Abstract:
A SYSTEM FOR FABRICATION OF PATTERNS IS SUBSTRATES SUCH AS INTERGRATED CIRCUITS ON SILICON WAFERS, EMPLOYS A SCANNING ELECTRON MICROSCOPE TO PRODUCE A PHOTOCATHODE HAVING THE DESIRED SURFACE PATTERN THEREIN AND THE PHOTCATHODE IS THEN EMPLOYED TO PRODUCE REPLICATE PATTERNS ON A PLURALITY OF SUBSTRATES. THE PHOTOCATHODE PRODUCES A PATTERNED ELECTRON BEAM WHICH IMPINGES ON AN ELECTRON RESIST ON A SUBSTRATE TO PROVIDE FOR DIFFERENTIAL SOLUBILITY BETWEEN THE ELECTRON BEAM TTREATED ZND UNTREATED RESIST AREAS. REMOVING THE MORE SOLUBLE PORTION OF THE ELECTRON RESIST AFTER TREATMENT BY THE PHOTOCATHODE, EXPOSES THE SUBSTRATE SURFACE WHICH IS THEN ALTERED EITHER PHYSICALLY OR CHEMICALLY. ONE OR MORE HIGHLY PRECISE PATTERNS BOTH IN THEIR LOCATION AND CONFIGURATION, MAY BE PRODUCED ON THE SURFACE OF A SUBSTRATE BY APPLYING A SERIES OF SUCCESSIVE ELECTRON RESISTS TO THE SUBSTRATE AND USING A PLURALITY OF PHOTOCATHODES.