot beam profiles.