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公开(公告)号：US4440608A
公开(公告)日：1984-04-03
申请号：US408238
申请日：1982-08-16
摘要： A process is provided for the electrodeposition of alloys of tin and lead by passing electrical current through an anode, an aqueous acidic plating solution and a cathode, wherein the aqueous acidic plating bath includes at least one organic compound having a formula ##STR1## wherein X=O, S, or NH and R.sub.2 and R.sub.3 are H, or lower alkyl and R.sub.1 is ##STR2## .
摘要翻译： 提供了一种通过使电流通过阳极，酸性电镀液和阴极电解电沉积锡和铅的方法，其中酸性电镀液包含至少一种具有下式的有机化合物，其中X = O，S或NH，并且R 2和R 3是H或低级烷基，并且R 1是
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公开(公告)号：US4334966A
公开(公告)日：1982-06-15
申请号：US265143
申请日：1981-05-19
申请人： Sidney C. Beach , C. Richard Frisby
发明人： Sidney C. Beach , C. Richard Frisby
CPC分类号： C25D3/38
摘要： A method is provided for depositing on a gravure roll a layer of copper especially adapted to receive electronic engraving comprising the steps of placing a gravure roll in an electroplating bath comprising from about 150 to about 225 grams/liter of copper sulfate from about 35 to about 90 grams/liter of sulfuric acid, from about 1 to about 15 grams/liter of a polyether having a molecular weight from about 4,000 to about 10,000, from about 0.3 to about 3.0 milligrams/liter of 1-lower alkyl-2-mercapto imidazole, and from about 1 to about 100 milligrams/liter of a sulfonated, sulfurized benzene compound; and passing electrical current through the bath to deposit copper on said roll.
摘要翻译： 提供了一种用于在凹版辊上沉积尤其适于接收电子雕刻的铜层的方法，其特征在于包括以下步骤：将凹版辊放置在包含约150至约225克/升硫酸铜的电镀浴中，所述硫酸铜约35至约 90克/升硫酸，约1至约15克/升分子量为约4,000至约10,000，约0.3至约3.0毫克/升的1-低级烷基-2-巯基咪唑的聚醚 ，和约1至约100毫克/升的磺化硫化苯化合物; 并且使电流通过浴以在所述辊上沉积铜。
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公开(公告)号：US4673469A
公开(公告)日：1987-06-16
申请号：US755961
申请日：1985-07-17
申请人： Sidney C. Beach , Jack D. Fellman
发明人： Sidney C. Beach , Jack D. Fellman
摘要： A method is provided for electrodepositing a layer of copper on a plastic substrate which method comprises: positioning the plastic substrate on a supporting member, with the supporting member being in contact at a plurality of spaced apart points with the substrate for the passage of electrical current therebetween; electrolessly depositing a thin layer of metal selected from the group consisting of copper, nickel, cobalt and mixtures thereof on a surface of the plastic substrate; positioning the supported substrate in an electroplating bath including from about 10.0 to about 45.0 g/l of copper ions, at least one acid selected from the group consisting of sulfuric acid, fluoroboric acid and sulfamic acid, with the acid being present in an amount sufficient to cause the electroplating bath to have a conductivity ranging from about 0.40 to about 0.60 mhos and from about 30 to about 150 mg/l of chloride ions; and passing electrical current through the bath so as to cause a layer of copper to be electrolytically deposited over the layer of electrolessly deposited metal.
摘要翻译： 提供了一种用于在塑料基板上电沉积铜层的方法，该方法包括：将塑料基板定位在支撑构件上，其中支撑构件与多个间隔开的点与衬底接触以使电流通过 之间; 在塑料基板的表面上无电沉积选自铜，镍，钴及其混合物的薄金属薄层; 将负载的基板定位在包括约10.0至约45.0g / l的铜离子的电镀浴中，至少一种选自硫酸，氟硼酸和氨基磺酸的酸，其酸的量以足够的量存在 使电镀浴具有约0.40至约0.60mhos和约30至约150mg / l氯离子的电导率; 并使电流通过浴，以使铜层电解沉积在无电沉积金属层上。
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公开(公告)号：US4559269A
公开(公告)日：1985-12-17
申请号：US600117
申请日：1984-04-13
申请人： Sidney C. Beach , Gary W. Loar
发明人： Sidney C. Beach , Gary W. Loar
CPC分类号： C09C1/0084 , C08K9/12 , C09B63/00 , C01P2004/50 , C01P2004/60 , C01P2004/80 , C01P2006/10 , C01P2006/60 , Y10S428/92 , Y10S428/921 , Y10T428/2991 , Y10T428/2993
摘要： A composite particle is provided which comprises a matrix of puffed borax having a porous surface, with the matrix having retained on the porous surface thereof a plurality of individual grains of metal oxide. A method of producing such a composite particle is also provided.
摘要翻译： 提供了一种复合颗粒，其包括具有多孔表面的膨化硼砂的基质，其中所述基质在多孔表面上保留有多个单独的金属氧化物颗粒。 也提供了这种复合粒子的制造方法。
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